DE-102019205411-B4 - Semiconductor arrangement

Abstract

Semiconductor arrangement (1), comprising at least a semiconductor device (2), a heat sink (3), a connecting element (4), and an electrical circuit (17) electrically connected to the heat sink (3); wherein the semiconductor device (2) and the heat sink (3) are arranged at a distance (5, 6) from each other and are electrically and thermally connected via the connecting element (4), wherein an electric current can be conducted to the electrical circuit (17) via the heat sink (3); wherein the semiconductor device (2) is arranged on a printed circuit board (7), wherein a first base (8) of the semiconductor device (2) faces the printed circuit board (7) and a second base (9) opposite the first base (8) faces the heat sink (3); wherein a plurality of semiconductor devices (2) are arranged on the circuit board (7), wherein the second base surfaces (9) of at least two semiconductor devices (2) are arranged at a different distance (5, 6) from the heat sink (3), wherein each of the second base surfaces (9) is electrically and thermally connected to the heat sink (3) via the one connecting element (4).

Inventors

• Andreas Lemke
• Marcus Klink
• Bastian Schaar
• Werner Rössler
• Frank Wesche
• Henning Volkmar
• Lutz Lackenmacher
• Bastian Gröger

Assignees

• VOLKSWAGEN AKTIENGESELLSCHAFT

Dates

Publication Date

20260513

Application Date

20190415

Claims (9)

1. Semiconductor arrangement (1), comprising at least a semiconductor device (2), a heat sink (3), a connecting element (4), and an electrical circuit (17) electrically connected to the heat sink (3); wherein the semiconductor device (2) and the heat sink (3) are arranged at a distance (5, 6) from each other and are electrically and thermally connected via the connecting element (4), wherein an electric current can be conducted to the electrical circuit (17) via the heat sink (3); wherein the semiconductor device (2) is arranged on a printed circuit board (7), wherein a first base (8) of the semiconductor device (2) is the conductor plate (7) and a second base surface (9) opposite the first base surface (8) is facing the heat sink (3); wherein a plurality of semiconductor devices (2) are arranged on the circuit board (7), wherein the second base surfaces (9) of at least two semiconductor devices (2) are arranged at a different distance (5, 6) from the heat sink (3), wherein each of the second base surfaces (9) is electrically and thermally connected to the heat sink (3) via the one connecting element (4).
2. Semiconductor arrangement (1) according to Claim 1 , wherein the connecting element (4) is at least partially deformable to bridge the gap (5, 6).
3. Semiconductor arrangement (1) according to Claim 2 , wherein the connecting element (4) is at least partially elastically deformable.
4. Semiconductor arrangement (1) according to Patent claim 3 , wherein contact is established at least between connecting element (4) and semiconductor device (2) or between connecting element (4) and heat sink (3) exclusively via a clamping effect due to the elastic deformation of the connecting element (4).
5. Semiconductor arrangement (1) according to one of the preceding claims, wherein the connecting element (4) is at least metallurgically connected to the heat sink (3).
6. Semiconductor arrangement (1) according to one of the preceding claims, wherein the connecting element (4) is a sheet metal part.
7. Semiconductor arrangement (1) according to one of the preceding claims, wherein an electrical first connection (10) of the semiconductor device (2) is arranged on the second base surface (9).
8. Semiconductor arrangement (1) according to Patent claim 7 , wherein the semiconductor device (2) comprises at least one transistor, wherein the first terminal (10) is a drain terminal.
9. Semiconductor arrangement (1) according to one of the preceding claims, wherein the connecting element (4) for connecting each semiconductor device (2) to the heat sink (3) has a spring segment (11) which is elastically deformable in the arrangement between semiconductor device (2) and heat sink (3) independently of other spring segments (11) of the connecting element (4).

Description

The invention relates to a semiconductor arrangement, comprising at least one semiconductor component. The semiconductor component is, in particular, arranged on a printed circuit board and electrically connected to it. Semiconductor arrays typically comprise multiple semiconductor devices arranged together on a printed circuit board (PCB). The PCB provides electrical contact between the semiconductor devices and an electrical circuit. Semiconductor assemblies require regular cooling. The heat generated in the semiconductor components must be dissipated, particularly via heat sinks (heat sinks), which, for example, have a much larger surface area than the semiconductor components. It is known, for example, to use solid components (e.g., cuboids made of aluminum) as heat sinks. These contact semiconductor devices via a base surface of the semiconductor device. Typically, several semiconductor devices are arranged together on a printed circuit board (PCB). Semiconductor devices regularly have different thicknesses, so that semiconductor devices arranged with a first base surface on the PCB each have second base surfaces positioned at different distances from the PCB. From the EP 0 130 279 B1 A heat radiation arrangement with a shielding housing for protecting electronic components is known. A first heat sink is thermally connected to the housing, and a second heat sink is thermally connected to the component. The heat sinks are thermally connected to each other via a threaded connection. The threaded connection allows the second heat sink to be moved relative to the first heat sink and the housing towards the component, thus ensuring contact. From the DE 603 19 523 T2 A device for cooling semiconductor components is known. The semiconductor element is thermally connected to a cooling element via an elastically deformable spring element. From the US 2004/0212963 A1 Springs are also provided for the thermally conductive connection of a circuit board to a heat sink. The object of the present invention is to at least partially solve the problems cited with reference to the prior art. In particular, a semiconductor arrangement is to be proposed which enables a particularly advantageous electrical interconnection of the semiconductor components and ensures reliable contact between the semiconductor components and a heat sink. A semiconductor arrangement with the features according to claim 1 contributes to solving these problems. Advantageous further developments are the subject of the dependent claims. The features listed individually in the claims can be combined in a technologically meaningful way and can be supplemented by explanatory details from the description and/or details from the figures, thereby showing further embodiments of the invention. A semiconductor arrangement is proposed, comprising at least a semiconductor device, a heat sink, a connecting element, and an electrical circuit electrically connected to the heat sink. The semiconductor device and the heat sink are spaced apart and electrically and thermally connected via the connecting element. An electric current can be conducted to the electrical circuit via the heat sink. The electrical circuit includes at least one electrical conductor through which the heat sink is connected or can be connected to a voltage source. During operation of the semiconductor assembly, the connecting element positioned between the heat sink and the semiconductor device conducts both an electric current and heat generated within the semiconductor device to the heat sink. In particular, the connecting element bridges the gap (which can vary depending on the size of the semiconductor device mounted on the same circuit board) between the semiconductor device and the heat sink. The heat sink is used in the operation of the semiconductor arrangement, in particular for the transmission of an electric current. In particular, the connecting element for bridging the gap is at least partially deformable (e.g. plastic, i.e. permanently, i.e. not self-reforming). Preferably, the connecting element is at least partially elastically deformable. Elastic deformation allows the connecting element to return to its original shape. Furthermore, due to its elastic properties, a preload can be applied. the connecting element is adjusted so that contact with the heat sink and/or the semiconductor component can be ensured (even without a positive or material-locking connection). In particular, contact is established, at least between the connecting element and the semiconductor device or between the connecting element and the heat sink (preferably between both), exclusively via a clamping effect resulting from the elastic deformation of the connecting element. Specifically, the connecting element is pre-stressed by the elastic deformation, so that a clamping force acting between the connecting element and the semiconductor device or heat sink (or between the semiconductor device and the hea