Search

DE-202026100830-U1 - Multi-layered composite dual-interface smart card with a biodegradable plastic film layer and a wood layer

DE202026100830U1DE 202026100830 U1DE202026100830 U1DE 202026100830U1DE-202026100830-U1

Abstract

A multilayer composite dual-interface smart card comprising a biodegradable plastic film layer and a wood layer, comprising an inlay layer, an upper substrate layer, and a lower substrate layer, each laminated on the upper and lower sides of the inlay layer, respectively, characterized in that the inlay layer comprises at least one composite unit, the composite unit being formed by clamping a biodegradable plastic film layer through a wood layer, wherein a high-frequency coil and a dual-interface smart card chip (200) are arranged on at least one biodegradable plastic film layer of the inlay layer, wherein a first through-hole for embedding the dual-interface smart card chip (200) is arranged on the wood layer or the wood layer and the biodegradable plastic film layer associated with the dual-interface smart card chip (200), wherein the upper substrate layer and the lower substrate layer are configured as the upper wood layer (70) and lower wood layer (80), respectively, wherein on the upper wood layer (70) a second passage point for exposing the contact surface of the dual-interface smart card chip (200) is arranged.

Assignees

  • ASIA CARD CORPORATION LTD

Dates

Publication Date
20260513
Application Date
20260213
Priority Date
20260213

Claims (7)

  1. A multilayer composite dual-interface smart card comprising a biodegradable plastic film layer and a wood layer, comprising an inlay layer, an upper substrate layer, and a lower substrate layer, each laminated on the upper and lower sides of the inlay layer, respectively, characterized in that the inlay layer comprises at least one composite unit, the composite unit being formed by clamping a biodegradable plastic film layer through a wood layer, wherein a high-frequency coil and a dual-interface smart card chip (200) are arranged on at least one biodegradable plastic film layer of the inlay layer, wherein a first through-hole for embedding the dual-interface smart card chip (200) is arranged on the wood layer or the wood layer and the biodegradable plastic film layer associated with the dual-interface smart card chip (200), wherein the upper substrate layer and the lower substrate layer are configured as the upper wood layer (70) and lower wood layer (80), respectively, wherein on the upper wood layer (70) a second passage point for exposing the contact surface of the dual-interface smart card chip (200) is arranged.
  2. Multi-layer composite dual-interface smart card with a biodegradable plastic film layer and a wood layer according to Claim 1 , characterized in that the INLAY layer comprises a first composite unit (a), wherein the first composite unit (a) has a first biodegradable plastic film layer (10), a first wood layer (20) and a second wood layer (30), each laminated on the upper and lower sides of the first biodegradable plastic film layer (10), wherein the high-frequency coil is arranged on the first biodegradable plastic film layer (10) by means of an ultrasonic wire embedding device, wherein a first passage is arranged on the first wood layer (20).
  3. Multi-layer composite dual-interface smart card with a biodegradable plastic film layer and a wood layer according to Claim 2 , characterized in that the INLAY layer further comprises a second composite unit (b), wherein the second composite unit (b) is laminated on the upper or lower side of the first composite unit (a), wherein the second composite unit (b) comprises a second biodegradable plastic film layer (40), a third wood layer (50) and a fourth wood layer (60), each of which is laminated on the upper and lower side of the second biodegradable plastic film layer (40).
  4. Multi-layer composite dual-interface smart card with a biodegradable plastic film layer and a wood layer according to Claim 3 , characterized in that the first composite unit (a) and the second composite unit (b) form a laminated multilayer composite unit as a whole, wherein the second composite unit (b) omits the third wood layer (50) when the second composite unit (b) is laminated beneath the first composite unit (a), wherein a second biodegradable plastic film layer (40) and a fourth wood layer (60) are successively laminated on the underside of the first composite unit (a), wherein the second composite unit (b) omits the fourth wood layer (60) when the second composite unit (b) is laminated over the first composite unit (a), and wherein a second biodegradable plastic film layer (40) and a third wood layer (50) are successively laminated on the top side of the first composite unit (a).
  5. Multi-layer composite dual-interface smart card with a biodegradable plastic film layer and a wood layer according to Claim 4 , characterized in that a third biodegradable plastic film layer (90) and a fourth biodegradable plastic film layer (100) are each laminated onto the surfaces of the upper wood layer (70) and the lower wood layer (80), wherein a third passage point is arranged at a location on the third biodegradable plastic film layer (90) corresponding to the second passage point.
  6. Multi-layer composite dual-interface smart card with a biodegradable plastic film layer and a wood layer according to Claim 5 , characterized in that the thickness of the first biodegradable plastic film layer (10), the second biodegradable plastic film layer (40), the third biodegradable plastic film layer (90) and the fourth biodegradable plastic film layer (100) is each 0.05 mm to 0.06 mm, wherein the thickness of the first wood layer (20), the second wood layer (30), the third wood layer (50) and the fourth wood layer (60) is each 0.17 mm to 0.35 mm, wherein the thickness of the upper wood layer (70) and the lower wood layer (80) is each 0.3 mm to 0.35 mm.
  7. Multi-layer composite dual-interface smart card with a biodegradable plastic film layer and a wood layer according to Claim 6 , characterized in that for the first biodegradable plastic film layer (10), the second biodegradable plastic film layer (40), the third biodegradable plastic film layer (90) and the fourth biodegradable plastic film layer (100) one of the biodegradable PVC film, the biodegradable PET film, the biodegradable ABS film and the biodegradable PC film is used.

Description

TECHNICAL AREA The present utility model relates to the technical field of smart cards, in particular to a multi-layer composite dual-interface smart card with a biodegradable plastic film layer and a wood layer. STATE OF THE ART Smart cards are media used to identify individuals and store personal information, offering the advantages of large data storage capacity and high security. Various smart cards are widely used in daily life, including but not limited to work permits, identity cards, financial transaction cards, membership cards, transportation cards, access control cards, and more. Current dual-interface smart cards typically consist of a plastic layer and a rigid material layer. The antenna is embedded in the plastic layer, and mounting holes are provided in the rigid material layer. The IC chip is encapsulated on a plastic plate in which the antenna is embedded. This step ensures that the IC chip is properly mounted onto the plastic layer and that the antenna's position and function are maintained. The plastic plate is milled to a suitable shape and structure to guarantee the precise mounting position of the IC chip and other components. A rigid material plate is bonded to one side of the plastic sheet, ensuring the IC chip sits within the mounting hole of the rigid material layer and exposes the IC chip's electrical contacts to the smart card's surface. This step guarantees the card body's stability and the IC chip's correct positioning. For existing dual-interface smart cards, the top and bottom plastic layers are laminated with the middle inlay layer. Therefore, the card base, consisting solely of a plastic layer, is not environmentally friendly during production and processing. Plastic smart cards lack texture, necessitating further optimization and improvement. CONTENTS OF THE PRESENT USE SAMPLE Against this background, the present utility model provides a multi-layered composite dual-interface smart card with a biodegradable plastic film layer and a wood layer. Dual-interface smart cards made from multi-layered wood and multi-layered biodegradable plastic film layers offer the advantages of being more environmentally friendly due to the biodegradable materials, while the wood layer gives the card a wood grain texture to enhance the user experience. The technical solution disclosed in the present utility model consists of a multilayer composite dual-interface smart card with a biodegradable plastic film layer and a wood layer, comprising an inlay layer, an upper substrate layer, and a lower substrate layer, each laminated on the upper and lower sides of the inlay layer, the inlay layer comprising at least one composite unit, the composite unit being formed by clamping a biodegradable plastic film layer through a wood layer, a high-frequency coil and a dual-interface smart card chip being arranged on at least one biodegradable plastic film layer of the inlay layer, a first through-hole for embedding the dual-interface smart card chip being arranged on the wood layer or the wood layer and the biodegradable plastic film layer associated with the dual-interface smart card chip, the upper substrate layer and the lower substrate layer being configured as the upper wood layer and the lower wood layer, respectively, a second through-hole for exposing the contact surface of the Dual-interface smart card chips are arranged. Furthermore, it is provided that the INLAY layer comprises a first composite unit, wherein the first composite unit has a first biodegradable plastic film layer, a first wood layer and a second wood layer, each laminated on the upper and lower sides of the first biodegradable plastic film layer, wherein the high-frequency coil is arranged on the first biodegradable plastic film layer by means of an ultrasonic wire embedding device, and wherein a first passage is arranged on the first wood layer. Preferably, the INLAY layer further comprises a second composite unit, wherein the second composite unit is laminated on the upper or lower side of the first composite unit, wherein the second composite unit has a second biodegradable plastic film layer, a third wood layer and a fourth wood layer, each of which is laminated on the upper and lower sides of the second biodegradable plastic film layer. Furthermore, it is provided that the first composite unit and the second composite unit form a laminated multilayer composite unit as a whole, wherein the second composite unit omits the third wood layer when the second composite unit is laminated below the first composite unit, wherein a second biodegradable plastic film layer and a fourth wood layer are successively laminated on the underside of the first composite unit, wherein the second composite unit omits the fourth wood layer when the second composite unit is laminated over the first composite unit, and wherein a second biodegradable plastic film layer and a third wood layer are successively laminated on the top side of the first composi