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EP-4016245-B1 - ELECTROMAGNETIC INTERFERENCE SHIELDING ENCLOSURE WITH THERMAL CONDUCTIVITY

EP4016245B1EP 4016245 B1EP4016245 B1EP 4016245B1EP-4016245-B1

Inventors

  • LEE, JAEJIN
  • PANAKKAL, James
  • LIM, Min Suet
  • PIOUS, Aiswarya M.

Dates

Publication Date
20260513
Application Date
20210923

Claims (10)

  1. A system (200) comprising: a printed circuit board (206), PCB, with one or more components (208, 210) disposed on a top surface of the PCB (206); a bottom chassis (204); a planar top electromagnetic interference, EMI, shield (214); one or more EMI walls (218) each with a top edge physically and electrically coupled with a surface of the planar top EMI shield (214), the one or more EMI walls (218) perpendicular to the surface of the planar top EMI shield (202); and an EMI gasket (225); wherein the planar top EMI shield (214) and the one or more EMI walls (218) are to enclose a portion of the PCB that is parallel to the planar top EMI shield (214); and wherein the one or more EMI walls (218) are to extend from the surface of the planar top EMI shield (214) to a bottom surface of the PCB (206), the top surface of the PCB (206) disposed between the bottom surface of the PCB (206) and the planar top EMI shield (202), wherein a bottom edge of the one or more EMI walls (218) opposite the top edge is to couple with the bottom chassis (204), wherein the PCB (206) is disposed between the bottom chassis (204) and the planar top EMI shield (214) and wherein the bottom chassis (204) is to provide EMI shielding, and wherein the EMI gasket (225) is to be positioned between the bottom edge of the one or more EMI walls (218) and the bottom chassis (204), wherein the EMI gasket (225) is thermally conductive.
  2. The system (200) of claim 1, wherein the planar top EMI shield (214) and the one or more EMI walls (218) include material that is thermally conductive and provides electromagnetic interference, EMI, shielding for the one or more components disposed on the PCB (206) within the enclosed portion of the PCB (206).
  3. The system (200) of claim 1, wherein at least one of the one or more EMI walls (218) is to electrically couple with an electrical ground (220) coupled with the PCB (206), and wherein the electrical ground (220) coupled with the PCB (206) includes an electrical ground (220) coupled with the bottom surface of the PCB (206).
  4. The system (200) of claim 1, wherein the planar top EMI shield (214) and the one or more EMI walls (218) form a unibody construction.
  5. The system (200) of claim 1, wherein the planar top EMI shield (214) and the one or more EMI walls (218) are to be removably coupled with the EMI gasket (225).
  6. The system (200) of any one of claims 1-5, wherein the planar top EMI shield (214) is to directly thermally couple with a component (216) disposed on the enclosed portion of the PCB (206).
  7. The system (200) of any one of claims 1-6, wherein the planar top EMI shield (214) and the one or more EMI walls (218) include a selected one or more of: aluminum, copper, brass, nickel, tin, or steel.
  8. A method comprising: identifying a planar top electromagnetic interference, EMI, shield (214); identifying a plurality of EMI walls (218); physically and electrically coupling each of the plurality of EMI walls (218) each with a top edge to a surface of the planar top EMI shield (214), the plurality of EMI walls (218) perpendicular to the surface of the planar top EMI shield (214), wherein the planar top EMI shield (214) and the plurality of EMI walls (218) are to enclose a portion of a printed circuit board (206), PCB, that is parallel to the planar top EMI shield (214), wherein the plurality of EMI walls (218) are to extend from the surface of the planar top EMI shield (214) to a bottom surface of the PCB (206), the PCB (206) having a top surface on which one or more components (208, 210) are disposed, wherein the top surface is disposed between the bottom surface of the PCB (206) and the planar top EMI shield (214), wherein a bottom edge of each of the plurality of EMI walls (218) opposite the top edge is to couple with a bottom chassis (204), wherein the PCB (206) is disposed between the bottom chassis (204) and the planar top EMI shield (214) and wherein the bottom chassis (204) is to provide EMI shielding, and wherein an EMI gasket (225) is to be positioned between the bottom edge of the plurality of EMI walls (218) and the bottom chassis (204), wherein the EMI gasket (225) is thermally conductive.
  9. The method of claim 8, wherein the planar top EMI shield (214) and the plurality of EMI walls (218) include material that is thermally conductive and provides electromagnetic interference, EMI, shielding for the one or more components disposed on the PCB (206) within the enclosed portion of the PCB (206).
  10. The method of any one of claims 8-9, wherein the planar top EMI shield (214) and the plurality of EMI walls (218) include a selected one or more of: aluminum, copper, brass, nickel, tin, or steel.

Description

Field Embodiments of the present disclosure generally relate to the field of computing devices, and in particular to electromagnetic interference (EMI) shielding and thermal solutions for printed circuit boards (PCB). Background Continued growth in computing that includes wireless access will continue to increase the demand for EMI shielded components placed on PCBs or other substrates. US 2019/378802 A1 describes an electronic component module that includes: electronic components mounted on a substrate, each of the electronic components having terminals located on a side, upper, and/or lower surface thereof, and a shield that is located on the substrate, has side plates surrounding the electronic components, and is supplied with a ground potential, wherein in an electronic component closest to one side plate of the side plates among one or more electronic components, in each of which at least one terminal of the terminals is located on the side and/or upper surface, a terminal a first distance of which to the one side plate is shortest among the at least one terminal is a first terminal supplied with the ground potential, and a second distance each of second terminals not supplied with the ground potential to the one side plate is greater than the first distance. US 10 349 565 B2 describes an electronic assembly having a printed circuit board (PCB) formed of a substrate of electrically isolating material that electrically isolates conductive traces carried therein and an electrical contact electrically coupled to an electrical trace and including, an electrical component that uses a high current/low loss signal, the electrical component being mounted at the substrate and electrically coupled to the electrical contact, a flex assembly having a housing formed of electrically isolating material, the housing carrying lines in a stacked arrangement each of which is capable of providing a high current/low loss path for carrying the high current/low loss signal, the flex assembly having a terminal having contacts arranged in a low-noise pattern where a contact is electrically connected to a corresponding transmission line and capable of forming an electrical connection between the transmission line and at least one electrical trace. US 2012/320558 A1 describes electronic components on a substrate that are shielded using electromagnetic shielding structures. Summary The present invention is defined in the independent claims. The dependent claims recite selected optional features. In the following, each of the described methods, apparatuses, examples, and aspects, which do not fully correspond to the invention as defined in the claims is thus not according to the invention and is, as well as the whole following description, present for illustration purposes only or to highlight specific aspects or features of the claims. Brief Description of the Drawings FIG. 1 is a diagram including a side view and a perspective view of a legacy shielding solution for a motherboard.FIG. 2 is a diagram showing a side view and a perspective view of EMI shielding or thermal solutions that extend past the motherboard, in accordance with various embodiments.FIG. 3 is a diagram that shows the bottom side of the motherboard that includes electrical grounding, in accordance with various embodiments.FIG. 4 shows a top view and a perspective view of a top EMI shield and thermal solution that includes walls to be placed over a motherboard, in accordance with various embodiments.FIG. 5 shows a top view and a perspective view of an EMI gasket that is placed on a chassis onto which a motherboard is to be placed, in accordance with various embodiments.FIG. 6 shows an exploded view of a top EMI shield, motherboard, and bottom chassis to be coupled, in accordance with various embodiments.FIG. 7 shows an example electrical connector for a motherboard, in accordance with various embodiments.FIG. 8 is a process for assembling a top EMI shield and thermal solution that includes walls, in accordance with various embodiments.FIG. 9 illustrates an example computing device 1700 suitable for having various components of FIGs. 1-8, in accordance with various embodiments. Detailed Description Embodiments described herein include systems, and processes related to providing motherboards, or other PCB, with EMI shielding that also provides thermal conductivity. In embodiments, this is done without consuming any area on the surface of the PCB. Embodiments of the EMI shield include a planar top, with one or more walls each with a top edge physically and electrically coupled with a surface of the planar top, the one or more walls substantially perpendicular to the surface of the planar top. In embodiments, the planar top and the one or more walls substantially enclose a portion of a PCB that is substantially parallel to the planar top, wherein the one or more walls extend from the surface of the planar top to a bottom surface of the PCB, the PCB having a top surfa