DE-102025121781-A1 - COOLING DEVICE FOR POWER MODULE AND INVERTER, WHICH FEATURES THIS

DE102025121781A1DE 102025121781 A1DE102025121781 A1DE 102025121781A1DE-102025121781-A1

Abstract

A cooling device for a power module is provided. The cooling device comprises a first surface contact cooler that contacts one surface of the power module and has a first heat sink in which a first airflow path is formed, and a second surface contact cooler that contacts the other surface of the power module and has a second heat sink in which a second airflow path is formed, wherein the first air path and the second air path together form a continuous airflow path.

Inventors

Won Seok Lee
Ji Eun Kim
Yo Han Kim
Jae Hyuk Seo
Jong Ho Jung
Yun Kyung Ji
Jong Yun PARK
Sun Sung KWON
Kwang Min Choi
Chon Ok Kim
Baek Yu Kim
Chul Min Ahn
Sung Gon Byun
Jun Young Ha
Su Hyeon MAENG
Dong Hui CHEON

Assignees

HYUNDAI MOTOR COMPANY
KIA CORPORATION

Dates

Publication Date: 20260513
Application Date: 20250604
Priority Date: 20241112

Claims (20)

Cooling device for a power module, wherein the cooling device comprises: a first surface contact cooler that contacts a first surface of the power module and has a first heat sink in which a first airflow path is formed; and a second surface contact cooler that contacts a second surface of the power module and has a second heat sink in which a second airflow path is formed, whereby the first airflow path and the second airflow path together form a continuous airflow path.
Cooling device according to Claim 1 , wherein the second heat sink is arranged on the longitudinal sides of the first heat sink.
Cooling device according to Claim 1 or 2 , wherein the first surface contact cooler has a first heat distributor that contacts a surface of the power module, and the first heat sink projects from the first heat distributor.
Cooling device according to Claim 3 , wherein the first heat distributor comprises: a first flat plate contact part having a surface in contact with a surface of the power module; and an extension part which is bent outwards in a width direction from an end section of the first flat plate contact part.
Cooling device according to Claim 4 , wherein the first heat sink comprises: a horizontal heat sink projecting in a horizontal direction from another surface of the first flat plate contact part; and a vertical heat sink projecting in a vertical direction from a surface of the extension part not facing the horizontal heat sink, wherein the first airflow path comprises a horizontal airflow path formed in the horizontal heat sink and a vertical airflow path formed in the vertical heat sink.
Cooling device according to Claim 5 , wherein at least one section of the second heat sink is arranged to face the horizontal heat sink in a longitudinal direction, wherein the horizontal airflow path and the second airflow path form a continuous air movement path, and another section of the second heat sink is arranged to face the vertical heat sink in a longitudinal direction, wherein the vertical airflow path and the second airflow path form a continuous air movement path.
Cooling device according to one of the preceding claims, wherein the second surface contact cooler has a second heat distributor with a surface in contact with the second surface of the power module, and the second heat sink projects from longitudinal sides of the second heat distributor in a direction in which the first heat sink is provided.
Cooling device according to Claim 7 , wherein the second heat sink is arranged on the longitudinal sides of the first heat sink and the first airflow path and the second airflow path are provided continuously in a longitudinal direction of the first heat sink.
Cooling device for a power module, the cooling device comprising: a first surface contact cooler that contacts a first surface of a power module and has a first heat sink in which a first airflow path is formed; a second surface contact cooler that is arranged on longitudinal sides of the first heat sink and has a second heat sink in which a second airflow path is formed, the second surface contact cooler contacting a second surface of the power module; a housing that is provided to surround at least a section of an external surface of the first heat sink and the second heat sink; a central support that is provided between the first surface contact cooler and the second surface contact cooler and forms a space in which the power module is arranged; and a support bracket that is coupled to the central support bracket and presses and fixes a surface of the second surface contact cooler that does not contact the power module, the first airflow path and the second airflow path together forming a continuous airflow path.
Cooling device according to Claim 9 , wherein the middle bracket blocks a section of the second heat sink that is not facing the first heat sink in a longitudinal direction to prevent air movement to the power module.
Cooling device according to Claim 9 or 10 , wherein the middle support comprises: a support panel with a surface in contact with the first surface contact cooler; and a separating rib, which is provided in plurality on another surface of the support panel in a longitudinal direction and forms a power module arrangement space in which the power module is arranged.
Cooling device according to Claim 11 , wherein at least one section of a first surface of the separating rib is in contact with the first surface contact cooler and at least one section of a second surface of the separating rib is in contact with the second surface contact cooler.
Cooling device according to Claim 12 , wherein the second surface of the separating rib is provided with an insertion recess into which the second surface contact cooler is inserted.
Cooling device according to one of the Claims 9 until 13 , wherein longitudinal end sections of the housing are open, so that the second heat sink is exposed to the longitudinal sides of the housing.
Cooling device according to one of the Claims 9 until 14 , wherein the housing comprises: a lateral housing part arranged on a surface of the first surface contact cooler and the second surface contact cooler in a width direction; an upper housing part bent from one end of the lateral housing part in a thickness direction; and a lower housing part bent from another end of the lateral housing part in the thickness direction.
Cooling device according to Claim 15 , wherein an end section of the upper housing part and an end section of the lower housing part are coupled to a surface of the middle support, and end sections of the support holder are coupled to another surface of the middle support.
Cooling device according to one of the Claims 9 until 16 , wherein the first surface contact cooler has a first heat distributor that contacts a surface of the power module, and the first heat sink projects from the first heat distributor.
Cooling device according to Claim 17 , wherein the first heat distributor comprises: a first flat plate contact part with a surface that contacts a surface of the power module; and an extension part that is bent outwards in a width direction from an end section of the first flat plate contact part, and the heat sink comprises: a horizontal heat sink projecting in a horizontal direction from another surface of the first flat plate contact part; and a vertical heat sink projecting in a vertical direction from a surface of the extension part that is not facing the horizontal heat sink.
Cooling device according to Claim 17 or 18 , wherein at least one section of the second heat sink is arranged to face the horizontal heat sink in a longitudinal direction, and another section of the second heat sink is arranged to face the vertical heat sink in a longitudinal direction.
Cooling device according to one of the Claims 9 until 19 , wherein the second surface contact cooler has a second heat distributor with a surface in contact with another surface of the power module and the second heat sink projects from longitudinal sides of the second heat distributor in a direction in which the first heat sink is provided.

Description

TECHNICAL AREA The present disclosure relates to a cooling device for a power module and an inverter comprising this device. BACKGROUND An automotive power conversion device receives direct current (DC) from a high-voltage battery, converts the DC to alternating current (AC), and supplies it to a motor. The motor's torque and speed are controlled by adjusting the AC current's strength and phase. A power conversion device is a switching element that converts the DC from the high-voltage battery into AC. Heat is generated during the switching process, and damage can occur if the temperature exceeds a certain level. Therefore, the power module of all power conversion devices utilizes cooling. Improving the cooling performance allows for the conversion of higher-spec currents within the power module, thus also improving the power conversion device's performance. In some power conversion devices, the power module is cooled by creating a cooling flow path within a housing or by arranging the power module with a separate radiator. A water-cooled or oil-cooled radiator is used as the radiator. However, using a water-cooled or oil-cooled cooler requires components such as a pump, radiator, tube, and hose, which increases manufacturing costs. Therefore, research into a cooling device that can effectively cool while reducing the manufacturing costs of a power module can be beneficial. PRESENTATION OF THE INVENTION One aspect of the present disclosure is to provide a cooling device for a power module that reduces manufacturing costs, provides improved cooling efficiency and enables miniaturization, and an inverter that incorporates these features. According to a first aspect of the present disclosure, a cooling device for a power module comprises a first surface contact cooler which contacts a surface of the power module and has a first heat sink in which a first airflow path is formed, and a second surface contact cooler which contacts the other surface of the power module and has a second heat sink in which a second airflow path is formed, wherein the first air path and the second air path together form a continuous airflow path. The second heat sink can be located on both long sides of the first heat sink. The first surface contact cooler can have a first heat distributor that contacts a surface of the power module, and the first heat sink can protrude from the first heat distributor. The first heat distributor can have a first flat plate contact part with a surface in contact with a surface of the power module, and an extension part that is bent outwards in a width direction from an end section of the first flat plate contact part. The first heat sink can have a horizontal heat sink projecting in a horizontal direction from the other surface of the first flat plate contact part, and a vertical heat sink projecting in a vertical direction from a surface of the extension part not facing the horizontal heat sink, wherein the first airflow path has a horizontal airflow path formed in the horizontal heat sink and a vertical airflow path formed in the vertical heat sink. The horizontal airflow path and the vertical airflow path can be parallel. At least one section of the second heat sink can be arranged to face the horizontal heat sink in a longitudinal direction, wherein the horizontal airflow path and the second airflow path form a continuous air movement path, and the other section of the second heat sink can be arranged to face the vertical heat sink in a longitudinal direction, wherein the vertical airflow path and the second airflow path form a continuous air movement path. The second surface contact cooler can have a second heat distributor with a surface in contact with the second surface of the power module, and the second heat sink can protrude from both longitudinal sides of the second heat distributor in a direction in which the first heat sink is provided. The second heat sink can be located on both longitudinal sides of the first heat sink, and the first airflow path and the second airflow path can be provided continuously in the longitudinal direction of the first heat sink. According to another aspect of the present disclosure, a cooling device for a power module comprises a first surface contact cooler that contacts a surface of a power module and has a first heat sink in which a first airflow path is formed, a second surface contact cooler that is arranged on both longitudinal sides of the first heat sink and has a second heat sink in which a second airflow path is formed, the second surface contact cooler contacting the other surface of the power module, a housing provided to surround at least a section of an external surface of the first heat sink and the second heat sink, a middle support provided between the first surface contact cooler and the second surface contact cooler and forming a space in which the power module is arranged, and a support bracket coupled to the middle support and pressing an