EP-3686905-B1 - METHOD OF MANUFACTURING ELECTRODE SUBSTRATE FOR TRANSPARENT LIGHT-EMITTING DEVICE DISPLAY

EP3686905B1EP 3686905 B1EP3686905 B1EP 3686905B1EP-3686905-B1

Inventors

SON, YONG GOO
LEE, KUN SEOK
LEE, SEUNG HEON

Dates

Publication Date: 20260506
Application Date: 20180914

Claims (2)

A method of manufacturing an electrode substrate for a transparent light emitting device display, the method comprising: laminating copper foil (20) on a transparent base material (10); forming a copper foil pattern (30) by etching the copper foil (20); forming a transparent photosensitive resin composition layer (40) on entire surfaces of upper portions of the transparent base material (10) and the copper foil pattern (30); and exposing at least a part of the copper foil pattern (30) by removing at least a part of the transparent photosensitive resin composition layer (40) provided on the copper foil pattern (30), wherein the laminating of the copper foil (20) on the transparent base material (10) uses an adhesive layer (50); the transparent photosensitive resin composition is a negative-type transparent photosensitive resin composition; a refractive index of the transparent photosensitive resin composition layer (40) is 1.45 to 1.55; a difference in a refractive index between the adhesive layer (50) and the transparent photosensitive resin composition layer (40) is within 0.05, wherein the copper foil pattern (30) comprises an electrode pattern and an electrode pad unit pattern, wherein a line width of the electrode pattern is 3 µm to 30 µm, and a line width of the electrode pad unit pattern is 50 µm or more, wherein the electrode pattern comprises a metal mesh pattern, and wherein the metal mesh pattern is provided on an entire region of an effective screen unit on the transparent base material (10), except for the electrode pad unit pattern; wherein the removing of at least the part of the transparent photosensitive resin composition layer (40) provided on the copper foil pattern (30) comprises performing rear-surface scattered light exposing and developing on a lower surface of the transparent base material (10) to form an exposed and developed transparent photosensitive resin composition layer (40) wherein that the exposed and developed transparent photosensitive resin composition layer (40) is provided on the electrode pattern, and the exposed and developed transparent photosensitive resin composition layer (40) is not provided on at least a part of the electrode pad unit pattern.
The method of claim 1, wherein a thickness of the copper foil (20) is 2 µm to 15 µm.

Description

[Technical Field] This application claims priority to and the benefit of Korean Patent Application No. 10-2017-0120348 filed in the Korean Intellectual Property Office on September 19, 2017. The present application relates to a method of manufacturing an electrode substrate for a transparent light emitting device display. [Background Art] Recently, Korea creates various exterior lighting in parks and town centers, as well as colorful signs, and provides information and attraction to urban residents through the convergence of high-tech information and communication technology (ICT) and light emitting diode (LED) technology. Particularly, in a transparent LED display using an indium tin oxide (ITO) transparent electrode material, an LED is applied between glasses or a transparent film, to which an LED is applied, is attached to one surface of glass, and has an advantage in that wires are not viewed, so that it is possible to display light of high quality. Accordingly, the transparent LED display is utilized in the interior of a hotel, a department store and the like, and has increasing importance in implementing media facade of an exterior wall of a building. According to a spread of a smart device, demands of a transparent electrode, which is transparent, is electrically conducted, and is used in a touch screen and the like, are explosive, and the most widely used transparent electrode among the transparent electrodes is an indium tin oxide (ITO) that is an oxide of indium and tin. However, reserves of indium, which is a main raw material of the material of the ITO transparent electrode, are not largely available globally and indium is produced in some countries, such as China, and production cost of indium is high. Further, indium has a disadvantage in that a resistance value is not constantly applied, so that an expressed light beam of an LED is not uniform. Accordingly, the transparent LED utilizing ITO has a limit in being utilized as a transparent electrode material with high performance and low cost. It is a fact that the ITO has been most dominantly used as a transparent electrode material, but research and technology development utilizing a new material are continuously conducted due to a limit in economic feasibility, restricted performance, and the like. As a transparent electrode material attracting attention as a next-generation new material, there are metal mesh, an Ag nanowire, carbon nano tube (CNT), conductive polymer, graphene, and the like. Among them, the metal mesh is a new material, which occupies 85% of a material replacing the ITO, is low cost and has high conductivity, so that a market of the metal mesh is expanded in an aspect of utilization of the metal mesh. The transparent LED display utilizing the metal mesh is easily repaired and maintained, is capable of saving resources, is capable of considerably preventing environmental contamination, and is economical by a decrease in manufacturing cost, compared to an existing ITO transparent display. Further, the transparent LED display utilizing the metal mesh may be expansively applied for various purposes and may be applied to and utilized in various products as a new transparent electrode material. JP 2017 045855 A discloses an LED display device in which a flexible transparent substrate is used. The flexible transparent substrate includes: a support substrate having a haze value of 20% or less; a metal wiring section laminated on a surface of the support substrate via an adhesive layer; and an insulating protective film covering a region excluding a region for mounting an LED element, laminated on the support substrate and the metal wiring section, and having a haze value of 20% or less. The degree of coverage by the metal wiring section on the surface of the support substrate is 40% or less. An adhesive forming the adhesive layer contains one resin selected from among a polyurethane resin, an acrylic resin, or an epoxy resin, as a main material resin, and the main material resin of an insulating resin that forms the insulating protective film is the same resin as the main material resin of the adhesive. US 2010/055605 A1 discloses a method of manufacturing the printed circuit board including: forming an opaque conductive pattern on one side of a transparent insulation layer; forming a photosensitive insulation layer on the transparent insulation layer such that the conductive pattern is covered; hardening the photosensitive insulation layer excluding an area covering the conductive pattern by irradiating light on the other side of the transparent insulation layer; and forming an opening on the photosensitive insulation layer by removing the area of the photosensitive insulation layer covering the conductive pattern such that the conductive pattern is exposed. US 2016/245491 A1 discloses a transparent light emitting apparatus including a first transparent substrate, a wiring sheet including a base layer disposed on the first transpar