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EP-3892596-B1 - GLASS FIBER-REINFORCED RESIN MOLDED ARTICLE

EP3892596B1EP 3892596 B1EP3892596 B1EP 3892596B1EP-3892596-B1

Inventors

  • SEKIKAWA, Hironobu
  • SASAKI, RYO
  • TAKAIZUMI, MAO

Dates

Publication Date
20260506
Application Date
20200207

Claims (4)

  1. A glass fiber-reinforced resin molded article containing glass fiber in a range of 10 to 90% by mass and a resin in a range of 90 to 10% by mass with respect to a total amount of the glass fiber-reinforced resin molded article, wherein the glass fiber comprises a composition including SiO 2 in a range of 52.0 to 59.5% by mass, B 2 O 3 in a range of 17.5 to 25.5% by mass, Al 2 O 3 in a range of 9.0 to 14.0% by mass, SrO in a range of 0.5 to 6.0% by mass, MgO in a range of 1.0 to 5.0% by mass, CaO in a range of 1.9 to 5.0% by mass, and a total content of F 2 and Cl 2 in a range of 0.1 to 2.5% by mass with respect to a total amount of the glass fiber, the glass fiber has a number average fiber length of 1 to 10000 µm, and the resin is selected from the group consisting of polybutylene terephthalate resin and a polyetheretherketone resin.
  2. The glass fiber-reinforced resin molded article according to claim 1, wherein the glass fiber has a number average fiber length of 100 to 450 µm.
  3. The glass fiber-reinforced resin molded article according to claim 1, wherein the glass fiber has a number average fiber length of 3 to 25 µm.
  4. The glass fiber-reinforced resin molded article according to claim 1, wherein the thermoplastic resin is a polybutylene terephthalate resin.

Description

Technical Field The present invention relates to a glass fiber-reinforced resin molded article. Background Art Conventionally, glass fiber has been widely used in various applications to improve the strength of resin molded articles, and the resin molded articles have been increasingly used for a housing or a part of electronic devices such as a smartphone and a laptop computer. In general, glass absorbs energy from alternating current as heat, and thus has a problem in that the above resin molded article generates heat when the resin molded article is used for a housing or a part of the above electronic devices. The dielectric loss energy absorbed by glass is proportional to the dielectric constant and the dielectric loss tangent determined by the component and structure of the glass, and is represented by the following formula (1): W=kf×ε1/2tanδ wherein W is a dielectric loss, k is a constant, f is a frequency, ε is a dielectric constant, and tanδ is a dielectric loss tangent. From the above formula (1), it is found that the dielectric loss is larger and heat generation of the above resin molded article is larger as the dielectric constant and the dielectric loss tangent are higher and as the frequency is higher. In order to reduce the dielectric loss energy of glass fiber-reinforced resin molded bodies, the applicant has filed a patent application directed to a glass fiber-reinforced resin molded article obtained by using glass fiber having a composition including SiO2 in the range of 52.0 to 57.0% by mass, Al2O3 in the range of 13.0 to 17.0% by mass, B2O3 in the range of 15.0 to 21.5% by mass, MgO in the range of 2.0 to 6.0% by mass, CaO in the range of 2.0 to 6.0% by mass, TiO2 in the range of 1.0 to 4.0% by mass, F2 of less than 1.5% by mass, and Li2O, Na2O, and K2O of less than 0.6% by mass in total with respect to the total amount of the glass fiber, the glass fiber-reinforced resin molded article having a lower dielectric constant and a lower dielectric loss tangent (see Patent Literature 1). Patent Literature 2 discloses a polybutylene terephthalate resin composition having a low dielectric constant and a low dielectric loss tangent comprising a polybutylene terephthalate resin and a cyclic olefin-based resin having a glass transition temperature ≥100°C, wherein the content of the cyclic olefin resin is preferably in the range of 20 to 80 mass parts based on 100 mass parts of the polybutylene terephthalate resin, and wherein the polybutylene terephthalate resin composition may further contain a compatibilizing agent and glass fiber. Patent Literature 3 discloses a glass fiber with a low dielectric constant for a high frequency high-density circuit board comprising the following components in percentage by weight: 50 to 60 percent of SiO2, 12 to 18 percent of Al2O3, 0 to 1.8 percent of CaO, 0.5 to 3.2 percent of MgO, 0.5 to 3.2 percent of ZnO, 21 to 27 percent of B2O3, 0 to 0.25 percent of Li2O, 0 to 0.25 percent of Na2O, 0.4 to 4 percent of TiO2, 0.5 to 3 percent of CaF2, and 0.2 to 0.6 percent of CeO2. Citation List Patent Literature Patent Literature 1: International Publication WO 2017/171101 A1Patent Literature 2: JP 2013 043942 APatent Literature 3: CN 101 696 089 A Summary of Invention Technical Problem In recent years, the size of data processed in electronic devices becomes larger and data communication among electronic devices becomes higher. In order to respond to these moves, use of higher frequencies of electrical signals has been promoted. In the above formula (1), as the frequency f increases, in glass fiber-reinforced resin molded articles, parameters other than the frequency, especially the dielectric constant and the dielectric loss tangent are, particularly the dielectric loss tangent is required to be reduced in order to lower the dielectric loss energy. Amid in this move, the glass fiber-reinforced resin molded article described in Patent Literature 1 has a disadvantage of insufficient reduction in the dielectric constant and dielectric loss tangent in a high-frequency region of 10 GHz or more. In view of overcoming the disadvantage, it is an object of the present invention to provide a glass fiber-reinforced resin molded article that enables the dielectric constant and the dielectric loss tangent to be reduced and enables particularly the dielectric loss tangent to be markedly reduced, in a high-frequency region of 10 GHz or more. Solution to Problem In order to achieve the object, a glass fiber-reinforced resin molded article of the present invention is a glass fiber-reinforced resin molded article containing glass fiber in the range of 10 to 90% by mass and a resin in the range of 90 to 10% by mass with respect to the total amount of the glass fiber-reinforced resin molded article, wherein the glass fiber comprises a composition including SiO2 in the range of 52.0 to 59.5% by mass, B2O3 in the range of 17.5 to 25.5% by mass, Al2O3 in the range of 9.0 to 14.0% by mass, SrO in