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EP-3806148-B1 - FLEXIBLE SUBSTRATE AND PREPARATION METHOD THEREFOR, AND FLEXIBLE ELECTRONIC DEVICE

EP3806148B1EP 3806148 B1EP3806148 B1EP 3806148B1EP-3806148-B1

Inventors

  • WANG, Pinfan

Dates

Publication Date
20260513
Application Date
20190221

Claims (14)

  1. A flexible substrate, comprising: a flexible base (100); a plurality of electronic components (200) disposed on the flexible base (100), a first gap (10) being formed between each two adjacent electronic components (200) of the plurality of electronic components (200); and a plurality of metal lines (20), wherein at least one end of each of the metal lines (20) is connected to the corresponding electronic component (200), at least a portion of the plurality of metal lines (20) are disposed in the first gap (10), and a length of each metal line (20) disposed in the first gap (10) is greater than a width of the first gap (10) in an extension direction of the metal line (20); wherein a first filling layer (300) is disposed in the first gap (10) to wrap the metal line (20) disposed in the first gap (10); characterized in that , the flexible substrate further comprises a protective cover (400); wherein the protective cover (400) is disposed on one side of the electronic component (200) distal from the flexible base (100) by an adhesive layer (40), and the first filling layer (300) is lower than the electronic component (200) in a direction perpendicular to the flexible base, and a second gap (30) is formed between the first filling layer (300) and the adhesive layer (40).
  2. The flexible substrate according to claim 1, wherein a material for forming the first filling layer (300) comprises a water gel having a Young's modulus of being less than 0.1 MPa.
  3. The flexible substrate according to claim 1, wherein a material for forming the first filling layer (300) comprises a polymer material having a viscosity of being less than 10,000 cps.
  4. The flexible substrate according to any one of claims 1 to 3, wherein the plurality of electronic components (200) are a plurality of flexible packages arranged in an array, and two ends of each of the metal lines (20) are connected to the corresponding electronic component (200) adjacent thereto.
  5. The flexible substrate according any one of claims 1 to 4, wherein the metal line (20) is provided with protrusions (21) in a direction perpendicular to the flexible base (100).
  6. The flexible substrate according to claim 1, wherein the second gap (30) is an air gap.
  7. The flexible substrate according to claim 1 , wherein a second filling layer (50) is disposed in the second gap (30), wherein a material of forming the second filling layer (50) comprises a material having a Young's modulus of being less than 0.1 MPa or a viscosity of being less than 10,000 cps.
  8. The flexible substrate according to claim 7, wherein functional particles (60) are disposed in the second filling layer (30), wherein the functional particles (60) comprise at least one of scattering particles, light-shielding particles, and heat-dissipating particles.
  9. The flexible substrate according to claim 8, wherein the heat-dissipating particles comprises at least one of carbon particles and metallic nanoparticles, wherein the carbon particles are made of a carbon material or a metal material; and the light-shielding particles are made of a liquid crystal material.
  10. A method for manufacturing the flexible substrate as defined in any one of claims 1 to 9, comprising: (S100) disposing a plurality of electronic components (200) on the flexible base (100), a gap being formed between each two adjacent electronic components (200) of the plurality of electronic components (200); (S200) disposing a plurality of metal lines (20) on the flexible base (100), and stretching and restoring the flexible base (100), such that the length of each metal line (20) disposed in the first gap (10) is greater than the width of the first gap (10) in an extension direction of the metal line (20); and (S300) disposing a first filling layer (300) in the first gap (10) to wrap the metal line (20) in the gap (10).
  11. The method according to claim 10, wherein the step of disposing a plurality of metal lines (20) on the flexible base (100), and stretching and restoring the flexible base (100), such that the length of each metal line (20) disposed in the first gap (10) is greater than the width of the first gap (10) in an extension direction of the metal line (20) comprises: stretching the flexible base (100) provided with the plurality of electronic components (200); disposing a plurality of metal lines (20) on the stretched flexible base (100), wherein at least a portion of the plurality of metal lines (20) are disposed in the first gap (10), and two ends of each metal line (20) disposed in the first gap (10) are connected to the corresponding electronic component (200) adjacent thereto; and restoring the flexible base (100) to a size before stretching, such that the metal line (20) forms protrusions (21) on the flexible base (100).
  12. The method according to claim 10 or 11, wherein during disposing the first filling layer (300) in the first gap (10), the method further comprises: controlling the height of the first filling layer (300), such that the first filling layer (300) is lower than the electronic component (200) corresponding to the first gap (10) in a direction perpendicular to the flexible base (100), thereby forming a groove in the first gap (10); and the method further comprises: disposing a protective cover (400) on one side of the electronic component (200) distal from the flexible base (100), wherein the protective cover (400) is attached to the electronic component (200) by an adhesive layer (40), such that an air gap is formed at the groove.
  13. The method according to claim 10 or 11, further comprising: filling one side of the first filling layer (300) distal from the flexible base (100) with a material having a Young's modulus greater than 0.1 MPa or a viscosity less than 10,000 cps to form a second filling layer (50); and disposing a protective cover (400) on one side of the second filling layer (50) distal from the flexible base (100), wherein the protective cover (400) is attached to the second filling layer (50) and the electronic component (200) by an adhesive layer (40).
  14. A flexible electronic device, comprising the flexible substrate as defined in any one of claims 1 to 9.

Description

TECHNICAL FIELD The present disclosure relates to a flexible substrate and a method for manufacturing the same, and a flexible electronic device. BACKGROUND With the advancement of semiconductor process technologies, flexible electronic devices have also been greatly developed. The flexible electronic device realizes a curved (bendable) function of the electronic device mainly by integrating electronic components onto a flexible substrate. The flexible electronic device provides the basis for the implementation of devices such as a wearable electronic device, and a flexible display. For the purpose of maintaining implementation of the functions of the electronic components during the process of bending the substrate, during manufacturing of the flexible electronic device, it is generally necessary to integrate and improve the structures of the electronic components integrated on the flexible substrate, the structures and connection lines, and the like, so as to ensure that the lines and electronic components, which are formed of metal or semiconductor materials, may not be damaged due to mechanical bending when the substrate is bent. WO 2017/101783 discloses a LED filament configured for emitting omnidirectional light. US 2014/220422 describes an electronic system comprises flexible, stretchable or polymer substrate, electronic device or device component that has free standing configuration or is tethered to substrate, and fluid containment chamber. US 2017/040306 recites a stretchable display for e.g. cellular telephone, has component forming pixel that includes sub-pixels of colors formed from respective crystalline semiconductor LEDs, and circuitry placed in substrate to supply signals to components. SUMMARY In one aspect, embodiments of the present disclosure provide a flexible substrate. The flexible substrate includes a flexible base; a plurality of electronic components disposed on the flexible base, a first gap being formed between each two adjacent electronic components of the plurality of electronic components; and a plurality of metal lines, wherein at least one end of each of the metal lines is connected to the corresponding electronic component, at least a portion of the plurality of metal lines are disposed in the first gap, and a length of each metal line disposed in the first gap is greater than a width of the first gap in an extension direction of the metal line; wherein a first filling layer is disposed in the first gap to wrap the metal line disposed in the first gap; the flexible substrate further includes a protective cover; where the protective cover is disposed on one side of the electronic component distal from the flexible base by an adhesive layer, and the first filling layer is lower than the electronic component in a direction perpendicular to the flexible base, and a second gap is formed between the first filling layer and the adhesive layer. According to embodiments of the present disclosure, a material for forming the first filling layer includes a water gel having a Young's modulus of being less than 0.1 MPa. According to embodiments of the present disclosure, a material for forming the first filling layer includes a polymer material having a viscosity of being less than 10,000 cps. According to embodiments of the present disclosure, the plurality of electronic components are a plurality of flexible packages arranged in an array, and two ends of each of the metal lines are connected to the corresponding electronic component adjacent thereto. According to embodiments of the present disclosure, each metal line has protrusions in a direction perpendicular to the flexible base, and the first filling layer is higher than the protrusions on the metal line. According to the embodiment of the present disclosure, the second gap is an air gap. According to embodiments of the present disclosure, the flexible substrate further includes a second filling layer disposed in the second gap, wherein a material for forming the second filling layer includes a material having a Young's modulus of being less than 0.1 MPa or a viscosity of being less than 10,000 centipoise.s (cps). According to embodiments of the present disclosure, functional particles are disposed in the second filling layer, wherein the functional particles include at least one of scattering particles, light-shielding particles, and heat-dissipating particles. According to embodiments of the present disclosure, the heat-dissipating particles includes at least one of carbon particles and metallic nanoparticles, wherein the carbon particles are made of a carbon material or a metal material. According to embodiments of the present disclosure, the light-shielding particles are made of a liquid crystal material. In another aspect, embodiments of the present disclosure provide a method for manufacturing the flexible substrate. The method includes: disposing a plurality of electronic components on the flexible base, a first gap being f