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EP-4089748-B1 - OPTICAL SUBSTRATE AND MANUFACTURING METHOD THEREOF

EP4089748B1EP 4089748 B1EP4089748 B1EP 4089748B1EP-4089748-B1

Inventors

  • CHEN, YI-AN
  • HUANG, WAN-LING
  • HSIEH, TSAU-HUA

Dates

Publication Date
20260513
Application Date
20220427

Claims (11)

  1. An optical substrate (100, 100b, 100c), comprising: a base layer (110); a bank layer (120, 120b), disposed on the base layer (110), comprising a first bank portion (121, 121b) separated from an edge (111) of the base layer (110), and having a first opening (124) and a second opening (125, 125b); a black matrix layer (150) disposed between base layer (110) and the bank layer (120, 120b); a wavelength conversion unit (130), disposed on the base layer (110), adjacent to a side (1211) of the first bank portion (121, 121b) away from the edge (111), wherein the wavelength conversion unit is disposed in the first opening, and the wavelength conversion unit is not disposed in the second opening; and a first encapsulating layer (140, 140b, 140c), disposed on bank layer (120, 120b), the wavelength conversion unit (130), and a portion (115, 115c) of the base layer (110) not covered by the bank layer (120, 120b) and the wavelength conversion unit (130); a driver substrate (180) disposed opposite to the base layer (110); an adhesive layer (170) disposed between the driver substrate (180) and the first encapsulating layer (140, 140b, 140c), wherein the optical substrate is characterized in that the first encapsulating layer contacts a top surface (1212) and a side surface (1213) of the first bank portion, and the first encapsulating layer contacts a top surface (131) of the wavelength conversion unit, and the side surface (1213) of the first bank portion (121, 121b) is adjacent to the second opening (125, 125b), a material of the bank layer comprises a light-absorbing material and/or a reflective material, and a material of the first encapsulating layer comprises transparent inorganic compounds having a water-resist effect, the portion of the base layer corresponds to and overlaps the second opening, a portion (152) of the black matrix layer (150) is not covered by the bank layer (120, 120b), and the first encapsulating layer (140, 140b, 140c) contacts the portion (152) of the black matrix layer (150) and the adhesive layer (170).
  2. The optical substrate (100) according to claim 1, wherein the bank layer (120) further comprises a second bank portion (122), wherein the second bank portion (122) is separated from the first bank portion (121), and the second bank portion (122) is closer to the edge (111) of the base layer (110) than the first bank portion (121).
  3. The optical substrate (100c) according to claim 1, further comprising: a light absorbing unit (190c), disposed at a side (1213) of the first bank portion (121, 121b) adjacent to the edge (111).
  4. The optical substrate (100c) according to claim 1, wherein a portion (115c) of the base layer (110) is not covered by the black matrix layer (150), and the first encapsulating layer (140b) contacts the portion (115c) of the base layer (110).
  5. The optical substrate (100c) according to claim 4, further comprising: a light absorbing unit (190c), disposed on the portion (115c) of the base layer (110).
  6. A manufacturing method of an optical substrate (100, 100b, 100c), comprising: providing a base layer (110); forming a black matrix layer (150) on the base layer (110); forming a bank layer (120, 120b) on the black matrix layer (150), wherein the bank layer (120, 120b) has a first opening (124) and a second opening (125, 125b); forming a wavelength conversion unit (130) in the first opening (124); and forming a first encapsulating layer (140, 140b, 140c) on the bank layer (120, 120b), the wavelength conversion unit (130), and a portion (115, 115c) of the base layer (110) corresponding to the second opening (125, 125b); providing a driver substrate (180); forming an adhesive layer between the driver substrate (180) and the first encapsulating layer (140, 140b, 140c), wherein the manufacturing method is characterized in that the first encapsulating layer contacts a top surface (1212) and a side surface (1213) of the first bank portion, and the first encapsulating layer contacts a top surface (131) of the wavelength conversion unit, and the side surface (1213) of the first bank portion (121, 121b) is adjacent to the second opening (125, 125b), a material of the bank layer comprises a light-absorbing material and/or a reflective material, and a material of the first encapsulating layer comprises transparent inorganic compounds having a water-resist effect, the wavelength conversion unit is not disposed in the second opening, the portion of the base layer corresponds to and overlaps the second opening, and the portion of the base layer is not covered by the bank layer and the wavelength conversion unit, and a portion (152) of the black matrix layer (150) is not covered by the bank layer (120, 120b), and the first encapsulating layer (140, 140b, 140c) contacts the portion (152) of the black matrix layer (150) and the adhesive layer (170).
  7. The manufacturing method according to claim 6, wherein the first encapsulating layer (140, 140b, 140c) contacts the black matrix layer (150) through the second opening (125, 125b).
  8. The manufacturing method according to claim 6, further comprising: patterning the black matrix layer (150) to form a third opening (154c), wherein the second opening (125b) overlaps the third opening (154c), and the first encapsulating layer (140b) contacts the base layer (110) through the second opening (125b) and the third opening (154c).
  9. The manufacturing method according to claim 8, further comprising: forming a light absorbing unit (190c) in the third opening (154c).
  10. The manufacturing method according to claim 6, further comprising: cutting the base layer (110) and the first encapsulating layer (140b, 140c) along a cutting line (114), wherein the cutting line (114) overlaps the second opening (125b).
  11. The manufacturing method according to claim 6, further comprising: cutting the base layer (110), the bank layer (120), and the first encapsulating layer (140) along a cutting line (114), wherein the cutting line (114) is adjacent to a side (125a) of the second opening (125) away from the first opening (124).

Description

BACKGROUND Technical Field The disclosure relates to an optical substrate and a manufacturing method thereof, and in particular, relates to an optical substrate and a manufacturing method thereof through which infiltration of water vapor may be reduced or reliability may be improved. Description of Related Art Display panels have been widely applied in electronic devices such as mobile phones, televisions, monitors, tablet computers, car displays, wearable devices, and desktop computers. With the vigorous development of electronic products, the demand for improved display quality of the electronic products continues to grow, and as such, the electronic devices used for display aim to provide more reliable display effects. CN 111505866 A relates to a display device including mutually independent sub-pixel areas, a light source that irradiates each sub-pixel area and a light control layer located on the light emitting side of the light source. EP 3282310 Al relates to a color filter including a substrate, a first color conversion layer, a second color conversion layer, a barrier wall and a light blocking layer. US 20111038070 A1 relates to a method for creating a color conversion layer using the ink jet method. US 2014/339495 Al relates to a light emitting including a micro LED device bonded to a bottom electrode, a top electrode in electrical contact with the micro LED device and a wavelength conversion layer around the micro LED device. SUMMARY The invention is set out in the appended set of claims. The following disclosure serves a better understanding of the present invention. The disclosure provides an optical substrate and a manufacturing method thereof through which infiltration of water vapor may be reduced or reliability may be improved. To make the aforementioned more comprehensible, several embodiments accompanied with drawings are described in detail as follows. BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings are included to provide a further understanding of the disclosure, and are incorporated in and constitute a part of this specification. The drawings illustrate exemplary embodiments of the disclosure and, together with the description, serve to explain the principles of the disclosure. FIG. 1A to FIG. 1E are local cross-sectional schematic views of a manufacturing method of an optical substrate according to a first embodiment of the disclosure.FIG. 2A to FIG. 2C are local cross-sectional schematic views of a manufacturing method of an optical substrate according to a second comparative example not falling under the claimed invention.FIG. 3A to FIG. 3C are local cross-sectional schematic views of a manufacturing method of an optical substrate according to a third embodiment of the disclosure.FIG. 4A to FIG. 4C are local cross-sectional schematic views of a manufacturing method of an optical substrate according to a fourth embodiment of the disclosure. DESCRIPTION OF THE EMBODIMENTS The accompanying drawings are included together with the detailed description provided below to provide a further understanding of the disclosure. Note that in order to make the accompanying drawings to be more comprehensible to readers and for the sake of clarity of the accompanying drawings, only part of the electronic device is depicted in the accompanying drawings of the disclosure, and specific components in the drawings are not depicted according to actual scales. In addition, the numbers and sizes of the components in each drawing are provided for illustration only and are not used to limit the scope of the disclosure. In the following specification and claims, the words "containing" and "including" are open-ended words and therefore should be interpreted as "containing but not limited to...". It should be understood that when a component or a film layer is referred to as being "on" or "connected to" another component or film layer, it can be directly on the another component or film layer or be directly connected to the another component or film layer, or an inserted component or film layer may be provided therebetween (not a direct connection). In contrast, when the component is referred to as being "directly on" another component or film layer or "directly connected to" another component or film layer, an inserted component or film layer is not provided therebetween. Although the terms "first", "second", "third"... may be used to describe various components, the components are not limited to these terms. These terms are only used to distinguish a single component from other components in the specification. The same terms may not be used in the claims, and the components in the claims may be replaced with first, second, third... according to the order declared by the components in the claims. Therefore, in the following description, the first component may be the second component in the claims. In the text, the terms "about", "approximately", "substantially", and "roughly" usually mean within 10