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CN-224234200-U - Power module and power device

CN224234200UCN 224234200 UCN224234200 UCN 224234200UCN-224234200-U

Abstract

The application provides a power module and a power device. The power module comprises an insulating substrate, an upper bridge chip set, a lower bridge chip set, a first metal block, a second metal block and a plastic package shell. The upper bridge chip set comprises a plurality of upper bridge chips and the upper bridge chips are connected in parallel through first metal blocks, the lower bridge chip set comprises a plurality of lower bridge chips and the lower bridge chips are connected in parallel through second metal blocks, the insulating substrate, the upper bridge chip set and the lower bridge chip set are covered by a plastic package shell, and at least one part of the first metal blocks and at least one part of the second metal blocks are exposed out of the plastic package shell and are used as two power interfaces respectively. The application can reduce parasitic noise of the module and improve current sharing among a plurality of parallel chips.

Inventors

  • ZHANG XUELUN

Assignees

  • 浙江晶能微电子有限公司
  • 浙江吉利控股集团有限公司
  • 吉利科技集团有限公司

Dates

Publication Date
20260512
Application Date
20250513

Claims (10)

  1. 1. A power module is characterized by comprising an insulating substrate, an upper bridge chip set, a lower bridge chip set, a first metal block, a second metal block and a plastic package shell, wherein, The upper bridge chip set and the lower bridge chip set are arranged on the insulating substrate, wherein the upper bridge chip set comprises a plurality of upper bridge chips, and the upper bridge chips are connected in parallel through the first metal blocks; The plastic package shell wraps the insulating substrate, the upper bridge chip set and the lower bridge chip set, and at least one part of the first metal block and the second metal block are exposed out of the plastic package shell and are respectively used as two power interfaces.
  2. 2. The power module of claim 1, wherein the insulating substrate has a conductive layer thereon, the conductive layer including first and second conductive regions spaced apart from each other, the first metal block including a body block and a connection block integrally extending from the body block, wherein, The upper bridge chips are symmetrically arranged in the first conductive area, the drains of the upper bridge chips are electrically connected to the first conductive area, the sources of the upper bridge chips are electrically connected with the main body block of the first metal block, and the connecting blocks of the first metal block are electrically connected with the second conductive area; The lower bridge chips are symmetrically arranged in the second conductive area, the drains of the lower bridge chips are electrically connected to the second conductive area, and the sources of the lower bridge chips are electrically connected with the second metal block.
  3. 3. The power module of claim 2, further comprising a third metal block, wherein, The third metal block is electrically connected to the first conductive region, and at least one part of the third metal block protrudes out of the upper surface of the plastic package shell and is used as another power interface.
  4. 4. The power module of claim 3, wherein the third metal block comprises two, wherein the two third metal blocks are disposed between the upper bridge chipset and the lower bridge chipset, and wherein the two third metal blocks are respectively located at opposite sides of the connection block of the first metal block.
  5. 5. The power module of claim 2, wherein the insulating substrate has opposite first and second ends, the conductive layer further comprising third and fourth conductive regions at the first and second ends of the insulating substrate, respectively, the power module further comprising a plurality of first and second conductive lines, wherein, The grid electrodes of the upper bridge chips are electrically connected to the third conductive areas through the first conductive wires; The grid electrodes of the lower bridge chips are electrically connected to the fourth conductive areas through the second conductive wires.
  6. 6. The power module of claim 5, wherein the power module further comprises a third conductive line and a fourth conductive line, the conductive layer further comprises a fifth conductive region and a sixth conductive region, wherein, The fifth conductive region is located between the first conductive region and the third conductive region, and is electrically connected with the source electrode of one of the adjacent upper bridge chips through the third conductive wire; The sixth conductive region is located between the second conductive region and the fourth conductive region, and is electrically connected with the source electrode of one of the adjacent lower bridge chips through the fourth conductive wire.
  7. 7. The power module of claim 6, further comprising a plurality of signal terminals, at least a portion of each of the signal terminals exposed outside the plastic package, the plurality of signal terminals including an upper bridge gate terminal, an upper bridge source terminal, an upper bridge drain terminal, a lower bridge gate terminal, and a lower bridge source terminal, wherein, The upper bridge gate terminal and the lower bridge gate terminal are electrically connected to the third conductive region and the fourth conductive region, respectively; The upper bridge source terminal and the lower bridge source terminal are respectively and electrically connected to the fifth conductive region and the sixth conductive region; the upper bridge drain terminal is electrically connected to the first conductive region.
  8. 8. The power module as set forth in any one of claims 1 to 7, wherein an upper surface of the first metal block has a first protruding bump protruding therefrom and an upper surface of the second metal block has a second protruding bump protruding therefrom, wherein both the first protruding bump and the second protruding bump protrude from an upper surface of the plastic package case.
  9. 9. The power module as claimed in any one of claims 1 to 7, wherein the upper surface of the plastic package case has a first slot and a second slot, wherein, The notches of the first slot and the second slot penetrate through the first end and the second end of the insulating substrate which are opposite, The first slot exposes at least a part of the surface of the first metal block outside the plastic package shell; the second slot exposes at least a portion of a surface of the second metal block outside the plastic package housing.
  10. 10. A power device is characterized by comprising three power modules, a heat dissipation substrate and a power terminal, wherein the power terminal comprises a direct current positive terminal, a direct current negative terminal and an alternating current terminal, and the power module is characterized in that, The three power modules are connected to the heat dissipation substrate; the direct current positive terminal is electrically connected with the third metal block exposed by the power module; The direct current negative terminal is electrically connected with the second metal block exposed by the power module; the alternating current terminal is electrically connected with the first metal block exposed by the power module, The insulating substrate has opposite first and second ends, the ac terminal extends from the first end of the insulating substrate, the dc positive terminal and the dc negative terminal each extend from the second end of the insulating substrate, and the dc positive terminal and the dc negative terminal have overlapping portions.

Description

Power module and power device Technical Field The present application relates to the field of power electronics, and in particular, to a power module and a power device. Background In an electric drive assembly of a vehicle, for converting direct current provided by a storage battery into alternating current supplied by a drive motor, a power module is arranged to realize conversion from direct current to alternating current, and three types of power interfaces are arranged, including a direct current positive electrode interface DC+, a direct current negative electrode interface DC-and an alternating current interface AC. The existing power modules, such as half-bridge plastic package power modules, generally adopt a copper lead frame as a power interface, so that parasitic noise of a power loop from a DC positive electrode interface DC+ to a DC negative electrode interface DC-is larger. In addition, because the active area of the existing SiC (silicon carbide) chip is limited, a single SiC chip cannot bear too much current, so that a plurality of SiC chips need to be connected in parallel to meet higher current requirements, and particularly in a new energy main drive inverter, high-power application requirements are realized through multi-chip parallel connection. In the current packaging scheme, a plurality of chips are connected in parallel usually through schemes such as bonding wires, copper clips (copper strips), copper or aluminum strips and the like, but the chips connected in parallel through the connecting schemes have different miscellaneous feeling, so that current is not shared, the current is not shared by the chips, a single chip can be damaged due to overlarge loss and stress for a long time, and further other parallel devices and the whole system are damaged. Disclosure of utility model The embodiment of the application aims to provide a power module and a power device, which can reduce parasitic noise of the module and improve current sharing among a plurality of parallel chips. One aspect of the application provides a power module. The power module comprises an insulating substrate, an upper bridge chip set, a lower bridge chip set, a first metal block, a second metal block and a plastic package shell. The upper bridge chip set and the lower bridge chip set are arranged on the insulating substrate, the upper bridge chip set comprises a plurality of upper bridge chips, the upper bridge chips are connected in parallel through the first metal blocks, the lower bridge chip set comprises a plurality of lower bridge chips, the lower bridge chips are connected in parallel through the second metal blocks, the insulating substrate, the upper bridge chip set and the lower bridge chip set are covered by the plastic package shell, and at least one part of each of the first metal blocks and the second metal blocks is exposed out of the plastic package shell and used as two power interfaces respectively. Further, a conductive layer is arranged on the insulating substrate, the conductive layer comprises a first conductive area and a second conductive area which are mutually spaced, the first metal block comprises a main body block and a connecting block which integrally extends from the main body block, a plurality of upper bridge chips are symmetrically arranged in the first conductive area, the drains of the upper bridge chips are electrically connected to the first conductive area, the sources of the upper bridge chips are electrically connected with the main body block of the first metal block, the connecting block of the first metal block is electrically connected with the second conductive area, a plurality of lower bridge chips are symmetrically arranged in the second conductive area, the drains of the lower bridge chips are electrically connected to the second conductive area, and the sources of the lower bridge chips are electrically connected with the second metal block. Further, the power module further comprises a third metal block, wherein the third metal block is electrically connected to the first conductive area, and at least one part of the third metal block protrudes out of the upper surface of the plastic package shell and is used as another power interface. Further, the third metal blocks include two, the two third metal blocks are disposed between the upper bridge chipset and the lower bridge chipset, and the two third metal blocks are located at opposite sides of the connection block of the first metal block, respectively. Further, the insulating substrate is provided with a first end and a second end which are opposite, the conductive layer further comprises a third conductive area and a fourth conductive area, the third conductive area and the fourth conductive area are respectively positioned at the first end and the second end of the insulating substrate, the power module further comprises a plurality of first conductive wires and a plurality of second conductive wires, where