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DE-112016002059-B4 - Computing device that uses a bypass unit

DE112016002059B4DE 112016002059 B4DE112016002059 B4DE 112016002059B4DE-112016002059-B4

Abstract

Computing device, comprising: an enclosure with a first wall; a chip package, including a chip electrically connected to a first signal PCB connector; a first connector which is carried near the first wall, the first connector including a cage and a housing with an interface, the housing carrying a first pair of terminals, each terminal of the first pair of terminals having a contact in the interface, the first connector being carried above a printed circuit board; a first cable with a pair of conductors, the cable including a first end and a second end, wherein a first end of the cable is terminated to the first pair of terminals; a first PCB connector, wherein the first PCB connector terminates at the second end of the first cable and is designed to be connected to the first signal PCB connector; and a component circuit that provides power to the chip.

Inventors

  • Bruce Reed
  • Brian Keith Lloyd
  • Gregory FITZGERALD

Assignees

  • MOLEX, LLC

Dates

Publication Date
20260513
Application Date
20160504
Priority Date
20150504

Claims (20)

  1. Computing device comprising: a casing with a first wall; a chip package, including a chip electrically connected to a first signal PCB connector; a first connector carried near the first wall, the first connector including a cage and a housing with an interface, the housing carrying a first pair of terminals, each terminal of the first pair having a contact in the interface, the first connector being carried above a printed circuit board; a first cable with a pair of conductors, the cable including a first end and a second end, the first end of the cable being terminated to the first pair of terminals; a first PCB connector, the first PCB connector being terminated to the second end of the first cable and being configured to connect to the first signal PCB connector; and a component circuit providing power to the chip.
  2. Computing device according to Claim 1 , wherein the chip is carried by a signal circuit board and the first signal circuit board connector is attached to the signal circuit board.
  3. Computing device according to Claim 2 , wherein the enclosure includes a second wall, the computing device including a second connector which is carried near the second wall, the second connector being terminated to a first end of a second cable, the second cable having a second end which is terminated to a second printed circuit board connector, the signal circuit board carrying a second signal circuit board connector which is electrically connected to the chip, the second circuit board connector being designed to be connected to the second signal circuit board connector.
  4. Computing device according to Claim 2 , wherein the component circuit is connected to the signal circuit board via a cable unit.
  5. Computing device according to Claim 1 , wherein the chip package encloses a substrate that supports the chip.
  6. Computing device according to Claim 5 , wherein the substrate is supported by a signal circuit board, the signal circuit board not extending to the first connector.
  7. Computing device according to Claim 6 , wherein the first connector is supported by a net, the net being supported cantilevered from the first wall.
  8. Computing device according to Claim 1 , wherein the chip is electrically connected to a plurality of signal PCB connectors and each of the plurality of signal PCB connectors is connected to a different first connector via a corresponding PCB connector.
  9. Connector system comprising: a first connector, including a cage and a housing supported by the cage, the housing enclosing a card slot with a plurality of terminals arranged on two sides of the card slot, the plurality of terminals each including contacts extending into the card slot and the end sections, the cage opening being oriented in a vertical arrangement; a plurality of cables, each of the cables having a first end and a second end, the first ends being terminated to the end sections; a first printed circuit board connector that terminates to the second ends of the plurality of cables; a signal printed circuit board carrying a chip, the signal printed circuit board having conductor tracks that are connected to the chip; and a signal printed circuit board connector that is attached to the signal printed circuit board, the signal printed circuit board connector including terminals that are electrically connected to the conductor tracks, the signal printed circuit board connector being designed to be connected to the first printed circuit board connector.
  10. Connector system according to Claim 9 , wherein the signal board connector is a first signal board connector and a second signal board connector is attached to the signal board, the first and second signal board connectors being arranged on two sides of the chip.
  11. Connector system according to Claim 9 , wherein the signal board connector is one of a plurality of signal board connectors and is attached to at least one of the plurality of signal board connectors on all four sides of the chip.
  12. Connector system according to Claim 9 , where the insertion loss in the signal circuit board is less than 2 dB when operating at 15 GHz.
  13. Connector system according to Claim 9 , where the insertion loss in the signal circuit board is less than 1 dB when operating at 15 GHz.
  14. Connector system according to Claim 9 , where the insertion loss between the chip and the signal PCB connector is less than 2 dB when operating at 15 GHz.
  15. Connector system according to Claim 9 , wherein the multitude of signal board connectors are arranged on a multitude of sides of the chip package.
  16. Connector system according to Claim 15 , with the multitude of signal board connectors arranged on four sides of the chip package.
  17. Connector system according to Claim 9 , further comprising a heat transfer section arranged on the cage, the heat transfer section including a tubular heat sink designed to conduct heat energy from the interior of the cage to a location on the rear of the cage.
  18. Connector system according to Claim 9 , further comprising a heat transfer section arranged in the cage, the heat transfer section including a tubular heat sink designed to conduct heat energy from the interior of the cage to a location on the rear of the cage.
  19. Connector system according to Claim 18 , wherein in the heat transfer section a plurality of fins are arranged on the rear of the cage, the plurality of fins being designed to act as a heat sink.
  20. Computing device comprising: a casing with a first wall; a chip package, including a chip electrically connected to a plurality of signal PCB connectors; a plurality of first connectors carried near the first wall, each of the first connectors including a cage and a housing with an interface, each housing carrying a first terminal pair, each terminal of the first terminal pair having a contact in the interface; a plurality of cables, each cable having a pair of conductors and a first end and a second end, the first end of each cable being terminated to a respective first terminal pair; a plurality of PCB connectors, the PCB connectors being terminated to the second ends of the plurality of cables and being configured to be connected to first signal PCB connectors, the plurality of signal PCB connectors being arranged on at least two sides of the chip package.

Description

TECHNICAL AREA This disclosure concerns the field of high-frequency signal transmission, more precisely computing systems arranged in a housing. DESCRIPTION OF RELATED TECHNOLOGY Computing devices such as routers, servers, switches, and the like must operate at high data transmission speeds to meet the increasing demand for bandwidth and to provide audio and video streaming in many end-user devices. These devices include a housing that supports a printed circuit board (PCB), which in turn carries various circuits. They utilize signal transmission lines that run between a primary chip element, such as an application-specific integrated circuit (ASIC), a user-programmable gate array (FPGA), a digital signal processor (DSP), etc., mounted on the PCB, and connectors mounted on the PCB. These transmission lines are formed as conductive traces on or within the PCB and run between the chip elements and external connectors or circuits of the device. In the patent US 8,672,707 B2 A connector arrangement for aligning communication connectors during a connection process is described. The connector arrangement comprises a communication connector, a plate connector, and a flexible cable arrangement with communication cables that couple the plate connector and the communication connector. In the patent US 8,747,158 B2 An electrical connector is described comprising a housing, contact modules arranged in the housing, grounding plates and a conductive elastomeric material, wherein the conductive elastomeric material extends between the contact modules and electrically connects the grounding plates to each other. In the patent US 8,804,342 B2 Communication modules are described comprising a printed circuit board, a support wall, an electrical connector with an array of electrical contacts, a plate connection and a flexible cable arrangement that is connected on one end to the array of electrical contacts and on the other end to the plate connection. It goes without saying that the integrated circuits (often called chips) are the core component of these electronic devices. These chips typically include a processor, and this processor has a die connected to a substrate (its package) by conductive solder points. The package may include microvias, or through-holes, that extend through the substrate to solder pads. These solder pads may include a ball-and-socket array that bonds the package to the printed circuit board. The printed circuit board includes numerous traces that define specific transmission lines, including differential signal pairs, ground paths associated with the differential signal pairs, and a variety of low-speed transmission lines for power, clock signals, and other functions. These conductor tracks run from the ASIC to the device's I/O connectors, to which external connectors are attached, and others run from the ASIC to backplane connectors that allow the device to be connected to a complete system such as a network server or the like, or still others run from the ASIC to components and circuits on the main board or another circuit board of the device. Typical printed circuit boards (PCBs) are usually made from a low-cost material known as FR4. Although inexpensive, FR4 is known to be lossy in high-speed signal transmission lines carrying data at speeds of approximately 6 Gbit/s and above (e.g., signal transmission frequencies above 3 GHz). These losses increase with increasing frequency, making FR4 undesirable for high-speed data transmission applications with signal transmission frequencies of approximately 10 GHz and above. To use FR4 as a PCB material for high-frequency signal transmission lines, a designer may need to use amplifiers and equalizers, which increase the final cost of the device. The total length of signal transmission traces on FR4 printed circuit boards can exceed threshold lengths, approximately 25 cm (about 10 inches), and may include bends and turns, which can lead to problems with signal reflections, noise, and additional losses. As mentioned above, losses can sometimes be corrected by using amplifiers, intermediate amplifiers, and equalizers, but these elements also increase the manufacturing cost of the final circuit board and further complicate the board layout. Additionally, routing signal transmission traces on the circuit board may require multiple turns and/or transitions. These turns Transitions and terminations that occur at termination points along signal transmission lines tend to reduce the signal-to-noise ratio. Furthermore, transitions and terminations tend to create impedance discontinuities that cause signal reflections, making it difficult to address the signal-to-noise ratio problem simply by increasing transmission power. This makes the use of printed circuit boards, especially when using FR4, but also more expensive materials, increasingly challenging for long-distance signal transmission as data rates increase. Consequently, some would welcome further improvement