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EP-3977356-B1 - RFID DEVICE

EP3977356B1EP 3977356 B1EP3977356 B1EP 3977356B1EP-3977356-B1

Inventors

  • LOWE, ADAM

Dates

Publication Date
20260506
Application Date
20200527

Claims (17)

  1. A process for manufacturing a transaction device having top and bottom surfaces, the process comprising the steps of: forming a metal frame (710, 810) defining an outer periphery (611), an inner periphery (612) defined by an opening, and at least one body discontinuity (620) from the outer periphery to the inner periphery (612) of the metal frame (710, 810); disposing a chip layer (730, 830) inside the opening, the chip layer (730, 830) comprising a substrate (734, 834); mounting at least one electronic component (734, 832) to the chip layer (730, 830) in the opening, the electronic component (734, 832) comprising an RFID module (732, 832); disposing a non-conductive material layer (740, 742, 840) about the electronic component (734, 832); and forming a hole (660) extending between the top and bottom surfaces (714, 715, 814, 815) of the device; disposing at least one additional layer (750, 850) over the non-conductive material layer (740, 742, 840), wherein the opening extends from a first surface thereof at least partially through the metal frame (710, 810) for a depth less than a thickness of the metal frame such that the opening comprises a pocket having a bottom, and the at least one additional layer (750, 850) comprises a first additional layer (652) disposed on one side of the opening before inserting the at least one electrical component (734, 832), and the step of disposing the non-conductive material (740, 742, 840) about that at least one electronic component (734, 832) comprises disposing a first layer of non-conductive material comprising a ferrite layer (742, 842) in the opening between a first surface of the chip layer (730, 830) and the pocket bottom and disposing a second layer of non-conductive material comprising a fill layer (640,740, 840) on top of the at least one electronic component (734, 832).
  2. The process of claim 1, wherein the RFID module comprises an antenna connected to or configured to inductively couple to an RFID chip.
  3. The process of claim 1, wherein the at least one additional layer (650, 652) is a printing layer.
  4. The process of claim 1, wherein the step of disposing the at least one additional layer (750, 850) over the non-conductive material (740, 742, 840) comprises adhesively attaching the one additional layer (750, 850) or laminating the at least one additional layer (750, 850) over the non-conductive material (740, 742, 840).
  5. The process of claim 1, further comprising disposing a second additional layer (750, 850) on top of the second layer of non-conductive material (740, 742, 840).
  6. The process of any one of claims 1-5, wherein the hole extends through the metal frame (710, 810) between the inner periphery and the outer periphery.
  7. An RFID device comprising: a metal frame (710, 810) having first and second opposite surfaces, an outer periphery, and an opening in the metal frame ( 710, 810) defining an inner periphery and extending from at least one of the opposite surfaces for a depth; a chip layer (730, 830) disposed inside the opening, the chip layer comprising a substrate (734, 834), an RFID transponder chip (732, 832) mounted to the substrate (734, 834), and a module antenna in the substrate (734, 834) connected to the RFID transponder chip (732, 832); at least one non-conductive material layer (740, 742, 840) disposed in the opening of the frame between the chip layer (734, 834) and one of the surfaces of the metal frame (710, 810); and at least one additional layer (750, 850) laminated over at least one surface of the metal frame (710, 810); characterized in that the depth of the opening extends from the first surface for less than a thickness of the metal frame (710, 810) such that the opening comprises a pocket having a bottom, wherein the at least one non-conductive material layer comprises a ferrite layer (742, 842) disposed between a first surface of the chip layer (730, 830) and the pocket bottom, wherein the fill layer (640, 740, 742, 840) is disposed on a second surface of the chip layer.
  8. The RFID device of claim 7, wherein the device has only a single laminated layer extending over the first surface of the metal frame (710, 810) and the fill layer.
  9. The RFID device of claim 7, further comprising a hole extending between the top and bottom surfaces of the device.
  10. The RFID device of claim 9, wherein the device comprises a component of a key ring or key chain, further comprising a member disposed in the hole, the member comprising a component of an apparatus configured to hold one or more keys.
  11. The RFID device of claim 7, wherein the RFID transponder chip comprises a dual interface chip having a contact pad, and the contact pad is accessible from an outer surface of the device.
  12. The RFID device of claim 7, wherein the RFID transponder chip is completely surrounded by non-conductive material (740, 742, 840).
  13. The RFID device of claim 7, wherein the RFID transponder chip is embedded in a non-conductive substrate (634), and has a laminated fill layer in contact with at least one surface of the RFID transponder chip embedded in the non-conductive substrate (634).
  14. The RFID device of claim 13, wherein the laminated fill layer, a ferrite layer (742) in contact both upper and lower surfaces of the RFID transponder chip embedded in the non-conductive substrate (634).
  15. The RFID device of claim 13, comprising the laminated fill layer in contact with only one surface of the RFID transponder chip embedded in the non-conductive substrate (634), and a ferrite layer (742) in contact with an opposite surface of the RFID transponder chip module embedded in the non-conductive substrate (634).
  16. The process of claim 1, further comprising (a) disposing a first overframe layer over the metal frame (710, 810) on one side of the opening.
  17. The process of claim 16, further comprising disposing a second overframe layer on top of the second layer of non-conductive material (740, 742, 840).

Description

FIELD OF THE INVENTION This invention relates to transaction cards with electronic components and methods for producing the same. BACKGROUND OF THE INVENTION Metal transaction cards present unique challenges when including electronic components, such as inductive coupling IC chips, RF electronics, and standalone electronic inlays. To accommodate these components, the metal is machined into various geometries, and then the component is placed in the cavity and left exposed or hidden under a printed sheet of plastic or other decorative element. The decorative element may be affixed to the card through a variety of processes such as platen lamination, contact adhesive, curable adhesives, or "push fit" or any joining method known to the art. RF shielding is often required in the cavity, further complicating card assembly while maintaining the desired aesthetic of the card. Some of these required machining geometries remove significant amounts of metal or leave slits or holes through the card, which weakens its strength and are undesirable aesthetically. In order to strengthen the card and provide a desirable surface, overmolding and insert molding techniques have been developed to encapsulate electronic inlays within the cards and strengthen the card geometries. Furthermore, this development has improved RF performance over existing designs because it enables more metal remove in critical RF transmission and receiving areas while maintaining structural rigidity and desired appearance. WO 2018/202774 A1 is reflected in the preamble of claim 7. SUMMARY OF THE INVENTION The invention is set out in the independent claims. Aspects of the invention relate to transaction cards, processes for manufacturing transaction cards, as well as transaction cards produced according to the disclosed methods. In accordance with one aspect, the invention provides for a process for manufacturing a transaction card and a transaction card produced thereby. The process includes forming an opening in a card body of the transaction card for receiving an electronic component; inserting the electronic component into the opening; and molding a molding material about the electronic component. In yet another aspect, the invention relates to an RFID device having a metal frame, an opening in the metal frame, and a RFID inlay disposed inside the opening. The RFID inlay comprises a substrate, an RFID transponder chip mounted to the substrate, and an inductive coupling antenna in the substrate connected to the RFID transponder chip. At least one fill layer may be disposed in the opening of the frame between the chip layer and one of the surfaces of the metal frame and at least one layer may be laminated over at least one surface of the metal frame. It is to be understood that both the foregoing general description and the following detailed description are exemplary, but are not restrictive, of the invention. BRIEF DESCRIPTION OF THE DRAWINGS The invention is best understood from the following detailed description when read in connection with the accompanying drawings, with like elements having the same reference numerals. When a plurality of similar elements is present, a single reference numeral may be assigned to the plurality of similar elements with a small letter designation referring to specific elements. When referring to the elements collectively or to a non-specific one or more of the elements, the small letter designation may be dropped. This emphasizes that according to common practice, the various features of the drawings are not drawn to scale unless otherwise indicated. On the contrary, the dimensions of the various features may be expanded or reduced for clarity. Included in the drawings are the following figures: FIG. 1 is a flow diagram of selected steps of a process for manufacturing a transaction card in accordance with aspects of the present invention.FIG. 2A is a photograph depicting an electronic component before overmolding in accordance with aspects of the present invention.FIG. 2B is a photograph depicting an electronic component after overmolding in accordance with aspects of the present invention.FIG. 3A is a schematic illustration of the front of a transaction card prior to insertion molding in accordance with aspects of the present invention.FIG. 3B is a schematic illustration of the rear of a transaction card prior to insertion molding in accordance with aspects of the present invention.FIG. 3C is a schematic illustration of the front of a transaction card after to insertion molding in accordance with aspects of the present invention.FIG. 3D is a schematic illustration of the rear of a transaction card after to insertion molding in accordance with aspects of the present invention.FIGS. 4A and 4B are schematic illustrations of selected steps of an over molding process for manufacturing a transaction card in accordance with aspects of the present invention.FIG. 5A is an image depicting the front side of an exemplary c