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EP-4054003-B1 - Micro-sized metamaterial absorbers

EP4054003B1EP 4054003 B1EP4054003 B1EP 4054003B1EP-4054003-B1

Inventors

  • RAKSHA, VLADIMIR P.
  • KOHLMANN, PAUL T.

Dates

Publication Date
20260506
Application Date
20220304

Claims (9)

  1. A coating (404, 504) for disposing on a surface of a component (402, 502), comprising: a first layer (508-A) that includes a first plurality of metamaterial absorbers, MMAs (102) disposed within a first binder (406, 506-A), wherein each MMA, of the first plurality of MMAs (102), comprises: a first metal or semiconductor material (104); a dielectric material (106) disposed on the first metal or semiconductor material (104); and a second metal material (108) disposed on the dielectric material (106), wherein: a length dimension (118) of the MMA is less than or equal to 200 micrometers (µm), a width dimension (120) of the MMA is less than or equal to 200 µm, and a thickness dimension (116) of the MMA is less than or equal to 8 µm.
  2. The coating (404, 504) of claim 1, wherein the first plurality of MMAs (102) includes a first MMA (102-1) and a second MMA (102-2), wherein at least one of: a profile of the first MMA (102-1) is different than a profile of the second MMA (102-2); a first difference between a length dimension (118-1) of the first MMA (102-1) and a length dimension (118-2) of the second MMA (102-2) satisfies a length difference threshold; a second difference between a width dimension (120-1) of the first MMA (102-1) and a width dimension (120-2) of the second MMA (102-2) satisfies a width difference threshold; or a third difference between a thickness dimension (116-1) of the first MMA (102-1) and a thickness dimension (116-2) of the second MMA (102-2) satisfies a thickness difference threshold.
  3. The coating (404, 504) of claim 1 or claim 2, wherein respective reference planes (408) of a set of MMAs (412), of the first plurality of MMAs (102), are approximately parallel to the surface of the component (402); or wherein respective reference planes (408) of a set of MMAs, of the first plurality of MMAs (102), are approximately perpendicular to the surface of the component (402).
  4. The coating (404, 504) of any of claims 1 to 3, wherein the first plurality of MMAs (102) includes one or more sets of MMAs (412), wherein: each set of MMAs, of the one or more sets of MMAs (412), is aligned in a chain; and respective chains of the one or more sets of MMAs (412) are approximately parallel to each other.
  5. The coating (504) of any of claims 1 to 4, further comprising a second layer (508-B) that includes a second plurality of MMAs (102-B) disposed within a second binder (506-B): wherein respective reference planes (510-A) of a first set of MMAs (518-A), of the first plurality of MMAs (102-A), are approximately parallel to respective reference planes (510-B) of a second set of MMAs(518-B) of the second plurality of MMAs (102-B); or, wherein respective reference planes (510-A) of a first set of MMAs (518-A), of the first plurality of MMAs (102-A), are approximately perpendicular to respective horizontal planes (510-B) of a second set of MMAs (518-B) of the second plurality of MMAs (102-B), or wherein the first plurality of MMAs (102-A) includes a first set of MMAs (518-A) aligned in a first chain; the second plurality of MMAs (102-B) includes a second set of MMAs (518-B) aligned in a second chain; and a difference between a first alignment angle of the first set of MMAs (518-A) and a second alignment angle of the second set of MMAs (518-B) satisfies an alignment angle difference threshold.
  6. A method, comprising: depositing, by a deposition system, a release material on a resin material, wherein the resin material is embossed with a plurality of unit cells; depositing, by the deposition system, a first metal or semiconductor material (104) on the release material; depositing, by the deposition system, a dielectric material (106) on the first metal or semiconductor material (104); and depositing, by the deposition system, a second metal material (108) on the dielectric material (106), wherein: portions of the first metal or semiconductor material (104), the dielectric material (106), and the second metal material (108) that are respectively deposited on the plurality of unit cells form a plurality of metamaterial absorbers, MMAs, (102), a length dimension (118) of each MMA, of the plurality of MMAs (102), is less than or equal to 200 micrometers (µm), a width dimension (120) of each MMA, of the plurality of MMAs (102), is less than or equal to 200 µm, and a thickness dimension (116) of each MMA, of the plurality of MMAs (102), is less than or equal to 8 µm.
  7. The method of claim 6, further comprising: removing the plurality of MMAs (102) from the release material; and singulating the plurality of MMAs (102).
  8. The method of claim 6 or claim 7, wherein the plurality of unit cells is arranged in at least one tessellation pattern.
  9. The method of any of claims 6 to 8, wherein the plurality of MMAs (102) includes a first MMA (102-1) and a second MMA (102-2), wherein at least one of: a first difference between a length dimension (118-1) of the first MMA (102-1) and a length dimension (118-2) of the second MMA (102-2) satisfies a length difference threshold; a second difference between a width dimension (120-1) of the first MMA (102-1) and a width dimension (120-2) of the second MMA (102-2) satisfies a width difference threshold; or a third difference between a thickness dimension (116-1) of the first MMA (102-1) and a thickness dimension (116-2) of the second MMA (102-2) satisfies a thickness difference threshold.

Description

RELATED APPLICATION This application claims priority to U.S. Provisional Patent Application No. 63/157,493, for "ELECTROMAGNETIC ENERGY ABSORBING METAMATERIALS AND COATINGS," filed on March 5, 2021. BACKGROUND An electromagnetic shield reflects or absorbs an electromagnetic wave. For example, an absorptive electromagnetic shield can absorb an electromagnetic wave that impinges a surface of the electromagnetic shield, thereby dissipating and converting the electromagnetic wave to another kind of energy, such as thermal energy. 'MAHMUD, S. ET AL. A Wide Incident Angle, Ultrathin, Polarization-Insensitive Metamaterial Absorber for Optical Wavelength Applications. IEEE Access. July 2020, Vol.8, pages 129525-129541', 'CHENG, Z. ET AL. Design and simulation of multi-color infrared CMOS metamaterial absorbers. Proc of SPIE. May 2016, Vol.9819, pages 98191P-1-98191P-8, ISBN 978-1-5106-1533-5', US 2015/0255877 A1 and CN 204 834 889 U are examples of electromagnetic radiation absorbers known in the art. SUMMARY Described but not claimed in isolation is a metamaterial absorber (MMA) configured to absorb a particular range of electromagnetic radiation. The MMA includes a first metal or semiconductor material; a dielectric material disposed on the first metal or semiconductor material; and a second metal material disposed on the dielectric material, wherein: a length dimension associated with the MMA is less than or equal to 200 micrometers (µm), a width dimension associated with the MMA is less than or equal to 200 µm, and a thickness dimension associated with the MMA is less than or equal to 8 µm. The first metal or semiconductor material may be a resistive material that comprises at least one of: an aluminum material, a copper material, or a silicon material. A thickness of the first metal or semiconductor material may be less than or equal to 1 µm. The dielectric material may comprise at least one of: a magnesium fluoride material, or a silicon dioxide material. A thickness of the dielectric material may be less than or equal to 5 µm. The second metal material may be a magnetic metal material that comprises at least one of: stainless steel, mild steel, element nickel, elemental iron, an iron-nickel alloy, an iron-aluminum alloy, a nickel-chromium-aluminum alloy, an iron-silicon alloy, an iron-ytterbium alloy, an iron-gallium alloy, a ferrite, a samarium-cobalt alloy, a neodymium-boron-iron alloy, a carbon-enriched iron, an aluminum-nickel-cobalt alloy, or an iron-nickel alloy. A thickness of the second metal material may be less than or equal to 2 µm. A profile of the MMA may comprise: a C-shaped profile, an H-shaped profile, a U-shaped profile, an I-shaped profile, a loop-shaped profile, a cross-shaped profile, a bar-shaped profile, or a round profile. The invention refers to a coating for disposing on a surface of a component includes a first layer that includes a first plurality of MMAs disposed within a first binder, wherein each MMA, of the first plurality of MMAs, comprises: a first metal or semiconductor material; a dielectric material disposed on the first metal or semiconductor material; and a second metal material disposed on the dielectric material, wherein: a length dimension associated with the MMA is less than or equal to 200 µm, a width dimension associated with the MMA is less than or equal to 200 µm, and a thickness dimension associated with the MMA is less than or equal to 8 µm. The first plurality of MMAs may include a first MMA and a second MMA, wherein at least one of: a profile of the first MMA is different than a profile of the second MMA; a first difference between a length dimension of the first MMA and a length dimension of the second MMA satisfies a length difference threshold; a second difference between a width dimension of the first MMA and a width dimension of the second MMA satisfies a width difference threshold; or a third difference between a thickness dimension of the first MMA and a thickness dimension of the second MMA satisfies a thickness difference threshold. Respective reference planes of a set of MMAs, of the first plurality of MMAs, may be approximately parallel to the surface of the component. Respective reference planes of a set of MMAs, of the first plurality of MMAs, may be approximately perpendicular to the surface of the component. The first plurality of MMAs may include one or more sets of MMAs, wherein: each set of MMAs, of the one or more sets of MMAs, is aligned in a chain; and respective chains of the one or more sets of MMAs are approximately parallel to each other. The coating may further comprise a second layer that includes a second plurality of MMAs disposed within a second binder, wherein: respective reference planes of a first set of MMAs, of the first plurality of MMAs, are approximately parallel to respective reference planes of a second set of MMAs of the second plurality of MMAs. The coating may further comprise a second layer that includes a second pl