DE-102025134866-A1 - Semiconductor device and method for manufacturing a semiconductor device

Abstract

One objective of the present disclosure is to provide a technique capable of uniformly bonding a printed circuit board (PCB) covered with a sealing material to a metal plate. According to the present disclosure, a semiconductor device comprises a PCB having a first primary surface and a second primary surface facing each other, a semiconductor device bonded to the first primary surface of the PCB, a sealing material covering a portion of the first primary surface of the PCB and the semiconductor device, and a metal plate bonded to the second primary surface of the PCB. The first primary surface of the PCB includes a pressed-in area exposed by the sealing material.

Inventors

• Yosuke Nakata
• Yuji Sato
• Shin Uegaki

Assignees

• MITSUBISHI ELECTRIC CORPORATION

Dates

Publication Date

20260513

Application Date

20250901

Priority Date

20241111

Claims (8)

1. Semiconductor device (100) comprising: a printed circuit board (10) having a first main surface and a second main surface opposite each other; a semiconductor device (20) bonded to the first main surface of the printed circuit board (10); a sealing material (30) covering a portion of the first main surface of the printed circuit board (10) and the semiconductor device (20); and a metal plate (40) bonded to the second main surface of the printed circuit board (10), wherein the first main surface of the printed circuit board (10) has a pressed-in area (12) exposed by the sealing material (30).
2. Semiconductor device (100) according to Claim 1 , wherein the printed circuit board (10) and the metal plate (40) are bonded together by a sintered bonding material or a solid-state bonding material.
3. Semiconductor device (100) according to Claim 1 or 2 , wherein the pressed part area (12) is provided as a plurality of pressed part areas (12) which are arranged on a plurality of straight lines (16) passing through the center of gravity (14) of the printed circuit board (10).
4. Semiconductor device (100a) according to one of the Claims 1 until 3 , wherein the sealing material (30a) has a notched part area, and the pressed part area (12a) is exposed from the notched part area.
5. Semiconductor device (100a) according to Claim 4 , wherein the semiconductor device comprises a plurality of semiconductor devices (20a-20f), the plurality of semiconductor devices (20a-20f) being arranged in a zigzag manner in a longitudinal direction of the first main surface of the printed circuit board (10) such that respective heat-generating centers are not aligned in a straight line, the semiconductor devices (20a, 20f) being arranged at both ends of the plurality of semiconductor devices (20a-20f) being arranged close to a center of the first main surface in a transverse direction of the first main surface compared with one or more semiconductor devices (20b-20e) being arranged among the other semiconductor devices (20b-20e), and the notched part region being provided in the vicinity of each of the semiconductor devices (20a, 20f) being arranged at both ends of the plurality of semiconductor devices (20a-20f).
6. Semiconductor device (100b) according to one of the Claims 1 until 5 , further comprising a bridging material (70) which is provided in an internal sub-area of the printed circuit board (10a) and is made of a material with a higher strength than the printed circuit board (10a), wherein the bridging material (70) spreads in a longitudinal direction of the printed circuit board (10a) and is arranged directly under the pressed part area (12a).
7. Semiconductor device (100b), according to Claim 6 , wherein the bridging material (70) is made of a material with a lower thermal diffusion coefficient than the printed circuit board (10a) and is located at a position which is not directly under the semiconductor device (20a-20f).
8. Method for manufacturing the semiconductor device (100) according to one of the Claims 1 until 7 , wherein the method comprises a sealing step which uses an insert, the insert having an upper insert (62) which comes into contact with the printed circuit board (10) from an upper surface of the printed circuit board (10), and the upper insert (62) having a projection which contacts the pressed part area (12).

Description

Background of the invention Area The present disclosure relates to a semiconductor device and a method for manufacturing a semiconductor device. background The unexamined Japanese patent application publication no. 2024-20691 This reveals a technology for soldering a printed circuit board (PCB) with a semiconductor device mounted on it to an insulating substrate with a circuit structure. However, when the PCB and the insulating substrate were joined by soldering, a problem arose: cracks appeared in the solder joint due to stress from cycle tests and the like. To solve this problem, a method involving the application of sintered bonding or solid-state bonding exists, which exhibit superior bonding durability compared to solder bonding. This sintered and solid-state bonding requires a pressure bonding process in a high-temperature environment of approximately 300 degrees Celsius. However, when the aforementioned method is applied to bonding a printed circuit board covered with a sealing material to a metal plate, the sealing material softens in the high-temperature environment during the pressure bonding process. As a consequence, a problem arose in that uniform bonding was difficult to achieve due to cracking or deformation of the sealing material around the area under pressure. Summary In view of the problem described above, one object of the present disclosure is to provide a semiconductor device and a method for manufacturing the semiconductor device which can uniformly bond a printed circuit board covered with a sealing material and a metal plate by applying pressure to a part of the printed circuit board exposed by the sealing material, thereby solving the problem described above. The features and advantages of the present disclosure can be summarized as follows. A semiconductor device according to the present disclosure comprises: a printed circuit board having a first main surface and a second main surface opposite each other; a semiconductor device bonded to the first main surface of the printed circuit board; a sealing material covering a portion of the first main surface of the printed circuit board and the semiconductor device; and a metal plate bonded to the second main surface of the printed circuit board, wherein the first main surface of the printed circuit board has a pressed-in area as an area exposed by the sealing material. Other and further tasks, features and advantages of the revelation will become more apparent from the following description. Brief description of the drawings 1 is a top view showing a semiconductor device according to the first embodiment of the present disclosure.2 is a first diagram showing a sealing process of the semiconductor device according to the first embodiment of the present disclosure.3 is a second diagram showing the sealing process of the semiconductor device according to the first embodiment of the present disclosure.4 is a third diagram showing the sealing process of the semiconductor device according to the first embodiment of the present disclosure.5 is a fourth diagram showing the sealing process of the semiconductor device according to the first embodiment of the present disclosure.6 is a top view showing a semiconductor device according to the second embodiment of the present disclosure.7 is a diagram showing thermal impairment in a semiconductor device according to a comparative example.8 is a diagram showing thermal impairment in the semiconductor device according to the second embodiment of the present disclosure.9 is a first diagram that shows a sealing process of the semiconductor device as shown in the second embodiment of the present disclosure.10 is a second diagram showing the sealing process of the semiconductor device according to the second embodiment of the present disclosure.11 is a third diagram showing the sealing process of the semiconductor device according to the second embodiment of the present disclosure.12 is a fourth diagram showing the sealing process of the semiconductor device according to the second embodiment of the present disclosure.13 is a top view showing a semiconductor device according to the third embodiment of the present disclosure.14 is a cross-sectional view, taken along a line AA' in 13 .15 is a cross-sectional view, taken along a line BB' in 13 . Description of the embodiments Semiconductor devices of the present disclosure are described with reference to the drawings. The same or corresponding components may be assigned the same reference numerals, and repeated descriptions may be omitted. In the present disclosure, a surface opposite the first principal surface is referred to as the second principal surface. First embodiment 1 Figure 100 is a top view showing a semiconductor device according to the first embodiment of the present disclosure. The semiconductor device 100 has a printed circuit board 10. The printed circuit board 10 is made of a material that is, for example, mainly composed of copper. Severa