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DE-102024210744-A1 - Power module bridge and method for assembling a power module bridge

DE102024210744A1DE 102024210744 A1DE102024210744 A1DE 102024210744A1DE-102024210744-A1

Abstract

Power module bridge (100), comprising a cooler (102) with a conductive surface (116), with at least two power modules (12) having arranged semiconductor devices, wherein each power module (12) is assigned current-carrying paths which are designed as overmolded copper elements (122) and as a phase bridge (128) and are connected to the power module (12) by first pre-assembled elements (106.1) by a first metallurgical connection, wherein each power module (12) is assigned a signal adapter (118), wherein the signal adapter (118) is connected to the power module (12) by adhesive (902), wherein a signal adapter (118) has a number of press-fit pins (120) and contact surfaces (602), wherein the contact surfaces (602) can be contacted with the semiconductor devices of the power module (12) by means of a bond wire connection via bond wires (124), wherein the power modules (12) are each connected by second The pre-assembled elements (106.2) are connected to the cooler (102) by a second material-bonded connection to the heat sink (102).

Inventors

  • Irfan Aydogmus

Assignees

  • Robert Bosch Gesellschaft mit beschränkter Haftung

Dates

Publication Date
20260513
Application Date
20241108

Claims (11)

  1. Power module bridge (100), comprising a cooler (102) with a conductive surface (116), with at least two power modules (12) comprising semiconductor components, wherein each power module (12) is assigned current-carrying paths formed as overmolded copper elements (122) and as a phase bridge (128) and connected to the power module (12) by a first metallurgical connection via first pre-assembled elements (106.1), wherein each power module (12) is assigned a signal adapter (118), wherein the signal adapter (118) is connected to the power module (12) by adhesive (902), wherein a signal adapter (118) has a number of press-fit pins (120) and contact surfaces (602), wherein the contact surfaces (602) can be contacted with the semiconductor components of the power module (12) by means of a bond wire connection with bond wires (124), wherein the power modules (12) are each connected by inserting second pre-assembly elements (106.2) are connected to the cooler (102) by a second material-bonded connection.
  2. Power module bridge (100) according to Claim 1 , wherein the first extension elements (106.1) and the second extension elements (106.2) are designed as solder plates.
  3. Power module bridge (100) according to Claim 1 or 2 , wherein the power modules (12) are each at least partially enclosed by a mold body (130).
  4. Power module bridge (100) according to one of the preceding claims, wherein the power module bridge (100) comprises a first power module (110.1), a second power module (110.2) and a third power module (110.3).
  5. Power module bridge (100) according to one of the preceding claims, wherein the contact surfaces (602) of the signal adapter (118) can be contacted with the semiconductor components of the power module (12) by means of a third material-bonded connection or an adhesive tape connection.
  6. Power module bridge (100) according to one of the preceding claims, wherein the first material-jointed connection and the second material-jointed connection are designed as a laser beam welding connection.
  7. Power module bridge (100) according to one of the preceding claims, wherein a T+ bridge (126) and a T- bridge (127) are formed side by side in the overmolded copper element (122) such that a low-inductive connection is formed.
  8. Power module bridge (100) according to one of the preceding claims, wherein a signal adapter (118) has a formable installation space (702) such that contact between the power module (12) and the external contact is ensured.
  9. Power module bridge (100) according to one of the preceding claims, wherein the adhesive (902) is designed such that an adjustable distance (904) can be achieved during a connection between the power module (12) and the signal adapter (118).
  10. Power module bridge (100) according to one of the preceding claims, wherein the conductive surface (116) is designed as a copper coating.
  11. Method for assembling a power module bridge (100) according to one of the Claims 1 until 10 comprising at least a first step, a second step and a third step, wherein in the first step the cooler (102) and the power modules (12) are joined by inserting second pre-assembly elements (106.2) and the power modules (12) are joined to the current-carrying phases by inserting first pre-assembly elements (106.1), wherein in the second step a signal adapter (118) is glued onto a power module (12), wherein in the third step a contacting of the signal adapter (118) with the power module (12) is carried out.

Description

Technical field The invention relates to a power module bridge with a cooler, comprising at least two power modules, each of which has at least one first pre-assembly element and at least one second pre-assembly element, as well as at least one AC power contact and at least one DC power contact with an injected copper element and a signal adapter. The invention further relates to a method for assembling a power module bridge. State of the art Out of DE 10 2014 219 998 B4 A power module is known, particularly for providing a phase current for an electric motor. The power module comprises a circuit carrier with a surface, at least two first contact surfaces on the surface, and at least two first power transistors, each having a contact surface on its base. Each of the at least two first power transistors is arranged directly on one of the first contact surfaces and is electrically connected to the respective first contact surface via its base contact surface. Furthermore, the power module comprises a second contact surface on the surface and at least two second power transistors, each having a ground contact surface. The at least two second power transistors are arranged directly on the second contact surface and are electrically connected to the second contact surface via their respective base contact surfaces. The power module further comprises at least two third contact surfaces on the surface, wherein the at least two second power transistors each have a further contact surface on their sides facing away from the surface of the circuit carrier, and each of the at least two second power transistors is electrically connected to one of the at least two third contact surfaces via its further contact surface. The at least two first contact surfaces and the at least two third contact surfaces are arranged alternately one behind the other in a longitudinal direction of the power module, and the second contact surface is arranged next to the at least two first contact surfaces and the at least two third contact surfaces, wherein the second contact surface has at least two contact areas, one of which is located next to each of the at least two first power transistors. The at least two first power transistors each have an additional contact surface on their sides facing away from the surface of the circuit carrier, and each first power transistor of the at least two first power transistors is electrically connected via its additional contact surface to the adjacent contact area of the at least two contact areas of the second contact surface. The at least two contact areas of the second contact surface and the at least two second power transistors are arranged alternately one behind the other in a longitudinal direction. Disclosure of the invention According to the invention, a power module bridge with a heat sink having a conductive surface and at least two power modules, which have arranged semiconductor components, is proposed. Each power module is assigned current-carrying paths designed as an overmolded copper element and as a phase bridge, and these paths are connected to the power module via a first metallurgical bond by means of first connecting elements. A signal adapter is also assigned to each power module, which is connected to the power module by means of an adhesive. The signal adapter has a number of press-fit pins and contact surfaces that can be contacted with the semiconductor components of the power module via bond wires. The power modules are each further connected to the heat sink via a second metallurgical bond by means of second connecting elements. The solution according to the invention provides a power module bridge that includes a signal adapter, enabling direct integration into existing production lines, so-called "design-to-line," without requiring any additional adjustments or modifications, unlike conventional solutions. The solution according to the invention leads to both an increase in production efficiency and a reduction in manufacturing costs. A signal adapter is a technical interface used to transmit control signals to a power module of a power module bridge. The signal adapter ensures optimal adaptation of the signal parameters between the control unit and the respective power module of a power module bridge. For example, the signal adapter acts as a transformer, converting the input signals from a control unit into output signals suitable for the power module. This involves adjusting voltage and current levels, taking signal delays into account, and... Galvanic isolation is provided. This ensures reliable operation and resistance to interference. The signal adapter of the power module bridge according to the invention is designed such that it can be assigned to a single power module and is adaptable. By way of example, a power module bridge according to the invention can comprise three power modules, with each power module having its own signal adapter. Within the scope of the