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DE-102024133015-A1 - Method for creating a bus-type-crossing electronics platform for the control electronics of an electric drive of a fluid pump, and comprising a fluid pump and an electronics platform created in this way

DE102024133015A1DE 102024133015 A1DE102024133015 A1DE 102024133015A1DE-102024133015-A1

Abstract

The invention relates to a method for creating a bus-type-independent electronics platform for a control electronics (1) of an electric drive, in particular a fluid pump, wherein the control electronics (1) for a plurality of variants of the fluid pump has a control electronics board (2) with a uniform board layout (3) and the board layout (3) has a connection pin pattern (4) with a plurality of connection pins (5), the fluid pump has a connector module (6) as an interface from the connection pin pattern (4) of the control electronics (1) to a pin pattern of a customer's vehicle electrical system, comprising the steps: - Providing all necessary connection pins (5) for all bus types to be covered in the connection pin pattern (4) of the PCB layout (3); - Arranging input pins (8) of the connector module (6) in an input pin pattern (9) corresponding to a connection pin pattern (5) of the control electronics board (2), in particular corresponding to a bus type to be contacted; - Arranging output pins (10) in an output pin pattern (11) of the connector module (6) corresponding to the pin pattern of a mating connector module of the customer's vehicle electrical system; - Transferring the input pin pattern (9) of the connector module (6) into the output pin pattern (11) of the connector module (6) within a connector module housing (13), wherein several conductor sections (14), each forming an input pin (8) of the connector module (6) at one end and an output pin (10) of the connector module (6) at the other end, are formed as stamped and bent parts, and the conductor sections (14) are overmolded or overmolded at least in an area between the input pins (8) and the output pins (10) to form a conductor section bundle (14).

Inventors

  • Conrad Nickel
  • Luis Herrling
  • Heidemarie Weinert

Assignees

  • NIDEC GPM GMBH

Dates

Publication Date
20260513
Application Date
20241112

Claims (10)

  1. Method for creating a bus-type-independent electronics platform for the control electronics (1) of an electric drive, in particular a fluid pump, wherein the control electronics (1) comprises a control electronics board (2) with a uniform board layout (3) for a plurality of variants of the fluid pump, and the board layout (3) has a connection pin pattern (4) with a plurality of connection pins (5), and the fluid pump has a connector module (6) as an interface from the connection pin pattern (4) of the control electronics (1) to a pin pattern (7) of a customer's vehicle electrical system, comprising the steps of: - Providing all necessary connection pins (5) for all bus types to be covered in the connection pin pattern (4) of the board layout (3); - Arranging input pins (8) of the connector module (6) in an input pin pattern (9) corresponding to the connection pin pattern (5) of the control electronics board (2), in particular corresponding to a bus type to be contacted; - Arranging output pins (10) in an output pin pattern (11) of the connector module (6) corresponding to the pin pattern (7) of a mating connector module of the customer's vehicle electrical system; - Converting the input pin pattern (9) of the connector module (6) into the output pin pattern (11) of the connector module (6) within a connector module housing (13), wherein several conductor sections (14), each forming an input pin (8) of the connector module (6) at one end and an output pin (10) of the connector module (6) at the other end, are formed as stamped and bent parts, and the conductor sections (14) are overmolded or cast at least in an area between the input pins (8) and the output pins (10) to form a conductor section bundle (15).
  2. Procedure according to Claim 1 , characterized in that the conductor section bundle (15) is designed as a separate component and is inserted into the connector module housing (6).
  3. Procedure according to Claim 1 , characterized in that the conductor sections (14) are bundled in a mold for the connector module housing (13) during the manufacture of the connector module housing (13) by overmolding or overmolding.
  4. Method according to one of the preceding claims, characterized in that the connection pin pattern (4) of the circuit board layout (3) provides at least one connection pin pattern (4) for at least one of the following listed bus types: - Pulse width modulation - LIN bus (local interconnect network, sensors) Actuators), especially in version 2.2 including UDS (Unified Diagnostic Systems) - CAN bus, especially CAN-FD (CAN bus with flexible data rate) - Flex-Ray bus (research: planned bus types for e-vehicles) - Ethernet
  5. Method according to one of the preceding claims, characterized in that the input pins (8) of the connector module (6) are contacted with the respective corresponding connection pins (5) of the connection pin pattern (4) of the control electronics board (2) by means of press-fit pins, solder connections and/or spring-loaded contact elements.
  6. Method according to one of the preceding claims, characterized in that an adaptation of a pin assignment of the connection pin pattern (4) to the customer-specific vehicle electrical system is carried out exclusively by an adapted conductor section routing within the connector module (6).
  7. Method according to one of the preceding claims, characterized in that a uniform connector collar (16) for fastening the connector module (6) to a uniform end cover (17) of the fluid pump is formed on the fluid pump side, independent of customer-specific interface geometries.
  8. Method according to one of the preceding claims, characterized in that a circuit board layout (3) is used for the control electronics (2), which is adapted to different customer-specific requirements, for example with regard to pump performance, a bus system used or the like, by means of adapted component assembly.
  9. Method according to one of the preceding claims characterized in that a uniform mechanical receiving interface independent of customer requirements is provided on a drive housing or on the end cover (17) of the fluid pumps for different plug modules (6), in particular for their uniform plug collars (16).
  10. Fluid pump comprising a bus-type-crossing electronics platform for the control electronics (1) created according to the method according to one of the Claims 1 until 9 .

Description

The invention relates to a method for creating a bus-type-independent electronics platform for control electronics of an electric drive of a fluid pump and a fluid pump comprising an electronics platform created in this way. From a supplier's perspective, it is currently common practice when developing fluid pumps, especially electric drives for fluid pumps, to start with individual, customer-specific requirements, such as those of an OEM customer, and develop a fluid pump that meets all of the customer's requirements. For example, with electric fluid pumps, the customer may use different data transmission bus systems or request pumps with different performance levels. Depending on these requirements, current practice dictates the development of customer-specific control electronics that match the customer's specifications. Electric fluid pumps typically have an end cover as a housing component, into which a customer-specific connector geometry is integrated. This connector is designed for the appropriate electrical connection to a socket in a customer-specific wiring harness. Among other things, the connector-socket systems of different customers also differ in the number and/or arrangement of contact pins within a connector. To meet the requirements of each customer, pin assignments are currently implemented through appropriate arrangement on a control electronics board and a customer-specific connector solution in the end cover. While this practice has proven effective in meeting customer-specific requirements, a disadvantage is the relatively high design effort involved with the different control electronics, the varying designs of the end caps with integrated contact pins, and similar components. Furthermore, this results in a very high degree of pump variety, making warehousing and logistical support complex. The object of the invention is therefore to provide an electronics platform with a suitable connector concept in order to cover as many customer interfaces/requirements of various OEM manufacturers as possible with as few interfaces as possible, particularly within the pump itself. A further aim is to achieve a significant reduction in the number of variants while maintaining a consistently high level of adaptability to specific customer requirements. These tasks are solved with regard to the method by a method for creating a bus-type-independent electronics platform for the control electronics of an electric drive, in particular a fluid pump, wherein the control electronics for a plurality of variants of the fluid pump has a control electronics board with a uniform board layout and the board layout has a connection pin pattern with a plurality of connection pins, the fluid pump has a connector module as an interface from the connection pin pattern of the control electronics to a pin pattern of a customer's vehicle electrical system, comprising the steps: - Providing all necessary connection pins for all bus types to be covered in the connection pin pattern of the PCB layout; - Arranging the input pins of the connector module in an input pin pattern corresponding to the connection pin pattern of the control electronics board, in particular corresponding to the bus type to be contacted; - Arranging output pins in an output pin pattern of the connector module corresponding to the pin pattern of a mating connector module of the customer's vehicle electrical system; - Transferring the input pin pattern of the connector module into the output pin pattern of the connector module within a connector module housing, wherein several conductor sections, each forming an input pin of the connector module at one end and an output pin of the connector module at the other end, are formed as stamped and bent parts, and the conductor sections are overmolded or overmolded at least in an area between the input pins and the output pins to form a conductor section bundle. The overmolding of conductor sections to form a conductor section bundle is carried out, for example, using plastic, in particular a thermoplastic, via a plastic injection molding process. However, a one- or multi-component thermoset can also be used. The bundling by overmolding or casting can take place in a suitable mold into which the conductor sections are placed. In a preferred embodiment of the method, the conductor section bundle is designed as a separate component and inserted into the connector module housing. Advantageously, in one embodiment, the conductor sections are placed in a mold. Materials for the connector module housing are bundled during the manufacturing of the connector module housing by overmolding or overmolding. For bus-specific adaptation to a customer-specific vehicle electrical system, for example of a particular vehicle, it is useful that the circuit board layout provides at least one connection pin pattern for at least one of the bus types listed below: - Pulse width modulation - LIN bus (local interconnect network, sen