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EP-4040491-B1 - DISPLAY SUBSTRATE, MANUFACTURING METHOD THEREFOR, DISPLAY DEVICE AND DISPLAY PANEL

EP4040491B1EP 4040491 B1EP4040491 B1EP 4040491B1EP-4040491-B1

Inventors

  • ZHU, XIAOYAN

Dates

Publication Date
20260506
Application Date
20200506

Claims (10)

  1. A display substrate, comprising: a base substrate; a first conductive pattern on the base substrate; an organic layer on a side of the first conductive pattern away from the base substrate; and a second conductive layer on a side of the organic layer away from the base substrate; wherein the display substrate comprises a pixel region and a bonding region, and the first conductive pattern is in the bonding region of the display substrate; a via hole penetrating the organic layer is arranged in the organic layer along a direction perpendicular to the base substrate, the via hole is in the bonding region, a position of the via hole corresponds to a position of the first conductive pattern, and the second conductive layer is electrically connected to the first conductive pattern through the via hole; characterised in that the display substrate further comprises a filling structure for filling the via hole, the filling structure has a first surface and a second surface opposite to each other, the first surface is close to the base substrate, and the second surface is away from the base substrate; a distance difference between a distance from the second surface of the filling structure to the base substrate and a distance from a surface of the organic layer on a side away from the base substrate to the base substrate is smaller than a preset threshold.
  2. The display substrate according to claim 1, further comprising a barrier layer on the side of the organic layer away from the base substrate, wherein a region of the barrier layer corresponding to the via hole is located between the filling structure and the second conductive layer.
  3. The display substrate according to claim 1, further comprising a barrier layer on the side of the organic layer away from the base substrate, wherein a region of the barrier layer corresponding to the via hole is located on a side of the filling structure away from the base substrate.
  4. The display substrate according to claim 3, further comprising a buffer layer on a side of the barrier layer away from the base substrate, wherein a distance difference between different regions of the buffer layer and the base substrate is smaller than the preset threshold.
  5. The display substrate according to claim 4, further comprising one or more of a first gate insulation layer, a second gate insulation layer or a dielectric layer on a side of the buffer layer away from the base substrate, wherein a distance difference between different regions of the first gate insulation layer and the base substrate is smaller than the preset threshold, a distance difference between different regions of the second gate insulation layer and the base substrate is smaller than the preset threshold, and a distance difference between different regions of the dielectric layer and the base substrate is smaller than the preset threshold.
  6. A display panel, comprising the display substrate according to any one of claims 1 to 5.
  7. A display device, comprising the display panel according to claim 6.
  8. A method of manufacturing a display substrate, comprising: providing a base substrate; forming a first conductive pattern on the base substrate; forming an organic layer on a side of the first conductive pattern away from the base substrate; forming a via hole in the organic layer; wherein the via hole is in the bonding region; forming a second conductive layer on a side of the organic layer away from the base substrate, wherein the second conductive layer is electrically connected to the first conductive pattern through the via hole; and characterised by forming a filling structure to fill the via hole, wherein the filling structure has a first surface and a second surface opposite to each other, the first surface is close to the base substrate, and the second surface is away from the base substrate; a distance difference between a distance from the second surface of the filling structure to the base substrate and a distance from a surface of the organic layer on a side away from the base substrate to the base substrate is smaller than a preset threshold.
  9. The method according to claim 8, wherein subsequent to the forming the filling structure to fill the via hole, the method further comprises: forming a barrier layer on a side of the filling structure away from the base substrate.
  10. The method according to claim 8, wherein prior to the forming the filling structure to fill the via hole, the method further comprises: forming a barrier layer on the side of the organic layer away from the base substrate; and the forming the filling structure to fill the via hole comprises: forming the filling structure to fill the via hole on a side of the barrier layer away from the base substrate.

Description

TECHNICAL FIELD The present disclosure relates to the field of display technology, and in particular to a display substrate, a method of manufacturing the display substrate, a display device and a display panel. BACKGROUND As micro light-emitting diode (Micro-LED) technology matures, a Micro-LED is used more and more widely. A Micro-LED display substrate in the related art includes a pixel region and a bonding region, and is bonded with a bonding integrated circuit (IC) in the bonding region to achieve electrical connection. However, during a bonding process, stress concentration may occur, which increases a possibility of that the display substrate is damaged. US 2017/0294463A1 discloses a peeling method and a manufacturing method of a flexible device. SUMMARY The present disclosure provides a display substrate according to claim 1, a method of manufacturing the display substrate according to claim 8, a display device according to claim 7, and a display panel according to claim 6. Compared with the related art, in the display substrate, the manufacturing method thereof, the display device and the display panel according to the embodiments of the present disclosure, the filling structure for filling the via hole is arranged in the via hole of the bonding region. In this way, the filling structure may realize the sharing of the pressure generated during the bonding process, reducing a possibility of stress concentration at the via hole, thereby reducing a possibility of that the display substrate is damaged. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1A is one structural schematic diagram of a display substrate according to at least one embodiment of the present disclosure;Fig. 1B is another structural schematic diagram of the display substrate according to at least one embodiment of the present disclosure;Fig. 1C is yet another structural schematic diagram of the display substrate according to at least one embodiment of the present disclosure;Fig. 1D is still yet another structural schematic diagram of the display substrate according to at least one embodiment of the present disclosure;Fig. 2A is a simulation model of a display substrate in the related art;Fig. 2B is a stress simulation result of the display substrate in the related art;Fig. 2C is a simulation model of the display substrate according to at least one embodiment of the present disclosure;Fig. 2D is a stress simulation result of the display substrate according to at least one embodiment of the present disclosure;Fig. 3 is a flowchart of a method of manufacturing the display substrate according to at least one embodiment of the present disclosure;Fig. 4A is a schematic diagram of an intermediate manufacturing process of the display substrate according to at least one embodiment of the present disclosure;Fig. 4B is another schematic diagram of an intermediate manufacturing process of the display substrate according to at least one embodiment of the present disclosure;Fig. 4C is yet another schematic diagram of an intermediate manufacturing process of the display substrate according to at least one embodiment of the present disclosure;Fig. 4D is still yet another schematic diagram of an intermediate manufacturing process of the display substrate according to at least one embodiment of the present disclosure;Fig. 4E is still yet another schematic diagram of an intermediate manufacturing process of the display substrate according to at least one embodiment of the present disclosure; andFig. 4F is still yet another schematic diagram of an intermediate manufacturing process of the display substrate according to at least one embodiment of the present disclosure. DETAILED DESCRIPTION Hereinafter, the technical solutions in embodiments of the present disclosure are described clearly and completely in conjunction with drawings in the embodiments of the present disclosure. Obviously, the following embodiments merely relate to a part of, rather than all of, the embodiments of the present disclosure, and based on these embodiments, a person skilled in the art may, without any creative effort, obtain the other embodiments, which also fall within the scope of the present disclosure. A display substrate is provided according to at least one embodiments of the present disclosure. As shown in Figs. 1A and 1B, the display substrate includes a base substrate 101, a first conductive pattern 102 on the base substrate 101, an organic layer 103 on a side of the first conductive pattern 102 away from the base substrate 101; and a second conductive layer 104 on a side of the organic layer 103 away from the base substrate 101. The display substrate includes a pixel region and a bonding region, and the pixel region includes a plurality of pixels and a driving circuit for providing electrical signals to the plurality of pixels. The bonding region includes a bonding structure (such as a bonding terminal) connected to the driving circuit for bonding an external driving circuit s