EP-4020572-B1 - DISPLAY DEVICE AND MANUFACTURING METHOD THEREFOR
Inventors
- LU, Pengcheng
- HUANG, KUANTA
- CHEN, XIAOCHUAN
- YANG, Shengji
- DONG, XUE
- WANG, HUI
- WANG, YANMING
Dates
- Publication Date
- 20260506
- Application Date
- 20190823
Claims (12)
- A display device, comprising: a base substrate (100); an active area (AA), the active area (AA) comprising a plurality of sub-pixels (SP) on the base substrate (100), and each of the plurality of sub-pixels (SP) comprising: a first reflecting electrode (106); a light-emitting element (130) on the first reflecting electrode (106), the light-emitting element (130) comprising a first electrode layer (122), an organic light-emitting functional layer (124) and a second electrode layer (126) stacked on the first reflecting electrode (106) in sequence, the first electrode layer (122) being a transparent electrode layer, and; an insulating layer (103) between the first reflecting electrode (106) and the first electrode layer (122), the insulating layer (103) being of light transmitted, such that light emitted from the organic light-emitting functional layer (124) passes through the insulating layer (103) and arrives at the first reflecting electrode (106) so as to be reflected by the first reflecting electrode (106); a pixel circuit (10) on the base substrate (100), the pixel circuit (10) comprising a driving transistor (T1), the driving transistor (T1) comprising a semiconductor layer, a source electrode (S) and a drain electrode (D), one of the source electrode (S) and the drain electrode (D) being electrically connected with the first reflecting electrode (106), and the semiconductor layer being in the base substrate (100); and a storing capacitor (Cst) on the base substrate (100), the storing capacitor (Cst) being configured to store a data signal; an edge area (EA) surrounding the active area (AA), wherein the edge area (EA) comprises: a plurality of second reflecting electrodes (216) on the base substrate (100); and a light shielding layer (240) on one side of the plurality of second reflecting electrodes (216) away from the base substrate (100); characterized in that , the edge area (EA) further comprises a sensing area (30), and the display device further comprises: a first reflecting electrode pattern located in the active area (AA), and the first reflecting electrode pattern comprise a plurality of the first reflecting electrodes (306) spaced apart from one another; a second reflecting electrode pattern located in the sensing area (30), and the second reflecting electrode pattern includes a plurality of second reflecting electrodes (307) spaced apart from one another; wherein a density of a plurality of first reflecting electrodes (306) is equal to a density of a plurality of second reflecting electrodes (307); wherein shapes of the first electrode reflecting electrode (306) and the second reflecting electrode (307) in a plane parallel to the base substrate 100 are both honeycomb; wherein the organic light-emitting functional layer (124) comprises an electron injection layer (EIL), an electron transport layer (ETL), a light emission layer (OL), a hole injection layer (HIL) and a hole transport layer (HTL).
- The display device according to claim 1, wherein the insulating layer (103) comprises a via (110) filled with a metallic element (108), the first reflecting electrode (106) is electrically connected with the first electrode layer (122) through the metallic element (108).
- The display device according to claim 1, wherein the insulating layer (203) comprises a first opening (210) for exposing the first reflecting electrode (206), and at least a portion (222a) of the first electrode layer (222) is in the first opening (210) and is electrically connected with the first reflecting electrode (206).
- The display device according to claim 1, wherein entire of the first reflecting electrode (306) is separated from and insulated from the first electrode layer (322) by the insulating layer (303).
- The display device according to any one of claims 1 to 4, further comprising at least one wiring layer (M1), wherein the at least one wiring layer (M1) is between the first reflecting electrode (106) and the base substrate (100).
- The display device according to any one of claims 1 to 4, further comprising a bonding area (BA) and a bonding pad (112) located in the bonding area (BA), wherein the insulating layer (103) comprises a second opening (114) for exposing the bonding pad (112).
- The display device according to claim 1, wherein the first reflecting electrode (106) and the second reflecting electrode (216) each comprises a metallic layer (105, 215), the metallic layers (105, 215) in the first reflecting electrode (106) and the second emitting electrode are arranged in a same layer.
- The display device according to claim 7, wherein the first reflecting electrode (106) and the second reflecting electrode (216) each further comprises at least one protective layer (104, 214), the at least one protective layer (104, 214) and the metallic layer (105, 215) are stacked with each other, and the at least one protective layer (104, 214) is provided on one side of the metallic layer (105, 215) adjacent to the base substrate (100).
- The display device according to any one of claims 1 to 4, wherein the light shielding layer (240) comprises at least two color film layers that have different colors and are stacked with each other.
- A manufacturing method for a display device, the display device comprising an active area (AA) and an edge area (EA) surrounding the active area (AA), and the manufacturing method comprising: providing a base substrate (100); forming a plurality of sub-pixels (SP) on the base substrate (100), the plurality of sub-pixels (SP) being in the active area (AA), and the forming the plurality of the sub-pixels (SP) comprising: forming a first reflecting electrode (106); forming a light-emitting element (130) on the first reflecting electrode (106), the light-emitting element (130) comprising a first electrode layer (122), an organic light-emitting functional layer (124) and a second electrode layer (126) that are stacked on the first reflecting electrode (106) in sequence, and the first electrode layer (122) being a transparent electrode layer; forming an insulating layer (103) between the first reflecting electrode (106) and the first electrode layer (122), the insulating layer (103) being of light transmitted, such that light emitted from the organic light-emitting functional layer (124) passes through the insulating layer (103) and arrives at the first reflecting electrode (106) so as to be reflected by the first reflecting electrode (106); forming a pixel circuit (10) on the base substrate (100), the pixel circuit (10) comprising a driving transistor (T1), the driving transistor (T1) comprising a semiconductor layer, a source electrode (S) and a drain electrode (D), one of the source electrode (S) and the drain electrode (D) being electrically connected with the first reflecting electrode (106), and the semiconductor layer being located in the base substrate (100); and forming a storing capacitor (Cst) on the base substrate (100), the storing capacitor (Cst) being configured to store a data signal; wherein the manufacturing method further comprising: forming a plurality of second reflecting electrodes (216) in the edge area (EA); and forming a light shielding layer (240) on one side of the plurality of second reflecting electrodes (216) away from the base substrate (100), characterized in that , the edge area (EA) further comprises a sensing area (30), and the display device further comprises: a first reflecting electrode pattern located in the active area (AA), and the first reflecting electrode pattern comprise a plurality of the first reflecting electrodes (306) spaced apart from one another; a second reflecting electrode pattern located in the sensing area (30), and the second reflecting electrode pattern includes a plurality of second reflecting electrodes (307) spaced apart from one another; wherein a density of a plurality of first reflecting electrodes (306) is equal to a density of a plurality of second reflecting electrodes (307); wherein shapes of the first electrode reflecting electrode (306) and the second reflecting electrode (307) in a plane parallel to the base substrate 100 are both honeycomb; wherein the organic light-emitting functional layer (124) comprising an electron injection layer (EIL), an electron transport layer (ETL), a light emission layer (OL), a hole injection layer (HIL) and a hole transport layer (HTL).
- The manufacturing method according to claim 10, further comprising: forming a via (110) in the insulating layer (103); and filling a metallic element (108) in the via (110); preferably, wherein the forming the first electrode layer (122) comprises: forming a first electrode material (150) on one side of the insulating layer (103) away from the base substrate (100); and patterning the first electrode material (150) to form the first electrode layer (122), the first electrode layer (122) overlaying the via (110) of the insulating layer (103) and being in contact with the metallic element (108), and the first electrode layer (122) being electrically connected with the first reflecting electrode (106) through the metallic element (108).
- The manufacturing method according to claim 10, further comprising: forming a first opening (210) in the insulating layer (203), the first opening (210) exposing the first reflecting electrode (206); preferably, wherein the forming the first electrode layer (222) comprises: forming a first electrode material (250) on one side of the insulating layer (103) away from the base substrate (200); and patterning the first electrode material (250) to form a first electrode layer (222), the first electrode layer (222) overlaying the first opening (210) of the insulating layer (103), and at least a portion (222a) of the first electrode layer (222) being formed in the first opening (210) and electrically connected with the first reflecting electrode (206).
Description
TECHNICAL FIELD Embodiments of the present disclosure relate to a display device, a manufacturing method of the display device, and a driving substrate. BACKGROUND With increasing progress of a Virtual Reality (VR) technology and an Augmented Reality (AR) technology, a display device suitable for VR/AR field is also developing towards directions of miniaturization, high Pixel Per Inch (PPI), a fast response and high color gamut. A silicon-based micro-display Organic Light-Emitting Device (OLED) panel is one of prominent directions. Although a silicon-based micro-display OLED starts relatively late, it is also becoming a new spotlight in display field with advantages of miniaturization and high PPI. US2010025664 provides an organic light-emitting diode ("OLED") display, which includes a first thin film transistor disposed on a substrate; a first insulating layer disposed on the first thin film transistor; a reflective electrode disposed on the first insulating layer; a common voltage line disposed on the first insulating layer and separated from the reflective electrode; a second insulating layer disposed on the reflective electrode and the common voltage line; a pixel electrode disposed on the second insulating layer and electrically connected to the first thin film transistor; an organic light-emitting member disposed on the pixel electrode; and a common electrode disposed on the organic light-emitting member, wherein the common voltage line is electrically connected to the common electrode. SUMMARY It is an object of the present invention to provide a display device, and a manufacturing method of the display device. . The object is achieved by the features of the respective independent claims. Further embodiments are defined in the corresponding dependent claims. Even though the description refers to embodiments or to the invention, it is to be understood that the invention is defined by the claims and embodiments of the invention are those comprising at least all the features of one of the independent claims. BRIEF DESCRIPTION OF THE DRAWINGS In order to clearly illustrate the technical solution of the embodiments of the disclosure, the drawings of the embodiments will be briefly described in the following; it is obvious that the described drawings are only related to some embodiments of the disclosure and thus are not limitative of the disclosure. FIG. 1(a) is a schematic diagram of a display device arranged on a silicon wafer and provided the present disclosure;FIG. 1(b) is a schematic diagram of respective functional areas of a display device provided by an embodiment of the present disclosure;FIG. 2 is a partially enlarged cross-sectional schematic diagram of a sub-pixel of a display device provided by an embodiment of the present disclosure;FIG. 3 is a partially enlarged cross-sectional schematic diagram of a sub-pixel of a display device provided by another embodiment of the present disclosure;FIG. 4 is a partially enlarged cross-sectional schematic diagram of a sub-pixel of a display device provided by yet another embodiment of the present disclosure;FIG. 5 is a partially enlarged cross-sectional schematic diagram of a sub-pixel of a display device provided by still another embodiment of the present disclosure;FIG. 6(a) and FIG. 6(b) respectively illustrate two different positional relationships between a first electrode layer and a first reflecting electrode provided by an embodiment of the present disclosure;FIG. 7 is a cross-sectional schematic diagram of a display device provided by an embodiment of the present disclosure;FIG. 8(a) is a circuit schematic diagram of a display device provided by an embodiment of the present disclosure;FIG. 8(b) is a partial circuit schematic diagram of a display device provided by an embodiment of the present disclosure;FIG. 9(a) is a structural schematic diagram of a display device provided by an embodiment of the present disclosure;FIG. 9(b) is a cross-sectional schematic diagram of a display device provided by an embodiment of the present disclosure;FIG. 10 is a flow diagram of a method for fabricating a sub-pixel of a display device provided by the present disclosure;FIG. 11 to FIG. 14 are cross-sectional schematic diagrams of a substrate in respective steps in a method for fabricating a sub-pixel of a display device provided by an embodiment of the present disclosure;FIG. 15 to FIG. 17 are cross-sectional schematic diagrams of a substrate in respective steps in a method for fabricating a sub-pixel of a display device provided by another embodiment of the present disclosure;FIG. 18 is a structural schematic diagram of an organic light-emitting functional layer of a display device provided by an embodiment of the present disclosure. DETAILED DESCRIPTION In order to make objects, technical details and advantages of the embodiments of the disclosure apparent, the technical solutions of the embodiments will be described in a clearly and fully understandable way