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DE-102024133085-A1 - Substrate clip with foil and structured electrically conductive structure of varying thicknesses

DE102024133085A1DE 102024133085 A1DE102024133085 A1DE 102024133085A1DE-102024133085-A1

Abstract

Substrate clip (100) for connecting a carrier (102) to an electronic component (104) of a housing (106), wherein the substrate clip (100) has an electrically insulating and thermally conductive film (108) and a structured electrically conductive structure (110) on a main surface of the electrically insulating and thermally conductive film (108) and has at least two different connecting sections (112-115) with different thicknesses (d1, d2).

Inventors

  • Yi Ting Tan
  • Chwee Pang Tommy Khoo
  • Mei Fen Hiew
  • Bee Kwan Saw
  • Wei Han Koo

Assignees

  • INFINEON TECHNOLOGIES AUSTRIA AG

Dates

Publication Date
20260513
Application Date
20241112

Claims (20)

  1. Substrate clip (100) for connecting a carrier (102) to an electronic component (104) of a housing (106), wherein the substrate clip (100) comprises: • an electrically insulating and thermally conductive film (108); and • a structured electrically conductive structure (110) on a main surface of the electrically insulating and thermally conductive film (108) and with at least two distinct connecting sections (112-115) with different thicknesses (d1, d2).
  2. Substrate clip (100) after Claim 1 , wherein at least one of the at least two different connecting sections (112-115) has a metal column (116).
  3. Substrate clip (100) after Claim 1 or 2 , wherein the at least two different connecting sections (112-115) have a first metal column (116) and a second metal column (118) with different vertical extensions (11, 12).
  4. Substrate clip (100) according to one of the Claims 1 until 3 , wherein the at least two different connecting sections (112-115) have a first metal sheet section (160) and a second metal sheet section (162) with different vertical extensions (s1, s2).
  5. Substrate clip (100) according to one of the Claims 1 until 4 , wherein at least one of the at least two different connecting sections (112-115) has a plating structure (120) at an interface area with a carrier (102) or with an electronic component (104).
  6. Substrate clip (100) according to one of the Claims 1 until 5 , having one of the following features: wherein different sections of the at least two distinct connecting segments (112-115) are electrically decoupled from each other; wherein different sections of the at least two different connecting sections (112-115) are electrically coupled to each other.
  7. Substrate clip (100) according to one of the Claims 1 until 6 , wherein the electrically insulating and thermally conductive film (108) is flat with homogeneous thickness (F).
  8. Substrate clip (100) according to one of the Claims 1 until 7 , wherein the electrically insulating and thermally conductive film (108) comprises or consists of a ceramic.
  9. Substrate clip (100) according to one of the Claims 1 until 8 , comprising a further electrically conductive structure (126), in particular made of solderable material, on a opposite other main surface of the electrically insulating and thermally conductive film (108).
  10. Substrate clip (100) after Claim 9 , wherein the further electrically conductive structure (126) is a continuous layer, in particular with homogeneous thickness.
  11. Substrate clip (100) according to one of the Claims 1 until 10 , wherein the substrate clip (100) is configured as one of a direct copper bonding type substrate, a direct aluminum bonding type substrate and an active metal brazing type substrate.
  12. Housing (106) comprising: • a carrier (102); • an electronic component (104) mounted on the carrier (102); and • a substrate clip (100) according to one of the Claims 1 until 11 , which connects the carrier (102) to the electronic component (104), wherein at least one of the at least two different connecting sections (112-115) establishes an electrically conductive connection with the carrier (102) and at least one other of the at least two different connecting sections (112-115) establishes an electrically conductive connection with the electronic component (104).
  13. Housing (106) after Claim 12 , having at least one of the following features: the housing (106) has at least one further substrate clip (100) after one of the Claims 1 until 11 on; wherein the substrate clip (100) connects at least two different sections (128, 130) of the carrier (102) and/or connects at least two electronic components (104); wherein the carrier (102) has a component assembly section (128) on which the electronic component (104) is mounted, and has at least one conductor section (130) that is electrically coupled to the at least one electronic component (104) and/or to the component assembly section (128), wherein in particular the component assembly section (128) is connected to one of the at least two connection sections (112, 114) and the at least one conductor section (130) is connected to another of the at least two connection sections (112, 114).
  14. Housing (106) after Claim 12 or 13 , comprising at least one of the following features: wherein the main surface of the substrate clip (100) opposite the structured electrically conductive structure (110) forms part of an outer surface of the housing (106); wherein a main surface of the support (102) forms part of an outer surface of the housing (106).
  15. Housing (106) according to one of the Claims 12 until 14 , comprising an encapsulation (132), for example a molding compound, which encapsulates a part of the carrier (102), at least a part of the substrate clip (100) and at least a part of the electronic component (104), wherein in particular the substrate clip (100) protrudes from the encapsulation (132) or is coplanar with the encapsulation (132).
  16. Housing (106) according to one of the Claims 12 until 15 , wherein the electronic component (104) is arranged in a flip-chip configuration and has an active area on its front side which is connected to the carrier (102).
  17. Housing (106) according to one of the Claims 12 until 16 , comprising at least one of the following features: wherein the electronic component (104) and another electronic component (104') are connected in a half-bridge configuration; wherein the different connecting sections (112-115) have at least three different thicknesses; wherein the different connecting sections (112-115) have a first thickness connecting the electronic component (104), a second thickness connecting another electronic component (104'), and a third thickness connecting the support (102); comprising at least one further electronic component (104') mounted on the support (102); wherein the electronic component (104) has at least one terminal facing the substrate clip (100); wherein the electronic component (104) has at least one terminal on each of its two opposite principal faces; wherein the electronic component (104) has a vertical electronic component; wherein the electronic component (104) is a lateral electronic component.
  18. A method for manufacturing a substrate clip (100) for connecting a carrier (102) to an electronic component (104) of a housing (106), the method comprising: • providing an electrically insulating and thermally conductive film (108); and • forming a structured electrically conductive structure (110) on a main surface of the electrically insulating and thermally conductive film (108) such that the structured electrically conductive structure (110) has at least two distinct connection sections (112-115) with different thicknesses (d1, d2).
  19. Procedure according to Claim 18 , wherein the method comprises forming the structured electrically conductive structure (110) with at least two different connecting sections (112-115) with different thicknesses (d1, d2) by: treating an initial electrically conductive structure (132) using a first mask (134) to form an electrically conductive intermediate structure (136) with a homogeneous thickness (d2); and then treating the electrically conductive intermediate structure (136) using a second mask (138) to obtain the structured electrically conductive structure (110) with at least two different connecting sections (112-115) with different thicknesses (d1, d2).
  20. Procedure according to Claim 18 , wherein the method comprises forming the structured electrically conductive structure (110) with at least two different connecting sections (112-115) with different thicknesses (d1, d2) by: providing an initial electrically conductive structure (150) with a homogeneous thickness (d0); and then attaching at least one column (116, 118) to the initial electrically conductive structure (150) in order to obtain the structured electrically conductive structure (110) with at least two different connecting sections (112-115) with different thicknesses (d1, d2).

Description

background Technical field Different embodiments generally relate to a substrate clip, a housing, and a method for manufacturing a substrate clip. Description of the state of the art Enclosures can be described, for example, as encapsulated electronic components with exposed electrical connections and can be mounted on an electronic peripheral, such as a printed circuit board. Enclosure costs are a key driver for industry. This is closely linked to performance, dimensions, and reliability. The various enclosure solutions are diverse and must meet the requirements of the application. Summary There may be a need for a housing and corresponding components that can be manufactured easily and with high reliability. According to an exemplary embodiment, a substrate clip is provided for connecting a carrier to an electronic component of a housing, wherein the substrate clip comprises an electrically insulating and thermally conductive film and a structured electrically conductive structure on a main surface of the electrically insulating and thermally conductive film and has at least two different connection sections with different thicknesses. According to a further exemplary embodiment, a housing is provided comprising a carrier, an electronic component mounted on the carrier and a substrate clip with the above-mentioned features connecting the carrier to the electronic component, wherein at least one of the at least two different connection sections establishes an electrically conductive connection with the carrier and at least one other of the at least two different connection sections establishes an electrically conductive connection with the electronic component. According to yet another exemplary embodiment, a method for manufacturing a substrate clip for connecting a carrier to an electronic component of a housing is provided, wherein the method comprises providing an electrically insulating and thermally conductive film and forming a structured electrically conductive structure on a main surface of the electrically insulating and thermally conductive film, such that the structured electrically conductive structure has at least two different connection sections with different thicknesses. According to an exemplary embodiment, a substrate adapted as a clip can be provided. Such a substrate clip can be configured to efficiently connect a carrier to an electronic component within a housing, while also providing extended functionality. This substrate clip can comprise an electrically insulating and thermally conductive film, such as a ceramic plate, which provides dielectric function and contributes to heat dissipation generated by the electronic component during housing operation. A structured, electrically conductive layer can be formed on one side of the film and can be provided with two or more connection sections of varying thicknesses. Such a multi-level electrically conductive layer on an electrically insulating and thermally conductive film can provide clip functionality by connecting different connection sections to various housing components, such as the carrier and the electronic component. This can enable the compact and highly efficient electrical coupling of the substrate and the electronic component without adding significant complexity to the manufacturing process, and with the possibility of providing additional electrical decoupling and thermal coupling functionality for the clip and the housing as a whole. To illustrate, a substrate with multiple interconnect sections of varying thicknesses on the same main surface of a dielectric and thermally conductive film can be reconfigured to additionally function as a clip for creating an electrical connection between components at different height levels, while simultaneously providing electrical current isolation and heat dissipation functionality. Description of further exemplary embodiments Further exemplary embodiments of the substrate clip, the housing and the method are explained below. In the context of the present application, the term "substrate clip" can, in particular, refer to a hybrid of an electrically conductive clip that enables electrical connectivity at two or more different height levels, with a substrate that provides electrically insulating and thermally conductive functionality through a suitably configured plate. With a common insulating substrate, it may be advantageous to provide more than one structured electrically conductive structure on a major surface of the substrate. For example, a first electrically conductive structure may be used to connect a drain pad of the electronic component to a drain conductor of the substrate, and a second electrically conductive structure may be used to connect a source pad of the electronic component to a source conductor of the substrate, and both the first and second structures may be fabricated on a major surface of the substrate. During fabrication, it may be advantageous to use a sin