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DE-112021006817-B4 - SEMICONDUCTOR COMPONENT

DE112021006817B4DE 112021006817 B4DE112021006817 B4DE 112021006817B4DE-112021006817-B4

Abstract

Semiconductor component (A10) which features the following: a plurality of first connections (10), each having a first front surface (101) facing a first side in a thickness direction (z) and extending in a first direction (x) orthogonal to the thickness direction (z); a semiconductor element (30) having a plurality of first electrodes (33) connected to the first front surfaces (101) of the plurality of first terminals (10); and a sealing resin (40) that covers the plurality of first connections (10) and the semiconductor element (30); and at least one second terminal (20) having a second front surface (201) extending in the first direction (x), wherein the sealing resin (40) has a resin underside (42) which is located on a side opposite the semiconductor element (30) with respect to the plurality of first connections (10) in the thickness direction (z), the multitude of first connections (10) are spaced apart from each other in a second direction (y) orthogonally to the thickness direction (z) and to the first direction (x), Each of the plurality of first connections (10) has a first back surface (102), a second back surface (103) and a first recessed surface (104) which point away from the first front surface (101) of the first connection (10) in the thickness direction (z), wherein the first back surface (102) and the second back surface (103) are spaced apart from each other in the first direction (x) with the first recessed surface (104) in between, the first back surface (102) and the second back surface (103) are exposed on the resin underside (42) and the first recessed surface (104) is covered with the sealing resin (40), at least part of the second terminal (20) is covered with the sealing resin (40), the semiconductor element (30) has a plurality of second electrodes (34) which are connected to the second front surface (201), the second connection (20) has a third back surface (202), a second recessed surface (203) and a third recessed surface (204) pointing away from the second front surface (201) in the thickness direction (z), the third back surface (202) is exposed on the resin underside (42), and the second recessed surface (203) and the third recessed surface (204) with the third back surface (202) in between are spaced apart from each other in the first direction (x) and are covered with the sealing resin (40).

Inventors

  • Kenji Fujii
  • Taro Nishioka
  • Shinya Hikita

Assignees

  • ROHM CO., LTD.

Dates

Publication Date
20260513
Application Date
20211222
Priority Date
20210115

Claims (15)

  1. A semiconductor component (A10) comprising: a plurality of first terminals (10), each having a first front surface (101) facing a first side in a thickness direction (z) and extending in a first direction (x) orthogonal to the thickness direction (z); a semiconductor element (30) comprising a plurality of first electrodes (33) connected to the first front surfaces (101) of the plurality of first terminals (10); and a sealing resin (40) covering the plurality of first terminals (10) and the semiconductor element (30); and at least one second terminal (20) having a second front surface (201) extending in the first direction (x), wherein the sealing resin (40) has a resin underside (42) located on a side opposite the semiconductor element (30) with respect to the plurality of first terminals (10) in the thickness direction (z), the plurality of first terminals (10) being spaced apart from each other in a second direction (y) orthogonally to the thickness direction (z) and to the first direction (x), each of the plurality of first terminals (10) having a first back surface (102), a second back surface (103), and a first recessed surface (104) extending away from the first front surface (101) of the first terminal (10) in the thickness direction (z), wherein the first back surface (102) and the second back surface (103) with the first recessed surface (104) between them in the first direction (x) are spaced apart, the first back surface (102) and the second back surface (103) are exposed on the resin underside (42), and the first recessed surface (104) is covered with the sealing resin (40), at least part of the second terminal (20) is covered with the sealing resin (40), the semiconductor element (30) has a plurality of second electrodes (34) connected to the second front surface (201), the second terminal (20) has a third back surface (202), a second recessed surface (203), and a third recessed surface (204) pointing away from the second front surface (201) in the thickness direction (z), the third back surface (202) is exposed on the resin underside (42), and the second recessed surface (203) and the third recessed surface (204) are connected to the third back surface (202). between them in the first direction (x) are spaced apart from each other and are covered with the sealing resin (40).
  2. Semiconductor component (A10) according to Claim 1 , wherein the plurality of first terminals (10) has two adjacent first terminals (10) flanking the second terminal (20) in the second direction (y).
  3. Semiconductor component (A10) according to Claim 2 , wherein the at least one second terminal has a plurality of second terminals (20) spaced apart from each other in the second direction (y), and the plurality of first terminals (10) and the plurality of second terminals (20) are arranged alternately in the second direction (y).
  4. Semiconductor component (A10) according to Claim 3 , wherein each of the plurality of first terminals (10) has a first terminal section (11) and a second terminal section (12), the first terminal section (11) forming part of the first front surface (101) and the first rear surface (102) of the first terminal (10), the second terminal section (12) forming part of the first front surface (101) and the second rear surface (103) of the first terminal (10), and each of the plurality of second terminals (20) has a third terminal section (21) forming part of the second front surface (201) and the third rear surface (202) of the second terminal (20).
  5. Semiconductor component (A10) according to Claim 4 , wherein the third terminal section (21) of each of the plurality of second terminals (20) does not overlap with either the first terminal section (11) or the second terminal section (12) of each of the plurality of first terminals (10) when viewed in the second direction (y).
  6. Semiconductor component (A10) according to Claim 5 , wherein at least one of the plurality of second electrodes (34) overlaps with the third terminal section (21) of each of the plurality of second terminals (20) seen in the thickness direction (z).
  7. Semiconductor component (A10) according to Claim 6 , wherein each of the plurality of second connections (20) has a projecting section (24) projecting from the third terminal section (21) of the second connection (20) in the second direction (y), the projecting section (24) forming part of the second front surface (201) and a fourth recessed surface (205) facing away from the second front surface (201) of the second connection (20), the fourth recessed surface (205) being covered with the sealing resin (40).
  8. Semiconductor component (A10) according to one of the Claims 5 until 7 , wherein each of the plurality of first terminals (10) has a first main section (13) which forms part of the first front surface (101) and the first recessed surface (104) of the first terminal (10) and overlaps with the first recessed surface (104) seen in the thickness direction (z), and in each of the first terminals (10) a dimension (L1, L2) of both the first terminal section (11) and the second terminal section (12) in the second direction (y) is larger than a dimension (L3) of the first main section (13) in the second direction (y).
  9. Semiconductor component (A10) according to one of the Claims 3 until 8 , wherein each of the plurality of first connections (10) has a first end face (105) and a second end face (106), wherein the first end face (105) is connected to the first front face (101) and the first rear face (102) of the first connection (10) and faces a first side in the first direction (x), wherein the second end face (106) is connected to the first front face (101) and the second rear face (103) and faces a second side in the first direction (x), each of the plurality of second connections (20) has a third end face (206) and a fourth end face (207), wherein the third end face (206) is connected to the second front face (201) and the second recessed face (203) of the second connection (20) and faces the first side in the first direction (x), the fourth end face (207) is connected to the second front face (201) and the third recessed surface (204) is connected and faces the second side in the first direction (x), the sealing resin (40) has a first resin side surface (431) and a second resin side surface (432) which are connected to the resin underside (42), are spaced apart from each other in the first direction (x) and face the first side and the second side respectively in the first direction (x), and the first end surface (105) and the third end surface (206) are exposed at the first resin side surface (431) to be flush with the first resin side surface (431), and the second end surface (106) and the fourth end surface (207) are exposed at the second resin side surface (432) to be flush with the second resin side surface (432).
  10. Semiconductor component (A10) according to Claim 9 , further comprising a plurality of third terminals (25), each having a third front surface (251) and a fourth back surface (252) pointing away from each other in the thickness direction (z) and arranged on the first side of the plurality of first terminals (10) in the second direction (y), wherein at least a part of each of the plurality of third terminals (25) is covered with the sealing resin (40), and the semiconductor element (30) comprising a plurality of third electrodes (35), wherein at least one of the plurality of third electrodes (35) is connected to the third front surface (251) of each of the plurality of third terminals (25).
  11. Semiconductor component (A10) according to Claim 10 , wherein each of the plurality of third connections (25) has a fifth end face (253) which is connected to the third front face (251) and the fourth rear face (252) of the third connection (25) and faces the first side in the second direction (y), the sealing resin (40) has a third resin side face (433) and a fourth resin side face (434) which are connected to the resin underside (42), the first resin side face (431) and the second resin side face (432) and are spaced apart from each other in the second direction (y), the fourth rear face (252) of each of the plurality of third connections (25) is exposed at the resin underside (42), and the fifth end face (253) of each of the plurality of third connections (25) is exposed at the third resin side face (433) to connect with the third resin side face (433) to be concise.
  12. Semiconductor component (A10) according to Claim 11 , further comprising a fourth terminal (27) having a fourth front surface (271) and a fifth back surface (272) which point away from each other in the thickness direction (z) and are arranged on the second side of the plurality of first terminals (10) in the second direction (y), wherein at least part of the fourth terminal (27) is covered with the sealing resin (40), the fifth back surface (272) is exposed on the resin underside (42), and the semiconductor element (30) has a plurality of fourth electrodes (36) which are connected to the fourth front surface (271).
  13. Semiconductor device (A10) according to Claim 12 , wherein the fourth terminal (27) has a fourth main section (28) and a plurality of fourth terminal sections (29), the fourth main section (28) forming part of the fourth front surface (271) and a fifth recessed surface (273) that faces away from the fourth front surface (271) and extends in the first direction (x), the plurality of fourth terminal sections (29) being spaced apart in the first direction (x), each of the plurality of fourth terminal sections (29) projecting from the fourth main section (28) towards the second side in the second direction (y) and forming part of the fourth front surface (271) and a part of the fifth back surface (272), the fifth recessed surface (273) is covered with the sealing resin (40), each of the plurality of fourth terminal sections (29) has a sixth end surface (274) which is connected to the fourth front surface (271) and the fifth back surface (272) and faces the second side in the second direction (y), and the sixth end surface (274) of each of the plurality of fourth terminal sections (29) is exposed at the fourth resin side surface (434) to be flush with the fourth resin side surface (434).
  14. Semiconductor component (A10) according to Claim 12 or 13 , wherein the semiconductor device (A10) comprises a semiconductor substrate (31) and a semiconductor layer (32) laminated onto the semiconductor substrate (31), wherein the semiconductor layer (32) comprises a circuit (321) and a control circuit (322) which is electrically connected to the circuit (321), and the plurality of first electrodes (33), the plurality of second electrodes (34) and the plurality of fourth electrodes (36) are electrically connected to the circuit (321), and the plurality of third electrodes (35) are electrically connected to the control circuit (322).
  15. Semiconductor component (A10) according to Claim 14 , wherein the plurality of first terminals (10) and fourth terminal (27) are input terminals receiving DC power to be converted, and the plurality of second terminals (20) are output terminals delivering AC power converted by the circuit (321).

Description

TECHNICAL AREA The present disclosure relates to a semiconductor component. GENERAL STATE OF THE ART A QFN (Quad For Non-Lead Package) is known as a package type for a semiconductor device. Patent document 1 discloses an example of such a QFN-type semiconductor device. The disclosed semiconductor device has a plurality of connections, and the front or end face of each connection is exposed so that it is flush with the side surface of the sealing resin (package). The rear surface of each connection is exposed so that it is flush with the underside of the sealing resin. With such a design, the semiconductor device can be made compact, and the mounting area on a printed circuit board is reduced compared to a QFP (Quad Flat Package) type, in which the connections protrude from the side surface of the sealing resin. In the semiconductor component disclosed in patent document 1, the terminals support the semiconductor element. As in 4 As shown in the patent document, the back surface 102 of each terminal 10 is extended in the x-direction and located directly beneath the semiconductor element. Therefore, the heat generated by the semiconductor element is concentrated through the terminals 10 into the area directly below the semiconductor element and dissipated through this area. This can lead to uneven heat dissipation from the semiconductor device. The back surfaces 102 of the terminals 10 are arranged adjacent to each other in the y-direction. When such a semiconductor device is mounted on a printed circuit board, uneven electrical conductivity can occur between adjacent back surfaces 102 (i.e., terminals 10). To avoid such failure, a large distance must be provided between adjacent back surfaces 102. This hinders the miniaturization of the semiconductor devices. Patent document 2 discloses a semiconductor component comprising a plurality of first terminals, a semiconductor element and a sealing resin; each of the plurality of first terminals has a first and a second back surface spaced apart from each other, with a recessed surface arranged between them, and the two back surfaces are free from the sealing resin, and the recessed surface is covered with the sealing resin. DOCUMENTS ON THE STATE OF THE TECHNOLOGY Patent document Patent document 1: JP 2020 - 77 694 APatent document 2: US 2019 / 0 162 745 A1 BRIEF SUMMARY OF THE INVENTION Problem that the invention is intended to solve In view of the above circumstances, it is an objective of the present disclosure to provide a semiconductor component suitable for achieving uniform heat dissipation and improving the reliability of the assembly. Means to solve the problem The semiconductor device provided according to the present disclosure comprises: a plurality of first terminals, each having a first front surface facing a first side in a thickness direction and extending orthogonally to the thickness direction in a first direction; a semiconductor element having a plurality of first electrodes connected to the first front surfaces of the plurality of first terminals; and a sealing resin covering the plurality of first terminals and the semiconductor element. At least one second terminal, having a second front surface, extends in the first direction. The sealing resin has a resin underside located on the opposite side of the semiconductor element with respect to the plurality of first terminals in the thickness direction. The plurality of first terminals are spaced apart from each other in a second direction orthogonally to both the thickness direction and the first direction. Each of the plurality of first terminals has a first back surface, a second back surface, and a first recessed or recessed surface facing away from the first front surface of the first terminal in the thickness direction. The first back surface and the second back surface are spaced apart in the first direction by the first recessed surface between them and are exposed on the resin underside. The first recessed surface is covered with the sealing resin. Furthermore, at least part of the second terminal is covered with the sealing resin, and the semiconductor element has a plurality of second electrodes connected to the second front surface. The second terminal has a third back surface, a second recessed surface, and a third recessed surface, which point away from the second front surface in the thickness direction. The third back surface is exposed on the resin underside, and the second The recessed surface and the third recessed surface are spaced apart from each other in the first direction with the third back surface in between and are covered with the sealing resin. Advantages of the invention According to the above design, the semiconductor component has improved heat dissipation and can be properly mounted. Further features and advantages of the present disclosure will become apparent from the detailed description set forth below with reference to the accompanying drawings. BRIEF DESCR