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DE-102025146545-A1 - COLD CONSTRUCTION GROUP INCLUDING MECHANICAL REINFORCEMENT TO PREVENT OBSTRUCTION

DE102025146545A1DE 102025146545 A1DE102025146545 A1DE 102025146545A1DE-102025146545-A1

Abstract

A cooling assembly is provided for dissipating heat generated by a semiconductor device. The assembly includes a cooler with a housing and a cover plate that define an internal fluid channel. The cooler incorporates at least one reinforcement structure, the structure being composed of a reinforcement material different from the material of the cover plate or the housing. The reinforced architecture increases the structural stiffness of the cooler to mitigate warping and the risk of die cracking or delamination.

Inventors

  • Seungwon Im

Assignees

  • SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Dates

Publication Date
20260513
Application Date
20251111
Priority Date
20251106

Claims (20)

  1. A device comprising: a cooler including: a housing; a cover plate joined to the housing, wherein the cover plate and the housing define a fluid channel; a fluid inlet port providing a fluid path into the fluid channel; and a fluid outlet port providing a fluid path out of the fluid channel; and a reinforcement structure arranged within the cooler, wherein the reinforcement structure is composed of a reinforcement material different from a material of the cover plate and the housing.
  2. establishment according Claim 1 , where the reinforcing material is ceramic.
  3. establishment according Claim 1 , with the reinforcement structure embedded in the housing.
  4. establishment according Claim 3 , wherein the housing includes a groove, the reinforcement structure is arranged in the groove, and the housing includes a seal that is arranged over the reinforcement structure and seals the fluid channel.
  5. establishment according Claim 1 , with the reinforcement structure embedded in the top plate.
  6. establishment according Claim 5 , wherein the cover plate includes: a base with a recessed area, wherein the reinforcement structure is arranged in the recessed area; and a cover arranged over the reinforcement structure.
  7. establishment according Claim 1 , wherein the reinforcement structure is a first reinforcement structure, wherein the device includes the first reinforcement structure embedded in the housing and a second reinforcement structure embedded in the cover plate.
  8. establishment according Claim 1 , further comprising a semiconductor device connected to the cover plate.
  9. establishment according Claim 8 , wherein the semiconductor device includes a silicon carbide die.
  10. A device comprising: a cooler, wherein the cooler includes a reinforcement structure arranged within the cooler, the reinforcement structure being composed of a reinforcement material different from a material of the cooler; and a power module connected to the cooler.
  11. establishment according Claim 10 , wherein the power module is a first power module and the setup includes a second power module and a third power module connected to the cooler.
  12. establishment according Claim 11 , wherein each of the first power module, the second power module and the third power module are configured to provide an output corresponding to one phase of a three-phase electrical output.
  13. establishment according Claim 10 , wherein the power module includes a first transistor die corresponding to a high side of a half-bridge circuit and a second transistor die corresponding to a low side of the half-bridge circuit.
  14. establishment according Claim 10 , wherein the cooler includes: an upper section; and a lower section joined to the upper section, wherein the upper section and the lower section define a fluid channel, wherein the reinforcement structure is embedded in at least one of the upper section and the lower section.
  15. establishment according Claim 14 , wherein the reinforcement structure is a first reinforcement structure, wherein the setup includes the first reinforcement structure embedded in the upper section and a second reinforcement structure embedded in the lower section.
  16. establishment according Claim 10 , wherein the reinforcement structure is composed of a ceramic material.
  17. A method comprising: arranging a reinforcement structure in at least one of a cover plate or a housing, wherein the reinforcement structure is composed of a reinforcement material that is different from a material of at least one of the cover plate and the housing; and joining the cover plate with the housing to form a cooler, wherein the cover plate and the housing define a fluid channel, the cooler including a fluid inlet port providing a fluid path into the fluid channel and a fluid outlet port providing a fluid path out of the fluid channel.
  18. Procedure according to Claim 17 , wherein the arrangement of the reinforcement structure in at least one of a cover plate and a housing includes embedding the reinforcement structure in the housing.
  19. Procedure according to Claim 17 , wherein the arrangement of the reinforcement structure in at least one of a cover plate and a housing includes embedding the reinforcement structure in the cover plate.
  20. Procedure according to Claim 17 , wherein the reinforcement material is ceramic and the material of at least one of the housing and the cover plate is aluminium.

Description

CROSS-REFERENCE TO RELATED REGISTRATIONS This registration takes advantage of the preliminary US Application No. 63/719,354 , filed on November 12, 2024, claim, which is hereby incorporated by reference in its entirety. TECHNICAL AREA This description refers to semiconductor package assemblies and, in particular, to a cooling assembly including mechanical reinforcement to prevent warping. BACKGROUND Semiconductor package assemblies (e.g., power modules for semiconductor devices) can enclose substrates connected to heat dissipation mechanisms (e.g., heat sinks, water jackets, etc.). Mechanical stresses from thermal cycling can weaken the bond between the semiconductor package assemblies and the heat sink, leading to poor cooling performance and even detachment. SUMMARY In general terms, a device includes a cooler. The cooler includes a housing and a cover plate joined to the housing, the cover plate and housing defining a fluid channel. The cooler also includes a fluid inlet port providing a fluid path into the fluid channel and a fluid outlet port providing a fluid path out of the fluid channel. The device further includes a reinforcing structure located within the cooler, the reinforcing structure being composed of a reinforcing material different from the material of the cover plate and housing. In some aspects, the reinforcement material is a ceramic. In some aspects, the reinforcement structure is embedded in the housing. In some aspects where the reinforcement structure is embedded in the housing, the housing includes a groove in which the reinforcement structure is located. The housing also includes a gasket located above the reinforcement structure within the groove, sealing the fluid channel. In some aspects, the reinforcement structure is embedded in the cover plate. In some aspects where the reinforcement structure is embedded in the cover plate, the cover plate includes a base with a recessed area in which the reinforcement structure is located, as well as a cover located above the reinforcement structure. In some aspects, the reinforcement structure is a first reinforcement structure embedded in the housing, and the setup includes a second reinforcement structure embedded in the cover plate. In some aspects, the setup further includes a semiconductor device associated with the cover plate. In some aspects, the semiconductor device includes a silicon carbide die. In another general aspect, a device includes a heat sink with a reinforcement structure located within the heat sink. The reinforcement structure is composed of a reinforcement material different from the heat sink material. The device also includes a power module connected to the heat sink. In some aspects, the power module is a first power module, and the device includes a second and a third power module connected to the heat sink. In some aspects, each of the first, second, and third power modules is configured to provide an output corresponding to one phase of a three-phase electrical output. In some aspects, the power module includes a first transistor die corresponding to a high side of a half-bridge circuit and a second transistor die corresponding to a low side of the half-bridge circuit. In some aspects, the cooler includes an upper section and a lower section joined to the upper section, with the upper and lower sections defining a fluid channel. The reinforcement structure is embedded in at least one of the upper and lower sections. In some aspects, the reinforcement structure is a first reinforcement structure embedded in the upper section, and the device includes a second reinforcement structure embedded in the lower section. In some aspects, the reinforcement structure is composed of a ceramic material. In another general aspect, a method includes arranging a reinforcement structure in at least one of the cover plates and housings of a cooler. The reinforcement structure is composed of a reinforcing material that is derived from a material The method differs from at least one aspect of the cover plate and the housing. It also includes joining the cover plate to the housing to form a cooler, wherein the cover plate and the housing define a fluid channel. The cooler includes a fluid inlet port providing a fluid path into the fluid channel and a fluid outlet port providing a fluid path out of the fluid channel. In some aspects of the process, arranging the reinforcement structure in at least one of a cover plate and a housing involves embedding the reinforcement structure in the housing. In some aspects of the process, the reinforcement material is a ceramic, and the material of at least one of the housing and the cover plate is aluminum. In some aspects of the process, joining the cover plate to the housing involves friction stir welding. The details of one or more implementations are set out in the accompanying drawings and the description below. Other features will become apparent from the description, the drawings, and the