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DE-102018104778-B4 - Component composite made of optical components, method for manufacturing a component composite and component with an optical component

DE102018104778B4DE 102018104778 B4DE102018104778 B4DE 102018104778B4DE-102018104778-B4

Abstract

Method for manufacturing a plurality of transferable optical components (10) on a common intermediate carrier (90), wherein the optical components are configured to shape a light beam and wherein a holding structure (3) with a plurality of holding elements (3A, 3B) forms a mechanical connection between the intermediate carrier and the optical components, comprising the following steps: - Attaching or forming a plurality of optical components on the intermediate support, wherein a sacrificial layer (4) is arranged in the vertical direction at least partially between the intermediate support and the optical components; and - Removal of the sacrificial layer, whereby the optical components are only mechanically connected to the intermediate support via the holding structure, wherein the holding elements release the optical components under mechanical load, so that the optical components are detachable from the intermediate support and thus transferable, wherein - the method for manufacturing a plurality of components is set up, wherein the retaining elements (3A, 3B) release the optical components under mechanical stress, so that the optical components are detached from the intermediate carrier (90) and printed onto a plurality of main bodies (2H), wherein the main bodies each have a semiconductor body (2) with an active zone (23) for generating or detecting electromagnetic radiation.

Inventors

  • Frank Singer
  • Hubert Halbritter

Assignees

  • OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung

Dates

Publication Date
20260513
Application Date
20180302

Claims (17)

  1. Method for producing a plurality of transferable optical components (10) on a common intermediate support (90), wherein the optical components are configured to shape a light beam and wherein a holding structure (3) with a plurality of holding elements (3A, 3B) forms a mechanical connection between the intermediate support and the optical components, comprising the following steps: - Attaching or forming a plurality of optical components on the intermediate support, wherein a sacrificial layer (4) is arranged at least partially in the vertical direction between the intermediate support and the optical components; and - removal of the sacrificial layer, whereby the optical components are only mechanically connected to the intermediate carrier via the retaining structure, wherein the retaining elements release the optical components under mechanical stress, so that the optical components are detachable from the intermediate carrier and thus transferable, wherein - the method for manufacturing a plurality of components is set up, wherein the retaining elements (3A, 3B) release the optical components under mechanical stress, so that the optical components are detached from the intermediate carrier (90) and printed onto a plurality of main bodies (2H), wherein the main bodies each have a semiconductor body (2) with an active zone (23) for generating or detecting electromagnetic radiation.
  2. Component assembly (100) comprising a plurality of optical components (10), a removable sacrificial layer (4), a retaining structure (3), and a common intermediate carrier (90), wherein: - the optical components each have an optical element (10E) for shaping a light beam; - the sacrificial layer is arranged at least partially in the vertical direction between the intermediate carrier and the optical components; - the retaining structure comprises a plurality of retaining elements (3A, 3B), wherein the retaining structure and the sacrificial layer form a mechanical connection between the intermediate carrier and the optical components; and - the optical components are mechanically connected to the intermediate carrier only via the retaining structure when the sacrificial layer is removed, wherein the retaining elements are designed under mechanical load such that they release the optical components, allowing the optical components to be detached from the intermediate carrier and thus transferable; and wherein: - the optical components (10) are free of an optically active layer configured for generating or detecting electromagnetic radiation.
  3. Method or component combination according to Claim 1 or 2 , wherein the optical components (10) each have a base body (10G), the optical element (10E) of the respective component is formed by the geometry of the associated base body.
  4. Method or component assembly according to the preceding claim, wherein the base body (10G) is plano-convex or plano-concave and wherein the components (10) each have a planar rear side (10R) facing the intermediate support (90).
  5. Method or component combination according to Claim 1 or 2 , wherein the optical components (10) each have a base body (10G), wherein the optical element (10E) of the respective component is embedded in the associated base body.
  6. Method or component composite according to Claim 1 or 2 , in which the optical components (10) each have a transparent base body (10G) containing photonic crystals that form the optical element (10E) of the respective component.
  7. Method or component combination according to Claim 1 or 2 , wherein the optical components (10) each have a base body (10G), wherein the optical element (10E) of the respective component is formed by an optical layer arranged on the associated base body.
  8. Method or component composite according to one of the Claims 5 until 7 , wherein the component (10) has a planar rear side (10R) facing the intermediate support (90) and a front side (10F) facing away from the intermediate support which is at least planar.
  9. Method or component assembly according to one of the preceding claims, wherein the retaining elements (3A, 3B) comprise retaining straps (3A) which are located laterally to the optical components (10) and are designed to be breakable or detachable when the optical components are removed under mechanical stress.
  10. Method or component assembly according to one of the preceding claims, wherein the retaining elements (3A, 3B) comprise retaining columns (3B) located below the optical components (10), arranged in a vertical direction exclusively between the intermediate support (90) and the optical components (10), and designed to be breakable or detachable when the optical components are removed under mechanical stress.
  11. Method or component assembly according to one of the preceding claims, wherein the retaining elements (3A, 3B) are designed with regard to their geometry and/or material composition such that they are designed to be breakable when pressing or removing the associated optical component (10).
  12. Method or component assembly according to one of the preceding claims, wherein - the sacrificial layer (4) forms a common boundary layer between the intermediate support (90) and the optical components (10), and - without the sacrificial layer a cavity (4H) is formed between the intermediate support and the optical components or between the optical components, wherein the retaining elements (3A, 3B) are located directly adjacent to the cavity or are arranged in the cavity.
  13. Method for manufacturing one or more components (1) comprising the following steps: - Providing the component assembly (100) according to one of the Claims 2 until 11 ; - Removal of the sacrificial layer (4); - Removal of one or more optical components (10) using a punch or a plurality of punches, wherein the retaining elements (3A, 3B) release the optical components under mechanical stress of the punch or punches, so that the optical components are detached from the intermediate carrier (90); - Printing of the component or the plurality of components (10) onto a main body (2H) of the component or onto a plurality of main bodies (2H) of the components, wherein the main body has a semiconductor body (2) with an active zone (23) configured for generating or detecting electromagnetic radiation; and - Separation of the punch or punches from the optical component or components.
  14. Method according to the preceding claim, wherein the optical component (10) is attached to the associated main body (2H) of the component (1) by means of a bonding layer (5).
  15. Procedure according to Claim 13 , in which the optical component (10) and the associated main body (2H) each have a planar surface and are mechanically connected to each other at the planar surfaces by means of a direct bonding process.
  16. Component (1) comprising a main body (2H) and an optical component (10), wherein: - the main body comprises a semiconductor body (2) with an active zone (23) configured for generating or detecting electromagnetic radiation; - the optical component comprises an optical element (10E) for shaping a light beam; and - the optical component is printed on the main body and contains mechanical traces of detached or broken retaining elements (3A, 3B); and - the optical component (10) and the main body (2H) each have a planar surface, the planar surfaces being directly adjacent to each other and forming a mechanical connection between the optical component and the main body based on van der Waals interactions.
  17. Component according to Claim 16 , wherein the main body (2H) is a surface-emitting laser diode and the optical component (10) is configured to shape a light beam generated during operation of the laser diode.

Description

A component assembly consisting of a plurality of optical components is described, wherein the optical components are particularly transferable and thus preferably printable. Furthermore, a method for manufacturing a component assembly, a method for manufacturing a component or a plurality of components, and a component with an optical component are described. Optical components, such as optical structures, are often fabricated on a substrate and individually mounted onto electronic components, such as semiconductor chips. Attaching and fixing a large number of optical components to these components is time-consuming and expensive. The printed matter US 2013/0 285 086 A1 describes a method for manufacturing a micro-LED device with a self-aligning metallization stack. The printed matter DE 10 2015 103 571 A1 describes a method for manufacturing a large number of conversion elements, a conversion element and an optoelectronic component. The printed matter US 2015/0 371 874 A1 describes systems and methods for controlling the release of transferable semiconductor structures. The printed matter US 2018/0 006 186 A1 describes printable inorganic semiconductor structures. The printed matter DE 10 2009 055 088 A1 describes a method for producing a structure, an optical component, and an optical layer stack. The printed matter US 2017/0 133 818 A1 describes a laser array display. The printed matter US 2005/0 174 767 A1 describes a lens molded onto a ladder frame and a method for molding a lens onto a ladder frame. One task is to specify optical components that can be mounted quickly, reliably, and easily onto electronic components. Further tasks include specifying reliable and cost-effective methods for manufacturing a component assembly or a plurality of components incorporating such optical components. These tasks are solved by the component assembly, the method, and the component according to the independent claims, as well as in connection with such a method or component assembly. Further embodiments and developments of the method, the component assembly, or the component are the subject of the further claims. According to at least one embodiment of the method for manufacturing a component assembly, a plurality of optical components are formed on an intermediate carrier. The intermediate carrier can be made of a transparent material, such as glass, or of a semiconductor material, for example, silicon. In particular, the method is directed toward the production of a plurality of transferable and, especially, printable optical components on a common intermediate carrier, wherein the optical components are preferably designed to be detachable from the intermediate carrier. For example, the optical components can be printed individually one after the other or simultaneously in groups onto target mounting surfaces, such as onto a component or onto several components, using one or more dies. The optical component described here is specifically designed for shaping a light beam. In particular, the optical component is an optical chip, for example, a diffractive optic, a refractive optic, a collimating optic, or a diffuser structure. The component, or the majority of components, can be used for generating or detecting electromagnetic radiation, for example, in the UV, IR, or visible spectral range. According to at least one embodiment of the method, a sacrificial layer is arranged vertically between the intermediate substrate and the optical components. For example, the sacrificial layer is made of a material such as germanium or silicon. The sacrificial layer can be formed on the intermediate substrate before or during the fabrication of the optical components on the intermediate substrate. With respect to the intermediate substrate and the optical components, the sacrificial layer can be made of a selectively removable material. For example, the material of the sacrificial layer is selected such that it can be removed, for instance, by an etching process without damaging the intermediate substrate and/or the optical components. A lateral direction is understood to be a direction that runs parallel to a principal extensional surface of the intermediate support and/or the optical component. For example, the lateral direction runs parallel to the Sacrificial layer. A vertical direction is understood to be a direction that is perpendicular to the main extensional surface of the intermediate support and/or the optical component. The vertical direction and the lateral direction are, in particular, orthogonal to each other. According to at least one embodiment of the method, a holding structure with a plurality of holding elements is produced. The holding structure is designed such that, particularly after the removal of the sacrificial layer, the optical components are mechanically connected to the intermediate support only via the holding structure. In other words, after the removal of the sacrificial layer, the optical c