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EP-3951881-B1 - DISPLAY SUBSTRATE AND METHOD FOR PREPARING SAME, AND DISPLAY APPARATUS

EP3951881B1EP 3951881 B1EP3951881 B1EP 3951881B1EP-3951881-B1

Inventors

  • HUANG, WEIYUN
  • KO, YOUNG YIK
  • KANG, SANGHUN
  • HU, Wenbo

Dates

Publication Date
20260506
Application Date
20190326

Claims (14)

  1. A display substrate (200; 300; 400), comprising a display region (201; 301; 401) and an opening region (2011; 3011; 4011), the display region (201; 301; 401) surrounding the opening region (2011; 3011; 4011), wherein a first barrier wall (2012; 3012; 4012) is between the display region (201; 301; 401) and the opening region (2011; 3011; 4011), and the first barrier wall (2012; 3012; 4012) surrounds the opening region (2011; 3011; 4011); the first barrier wall (2012; 3012; 4012) comprises a first metal layer structure, and at least one side surface, surrounding the opening region (2011; 3011; 4011), of the first metal layer structure comprises a recess (2012A; 3012A; 4012A); the display substrate (200; 300; 400) further comprises a base substrate (202; 302; 402), the first metal layer structure comprises: a first metal sub-layer (20121) on a first side of the base substrate (202; 302; 402), and a second metal sub-layer (20122) on a side of the first metal sub-layer (20121) away from the base substrate (202; 302; 402), wherein the orthographic projection of the first metal sub-layer (20121) on the base substrate (202; 302; 402) is within the orthographic projection of the second metal sub-layer (20122) on the base substrate (202; 302; 402), so as to form the recess (2012A; 3012A; 4012A); characterized in that the first metal layer structure further comprises a third metal sub-layer (20123) on the first side of the base substrate (202; 302; 402), the first metal sub-layer (20121) is on a side of the third metal sub-layer (20123) away from the base substrate (202; 302; 402), and the orthographic projection of the first metal sub-layer (20121) on the base substrate (202; 302; 402) is within the orthographic projection of the third metal sub-layer (20123) on the base substrate (202; 302; 402); and the orthographic projection of the second metal sub-layer (20122) on the base substrate (202; 302; 402) is within the orthographic projection of the third metal sub-layer (20123) on the base substrate (202; 302; 402).
  2. The display substrate (200; 300; 400) according to claim 1, wherein the display region (201; 301; 401) comprises an electrode pattern, the electrode pattern comprises a second metal layer structure, the first metal layer structure and the second metal layer structure have a same structure and comprise a same material.
  3. The display substrate (200; 300; 400) according to claim 1, wherein a thickness of the first metal sub-layer (20121) is larger than a thickness of the second metal sub-layer (20122) and is larger than a thickness of the third metal sub-layer (20123); for example, the thickness of the first metal sub-layer (20121) ranges from 150 nm to 900 nm, the thickness of the second metal sub-layer (20122) ranges from 30 nm to 300 nm, and the thickness of the third metal sub-layer (20123) ranges from 30 nm to 300 nm.
  4. The display substrate (200; 300; 400) according to any one of claim 1 or 3, wherein an indentation direction of the recess (2012A; 3012A; 4012A) is parallel to the base substrate (202; 302; 402).
  5. The display substrate (200; 300; 400) according to claim 1, further comprising a second barrier wall (3013) that is between the display region (201; 301; 401) and the opening region (2011; 3011; 4011), wherein the second barrier wall (3013) surrounds the opening region (2011; 3011; 4011), has a same structure as the first barrier wall (2012; 3012; 4012), and is arranged on a side of the first barrier wall (2012; 3012; 4012) away from the opening region (2011; 3011; 4011).
  6. The display substrate (200; 300; 400) according to claim 1, wherein the display region (201; 301; 401) further comprises a first electrode layer (218; 318; 418), a second electrode layer (204; 304; 404), and an organic functional layer between the first electrode layer (218; 318; 418) and the second electrode layer (204; 304; 404), the first electrode layer (218; 318; 418), the second electrode layer (204; 304; 404), and the organic functional layer are configured to form a light emitting device; and the organic functional layer is disconnected at the side surface, comprising the recess (2012A; 3012A; 4012A), of the first barrier wall (2012; 3012; 4012); for example, the second electrode layer (204; 304; 404) is a cathode layer, and the cathode layer is disconnected at the side surface, comprising the recess (2012A; 3012A; 4012A), of the first barrier wall (2012; 3012; 4012).
  7. The display substrate (200; 300; 400) according to claim 1, further comprising an image sensor and/or an infrared sensor, wherein the image sensor and/or the infrared sensor is connected to the base substrate (202; 302; 402), and an orthographic projection of the image sensor and/or infrared sensor on the base substrate (202; 302; 402) at least partially overlaps with the opening region (2011; 3011; 4011).
  8. The display substrate (200; 300; 400) according to claim 1, wherein under action of an etching solution for etching to form the first metal layer structure, an etching rate of a material of the first metal sub-layer (20121) is larger than an etching rate of a material of the second metal sub-layer (20122); for example, the material of the first metal sub-layer (20121) comprises aluminum or copper; and the material of the second metal sub-layer (20122) comprises titanium or molybdenum.
  9. The display substrate (200; 300; 400) according to any one claims 1, 3, and 4, wherein the first barrier wall (2012; 3012; 4012) further comprises an insulation layer structure (4012C), the insulation layer structure (4012C) is on the first side of the base substrate (202; 302; 402), and the first metal layer structure is on a side of the insulation layer structure (4012C) away from the base substrate (202; 302; 402); for example, the insulation layer structure (4012C) comprises a plurality of insulation sub-layers.
  10. A preparation method of a display substrate, comprising: forming a display region (201; 301; 401) and an opening region (2011; 3011; 4011), wherein the display region (201; 301; 401) surrounds the opening region (2011; 3011; 4011), and forming a first barrier wall (2012; 3012; 4012) between the display region (201; 301; 401) and the opening region (2011; 3011; 4011), wherein the first barrier wall (2012; 3012; 4012) surrounds the opening region (2011; 3011; 4011) and comprises a first metal layer structure, and a recess (2012A; 3012A; 4012A) is formed on at least one side surface, surrounding the opening region (2011; 3011; 4011), of the first metal layer structure; the preparation method further comprises providing a base substrate (202; 302; 402), the first metal layer structure comprises: a first metal sub-layer (20121) on a first side of the base substrate (202; 302; 402), and a second metal sub-layer (20122) on a side of the first metal sub-layer (20121) away from the base substrate (202; 302; 402), wherein the orthographic projection of the first metal sub-layer (20121) on the base substrate (202; 302; 402) is within the orthographic projection of the second metal sub-layer (20122) on the base substrate (202; 302; 402), so as to form the recess (2012A; 3012A; 4012A); characterized in that the first metal layer structure further comprises a third metal sub-layer (20123) on the first side of the base substrate (202; 302; 402), the first metal sub-layer (20121) is on a side of the third metal sub-layer (20123) away from the base substrate (202; 302; 402), and the orthographic projection of the first metal sub-layer (20121) on the base substrate (202; 302; 402) is within the orthographic projection of the third metal sub-layer (20123) on the base substrate (202; 302; 402); and the orthographic projection of the second metal sub-layer (20122) on the base substrate (202; 302; 402) is within the orthographic projection of the third metal sub-layer (20123) on the base substrate (202; 302; 402).
  11. The preparation method according to claim 10, wherein forming the display region (201; 301; 401) comprises: forming an electrode pattern when forming the first metal layer structure, wherein the electrode pattern comprises a second metal layer structure, and the first metal layer structure and the second metal layer structure are formed using a same layer; for example, the opening region (2011; 3011; 4011) is formed by laser cutting or mechanical punching.
  12. The preparation method according to claim 11, wherein forming the first barrier wall (2012; 3012; 4012) comprises: forming a first metal material layer on a first side of the base substrate (202; 302; 402), and forming a second metal material layer on a side of the first metal material layer away from the base substrate (202; 302; 402); performing a first etching process on the first metal material layer and the second metal material layer to form the electrode pattern and an initial barrier wall; and performing a second etching process on the initial barrier wall to form the first barrier wall (2012; 3012; 4012), wherein a wet etching method is adopted in the second etching process, and an etching rate produced by an etching solution used in the second etching process on the first metal material layer is larger than an etching rate produced by the etching solution on the second metal material layer, so that the recess (2012A; 3012A; 4012A) is formed; or forming the first barrier wall (2012; 3012; 4012) comprises: sequentially forming a third metal material layer, a first metal material layer and a second metal material layer on a first side of a base substrate (202; 302; 402); performing a first etching process on the third metal material layer, the first metal material layer and the second metal material layer to form the electrode pattern and an initial barrier wall; and performing a second etching process on the initial barrier wall to form the first barrier wall (2012; 3012; 4012), wherein a wet etching method is adopted in the second etching process, and an etching rate produced by an etching solution used in the second etching process on the first metal material layer is larger than an etching rate produced by the etching solution on the second metal material layer and is larger than an etching rate produced by the etching solution on the third metal material layer, so that the recess (2012A; 3012A; 4012A) is formed; for example, the first etching process adopts a dry etching method.
  13. The preparation method according to claim 12, wherein forming the display region (201; 301; 401) further comprises: forming a first electrode layer (218; 318; 418), a second electrode layer (204; 304; 404), and an organic functional layer between the first electrode layer (218; 318; 418) and the second electrode layer (204; 304; 404), wherein the first electrode layer (218; 318; 418), the second electrode layer (204; 304; 404), and the organic functional layer are configured to form a light emitting device, the etching solution used in the second etching process is same as an etching solution used for etching to form the first electrode layer (218; 318; 418), and the organic functional layer is disconnected at the side surface, comprising the recess (2012A; 3012A; 4012A), of the first barrier wall (2012; 3012; 4012).
  14. The preparation method according to claim 11, wherein forming the first barrier wall (2012; 3012; 4012) comprises: forming a first metal material layer on a first side of a base substrate (202; 302; 402); forming a second metal material layer on a side of the first metal material layer away from the base substrate (202; 302; 402); and performing one wet etching process on the first metal material layer and the second metal material layer, wherein an etching rate produced by an etching solution used in the wet etching process on the first metal material layer is larger than an etching rate produced by the etching solution on the second metal material layer.

Description

TECHNICAL FIELD The present invention relates to a display substrate and a preparation method thereof, and a display device comprising the display substrate. BACKGROUND At present, a display screen of a display device is developing towards large screen and full screen. Generally, a display device (e.g., a mobile phone, a tablet computer, etc.) has a camera device (or an imaging device), which is usually disposed on a side outside the display region of the display screen. However, installation of the camera device requires a certain position, which is not beneficial to a design of full screen and narrow frame of the display screen. For example, the camera device may be combined with the display region of the display screen, and a position is reserved for the camera device in the display region, so as to maximize the display region of the display screen. US 2017/0148856 A1 discloses an organic light-emitting display including an opening penetrating a substrate and an insulating layer on the substrate, in which a pixel array surrounds the opening. WO 2019/030858 A1 discloses a display device including an active region and a cutout section at a position surrounded by the edge portion of the active region. SUMMARY It is an object of the present invention to provide a display substrate and a preparation method thereof, and a display device comprising the display substrate, which can solve one or more problems in the art. The object is achieved by the features of the respective independent claims. Further embodiments are defined in the respective dependent claims. BRIEF DESCRIPTION OF THE DRAWINGS In order to clearly illustrate the technical solution of the embodiments of the disclosure, the drawings of the embodiments will be briefly described in the following; it is obvious that the described drawings are only related to some embodiments of the disclosure and thus are not limitative of the disclosure. FIG. 1A is a planar schematic diagram of a display substrate;FIG. 1B is a cross-sectional schematic diagram taken along a line A-A illustrated in FIG. 1A;FIG. 2A is a planar schematic diagram of a display substrate provided by some embodiments of the present disclosure;FIG. 2B is a cross-sectional schematic diagram taken along a line B-B illustrated in FIG. 2A;FIG. 2C is another cross-sectional schematic diagram taken along a line B-B illustrated in FIG. 2A;FIG. 3 is a cross-sectional schematic diagram of a barrier wall in a display substrate provided by some embodiments of the present disclosure, but not forming part of the claimed invention;FIG. 4 is a cross-sectional schematic diagram of a barrier wall in a display substrate provided by some embodiments of the present disclosure;FIG. 5A is a planar schematic diagram of another display substrate provided by some embodiments of the present disclosure;FIG. 5B is a cross-sectional schematic diagram taken along a line C-C illustrated in FIG. 5A;FIG. 5C is another cross-sectional schematic diagram taken along a line C-C illustrated in FIG. 5A;FIG. 6 is a cross-sectional schematic diagram of a barrier wall in another display substrate provided by some embodiments of the present disclosure, but not forming part of the claimed invention;FIG. 7 is a cross-sectional schematic diagram of a barrier wall in further another display substrate provided by some embodiments of the present disclosure;FIG. 8A is a planar schematic diagram of further another display substrate provided by some embodiments of the present disclosure;FIG. 8B is a cross-sectional schematic diagram taken along a line D-D illustrated in FIG. 8A;FIG. 9 is a cross-sectional schematic diagram of a barrier wall in further another display substrate provided by some embodiments of the present disclosure;FIG. 10 is a cross-sectional schematic diagram of a barrier wall in further another display substrate provided by some embodiments of the present disclosure;FIG. 11 is a cross-sectional schematic diagram of a barrier wall in further another display substrate provided by some embodiments of the present disclosure;FIG. 12A-FIG. 12B are planar schematic diagrams of a display substrate in a preparation process thereof provided by some embodiments of the present disclosure;FIG. 13A-FIG. 13C are planar schematic diagrams of a display substrate in a preparation process thereof provided by some embodiments of the present disclosure; andFIG. 14 is a schematic diagram of display device provided by some embodiments of the present disclosure. DETAILED DESCRIPTION In order to make objects, technical details and advantages of the embodiments of the disclosure apparent, the technical solutions of the embodiments will be described in a clearly and fully understandable way in connection with the drawings related to the embodiments of the disclosure. Apparently, the described embodiments are just a part but not all of the embodiments of the disclosure. Based on the described embodiments herein, those skilled in the art can obtain o