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DE-102025142895-A1 - SUBSTANT PROCESSING PROCESSES

DE102025142895A1DE 102025142895 A1DE102025142895 A1DE 102025142895A1DE-102025142895-A1

Abstract

Implementations of a process for processing a substrate may include: providing a semiconductor substrate; removing a predetermined thickness of material from the semiconductor substrate around its perimeter; and applying an adhesive to a major flat surface of the semiconductor substrate. The process may also include applying a sealant around the perimeter of the semiconductor substrate and bonding an optically transparent substrate to the semiconductor substrate using the adhesive and sealant.

Inventors

  • Gabrielle Robert

Assignees

  • SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Dates

Publication Date
20260513
Application Date
20251021
Priority Date
20241113

Claims (20)

  1. A method for processing a substrate, comprising: providing a semiconductor substrate; removing a predetermined thickness of material from the semiconductor substrate around its perimeter; applying an adhesive to a major flat surface of the semiconductor substrate; applying a sealant around the perimeter of the semiconductor substrate; and bonding an optically transparent substrate to the semiconductor substrate using the adhesive and the sealant.
  2. Procedure according to Claim 1 , furthermore, including planarizing the sealing material before bonding it to the optically permeable substrate.
  3. Procedure according to Claim 1 , furthermore comprising thinning the semiconductor substrate to a predetermined thickness.
  4. Procedure according to Claim 1 , furthermore, comprising the singulation of the optically transparent substrate and the semiconductor substrate to form a multitude of image sensor packages.
  5. Procedure according to Claim 1 , wherein the semiconductor substrate is circular and the removal of a predetermined material thickness further comprises the removal of a width of 1 mm to 3 mm of material at the circumference of the semiconductor substrate.
  6. Procedure according to Claim 1 , wherein the removal of the predetermined material thickness further includes removal using saws.
  7. Procedure according to Claim 1 , wherein the removal of the predetermined material thickness further includes removal using etching.
  8. Procedure according to Claim 1 , wherein the removal of the predetermined material thickness further includes removal using wet sets.
  9. Procedure according to Claim 1 , wherein the adhesive forms a grid pattern on the largest flat surface of the semiconductor substrate.
  10. A method for processing a substrate, comprising: providing a semiconductor substrate; forming a groove in the semiconductor substrate around a circumference of the semiconductor substrate; applying an adhesive to a major flat surface of the semiconductor substrate; applying a sealing material into the groove; and bonding an optically transparent substrate to the semiconductor substrate using the adhesive and the sealing material.
  11. Procedure according to Claim 10 , furthermore, including planarizing the sealing material before bonding it to the optically permeable substrate.
  12. Procedure according to Claim 10 , furthermore comprising thinning the semiconductor substrate to a predetermined thickness.
  13. Procedure according to Claim 10 , furthermore, comprising the singulation of the optically transparent substrate and the semiconductor substrate to form a multitude of image sensor packages.
  14. Procedure according to Claim 10 , wherein the semiconductor substrate is circular and the groove has a width of 1 mm to 3 mm.
  15. Procedure according to Claim 10 , wherein the adhesive forms a grid pattern on the largest flat surface of the semiconductor substrate.
  16. A method for processing a substrate, comprising: providing a semiconductor substrate; cutting a predetermined gap around a circumference of the semiconductor substrate into a largest flat surface of the semiconductor substrate; applying an adhesive to the largest flat surface of the semiconductor substrate; applying a sealant to the circumference of the semiconductor substrate; and bonding an optically transparent substrate to the semiconductor substrate using the adhesive and the sealant.
  17. Procedure according to Claim 16 , furthermore comprising thinning the semiconductor substrate to a predetermined thickness.
  18. Procedure according to Claim 16 , furthermore, comprising the singulation of the optically transparent substrate and the semiconductor substrate to form a multitude of image sensor packages.
  19. Procedure according to Claim 18 , where the image sensor packages either include an air gap or are gapless image sensor packages.
  20. Procedure according to Claim 16 , wherein the adhesive forms a grid pattern on the largest flat surface of the semiconductor substrate.

Description

BACKGROUND 1. Technical field Aspects of this document relate generally to substrates, such as substrates used for image sensor packages. 2. State of the art Various semiconductor package designs have been developed to facilitate electrical connections to a semiconductor die, a circuit, or another mainboard to which the package is attached. Other semiconductor package designs provide mechanical stability or protection against shock and vibration. Some semiconductor packages are manufactured on a wafer scale, and others are manufactured on a semiconductor die scale. SUMMARY Implementations of a process for processing a substrate may include: providing a semiconductor substrate; removing a predetermined thickness of material from the semiconductor substrate around its perimeter; and applying an adhesive to a major flat surface of the semiconductor substrate. The process may also include applying a sealant around the perimeter of the semiconductor substrate and bonding an optically transparent substrate to the semiconductor substrate using the adhesive and sealant. Implementations of a process for processing a substrate may include one, all, or any of the following: The process may include planarizing the sealing material prior to bonding the optically transparent substrate. The process can include thinning the semiconductor substrate to a predetermined thickness. The process can include singulating the optically transparent substrate and the semiconductor substrate to form a large number of image sensor packages. The semiconductor substrate can be circular, and the removal of a predetermined material thickness can further include the removal of a width of 1 mm to 3 mm of material at the circumference of the semiconductor substrate. Removing the predetermined material thickness may also include removal using saws. Removing the predetermined material thickness may also include removal using etching. Removing the predetermined material thickness may also include removal using wet sets. The adhesive forms a grid pattern on the largest flat surface of the semiconductor substrate. Implementations of a process for processing a substrate may include: providing a semiconductor substrate; forming a groove in the semiconductor substrate around a circumference of the semiconductor substrate; applying an adhesive to a largest flat surface of the semiconductor substrate; applying a sealing material into the groove; and bonding an optically transparent substrate to the semiconductor substrate using the adhesive and the sealing material. Implementations of a process for processing a substrate may include one, all, or any of the following: The process may include planarizing the sealing material prior to bonding the optically transparent substrate. The process can include thinning the semiconductor substrate to a predetermined thickness. The process can include singulating the optically transparent substrate and the semiconductor substrate to form a large number of image sensor packages. The semiconductor substrate can be circular and the groove can have a width of 1 mm to 3 mm. The adhesive can form a grid pattern on the largest flat surface of the semiconductor substrate. Implementations of a process for processing a substrate may include: providing a semiconductor substrate; cutting a predetermined gap around a circumference of the semiconductor substrate into a largest flat surface of the semiconductor substrate; applying an adhesive to the largest flat surface of the semiconductor substrate; applying a sealant to the circumference of the semiconductor substrate; and bonding an optically transparent substrate to the semiconductor substrate. conductor substrate using the adhesive and the sealing material. Implementations of a process for processing a substrate may include one, all, or any of the following: The process can include thinning the semiconductor substrate to a predetermined thickness. The process can include singulating the optically transparent substrate and the semiconductor substrate to form a large number of image sensor packages. The image sensor packages can either include an air gap or be gapless image sensor packages. The adhesive can form a grid pattern on the largest flat surface of the semiconductor substrate. The foregoing and other aspects, features and advantages will be evident to professionals from the DESCRIPTION and DRAWINGS as well as from the CLAIMS. BRIEF DESCRIPTION OF THE DRAWINGS The following describes implementations in conjunction with the accompanying drawings, where identical reference symbols denote similar elements and where: 1 a lateral flow cross-sectional view of an implementation of a semiconductor substrate and an optically transparent substrate during a bonding process; 2 a top view of the semiconductor substrate and the optically transparent substrate of 1 during the course of 1 is; 3 A cross-sectional detail view of the edge of the semiconductor substrate and the edge of th