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DE-112024003081-T5 - IMAGE SENSOR WITH A CURVED SENSOR CHIP AND METHOD FOR MANUFACTURING THE IMAGE SENSOR

DE112024003081T5DE 112024003081 T5DE112024003081 T5DE 112024003081T5DE-112024003081-T5

Abstract

An image sensor (10) comprises a carrier (100) with a curved surface region (101), wherein an opening (105) extends from the curved surface region (101) to a second main surface (102) of the carrier (100). The image sensor (10) further comprises a curved sensor chip (110) arranged in the curved surface region (101), wherein a second main surface (112) of the curved sensor chip (110) adjoins the curved surface region (101), and an electrical contact element (107) arranged in the opening (105) and extending from the curved surface region (101) to the second main surface (102) of the carrier (100).

Inventors

  • Alexandre De Kerckhove
  • Andrew Garland

Assignees

  • ams Sensors Belgium BV

Dates

Publication Date
20260513
Application Date
20240719
Priority Date
20230725

Claims (14)

  1. Image sensor (10), comprising: a carrier (100) with a curved surface region (101), wherein an opening (105) extends from the curved surface region (101) to a second main surface (102) of the carrier (100); a curved sensor chip (110) arranged in the curved surface region (101), wherein a second main surface (112) of the curved sensor chip (110) adjoins the curved surface region (101); and an electrical contact element (107) arranged in the opening (105) and extending from the curved surface region (101) to the second main surface (102) of the carrier (100).
  2. Image sensor (10) after Claim 1 , wherein the curved surface area (101) is formed in a first main surface (103) of the support (100) opposite the second main surface (102) of the support (100).
  3. Image sensor (10) after Claim 1 or 2 , further comprising a contact opening (114) formed in the second main surface (112) of the curved sensor chip (110).
  4. Image sensor (10) after Claim 3 , wherein the contact opening (114) is arranged adjacent to the opening (105) which is arranged in the carrier (100).
  5. Image sensor (10) according to one of the preceding claims, further comprising an anisotropic conductive film (116) between the carrier (100) and the curved sensor chip (110).
  6. Image sensor (10) according to one of the preceding claims, further comprising an anisotropic conductive paste (117) between the carrier (100) and the curved sensor chip (110).
  7. Image sensor (10) according to one of the preceding claims, further comprising a solder ball (118) between the carrier (100) and the curved sensor chip (110).
  8. Image sensor (10) according to one of the preceding claims, further comprising a lens (120) over the first main surface (111) of the curved sensor chip (110).
  9. Method for manufacturing an image sensor (10), comprising: forming (S100) a curved surface region (101) in a first main surface (103) of a carrier (100), forming (S110) an opening (105) extending from the curved surface region (101) to a second main surface (102) of the carrier (100), forming (S120) an electrical contact element (107) in the opening (105), wherein the electrical contact element (107) extends from the curved surface region (101) to the second main surface (102) of the carrier (100). surface (102) of the carrier (100), arranging (S130) a flat sensor chip (125) in the curved surface area (101), and applying (S140) pressure and heat so that a second main surface (112) of the curved sensor chip (110) adjoins the curved surface area (101).
  10. Procedure according to Claim 9 , further comprising the application of an anisotropic conductive film (116) in the curved surface area (101) after forming the electrical contact element (107) and prior to arranging the flat sensor chip (125) in the curved surface area (101).
  11. Procedure according to Claim 9 , further comprising the application of an anisotropic conductive paste (117) in the curved surface area (101) after forming the electrical contact element (107) and prior to arranging the flat sensor chip (125) in the curved surface area (101).
  12. Procedure according to Claim 9 , further comprising placing solder balls (118) in the curved surface area (101) after forming the electrical contact element (107) and before arranging the flat sensor chip (125) in the curved surface area (101).
  13. Procedure according to one of the Claims 9 until 12 , further comprising thinning the flat sensor chip (125) to a thickness of less than 100 µm before arranging the flat sensor chip (125) in the curved surface area (101).
  14. Procedure according to one of the Claims 9 until 13 , further comprising forming a contact opening (114) in the second main surface (112) of the flat sensor chip (125) prior to arranging the flat sensor chip (125) in the curved surface area (101).

Description

The present disclosure relates to an image sensor with a curved sensor chip and a method for manufacturing the image sensor. Image sensors used, for example, in imaging devices such as cameras, mobile phone cameras, consumer electronics cameras, surveillance video cameras, or automotive driver assistance systems, typically receive electromagnetic radiation with a curved wavefront. Therefore, efforts are being made to provide an image sensor with a curved semiconductor sensor chip. In general, the aim is to provide an improved image sensor and an improved method for manufacturing an image sensor. SUMMARY An image sensor comprises a substrate with a curved surface region. An opening extends from the curved surface region to a second main surface of the substrate. The image sensor further comprises a curved sensor chip arranged within the curved surface region, with a second main surface of the curved sensor chip adjacent to the curved surface region. The image sensor further comprises an electrical contact element arranged in the opening and extending from the curved surface region to the second main surface of the sensor chip. For example, the curved surface area is formed in a first main surface of the support opposite the second main surface of the support. According to embodiments, the image sensor further comprises a contact opening formed in the second main surface of the curved sensor chip. The contact opening can be located adjacent to the opening that is located in the carrier. The image sensor can further comprise an anisotropic conductive film between the substrate and the curved sensor chip. According to further embodiments, the image sensor also comprises an anisotropic conductive paste or a solder ball between the carrier and the curved sensor chip. The image sensor may also include a lens over the first main surface of the curved sensor chip. According to embodiments, a method for manufacturing an image sensor comprises forming a curved surface section in a first main surface of a carrier and forming an opening extending from the curved surface section to a second main surface of the carrier. The method further comprises forming an electrical contact element in the opening, the electrical contact element extending from the curved surface section to the second main surface of the carrier. The method further comprises arranging a flat sensor chip in the curved surface area and applying pressure and heat such that a second main surface of the curved sensor chip adjoins the curved surface area. The method may further include the application of an anisotropic conductive film in the curved surface area after forming the electrical contact element and before arranging the flat sensor chip in the curved surface area. According to further embodiments, the method further comprises applying an anisotropic conductive paste or placing solder balls in the curved surface area after forming the electrical contact element and before arranging the flat sensor chip in the curved surface area. The method can further include thinning the flat sensor chip to a thickness of less than 100 µm before arranging the flat sensor chip in the curved surface area. For example, a contact opening can be formed in the second main surface of the sensor chip before the sensor chip is positioned in the curved surface area. BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings are enclosed to provide a further understanding of embodiments of the invention and are incorporated into and form part of this description. The drawings illustrate the embodiments of the present invention and, together with the description, serve to explain the principles. Other embodiments of the invention and many of the intended advantages are immediately appreciated, as they are described in detail below. The description should be better understood. The elements of the drawings are not necessarily to scale relative to each other. Identical reference symbols denote corresponding similar parts. 1A shows a cross-sectional view of an image sensor according to embodiments. 1B shows a cross-sectional view of an image sensor according to further embodiments. 1C shows a stretched perspective view of an image sensor according to embodiments. 2A until 2H illustrate processes for manufacturing a lidless thin sensor chip. 3A until 3F illustrate processes for forming a carrier with a curved surface area. 4A until 4D Illustrate cross-sectional views of a support during the execution of a method for manufacturing an image sensor according to embodiments. 5A until 5D Illustrate cross-sectional views of a support during the execution of a process for manufacturing an image sensor. 6A until 6D show cross-sectional views of a support during the execution of a method for manufacturing an image sensor according to embodiments. 7 summarizes a method according to embodiments. DETAILED DESCRIPTION The following detailed description refers to the accompanying drawings, whic