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EP-4101279-B1 - A METHOD AND A SEED INSERTION DEVICE FOR PLACING SEEDS INSIDE A GROWTH SUBSTRATE

EP4101279B1EP 4101279 B1EP4101279 B1EP 4101279B1EP-4101279-B1

Inventors

  • Kurg, Indrek
  • LEPP, Mattias

Dates

Publication Date
20260513
Application Date
20210607

Claims (11)

  1. A method for placing seeds (2) inside a growth substrate (1), wherein the method comprises the steps of: arranging a seed insertion device (3) in contact with the growth substrate (1) such that a tip (30) of the seed insertion device (3) penetrates through an outer surface (10) of the growth substrate (1); creating a growth pocket (4) inside the growth substrate (1) with the seed insertion device (3); supplying seeds (2) to the growth pocket (4) of the growth substrate (1) via the seed insertion device (3); removing the seed insertion device (3) from contact with the growth substrate (1); and characterized by the step of closing the growth pocket (4) of the growth substrate formed of growth material comprising elastic properties by elastic force of the growth substrate (1) for forming a closed growth pocket (4) such that the seeds (2) remain in the closed growth pocket (4) inside the growth substrate (1).
  2. A method for placing seeds (2) inside a growth substrate (1) according to claim 1, characterized in that the step of creating the growth pocket (4) comprises: arranging the seed insertion device (3) within the growth substrate (1) such that growth material of the growth substrate (1) separates and presses away from the seed insertion device when the seed insertion device (3) penetrates the growth substrate (1) thus forming the growth pocket (4).
  3. A method for placing seeds (2) inside a growth substrate (1) according to claim 2, characterized in that the step of arranging the seed insertion device (3) within the growth substrate (1) comprises: arranging an insertion tube (13) of the seed insertion device (3) to penetrate into the growth substrate (1); and forming the growth pocket (4) in the growth substrate (1) by the insertion tube (13).
  4. A method for placing seeds (2) inside a growth substrate (1) according to claim 2, characterized in that the step of arranging the seed insertion device (3) within the growth substrate (1) comprises: arranging an insertion tube (13) of the seed insertion device (3) to penetrate the growth substrate (1); pushing a pushing core (23) provided inside the insertion tube (13) out from the insertion tube (13) into the growth substrate (1); and forming the growth pocket (4) in the growth substrate (1) by the insertion core (23).
  5. A method for placing seeds (2) inside a growth substrate (1) according to claim 2, characterized in that the step of arranging the seed insertion device (3) within the growth substrate (1) comprises: arranging a spreading insert (33) of the seed insertion device (3) to penetrate into the growth substrate (1); spreading wings (33a, 33b) of the spreading insert (33) apart within the growth substrate (1); and forming the growth pocket (4) in the growth substrate (1) by the spreading insert (33).
  6. A method for placing seeds (2) inside a growth substrate (1) according to any preceding claim, characterized in that the step of supplying seeds (2) to the growth pocket (4) comprises: feeding seeds (2) to the seed insertion device (3); conveying the seeds (2) in the seed insertion device (3); and removing the seeds (2) from the tip (30) of the seed insertion device (3) to the growth pocket (4) formed by the seed insertion device (3).
  7. A method for placing seeds (2) inside a growth substrate (1) according to any preceding claim, characterized in that the step of closing the growth pocket (4) by elastic force of the growth substrate (1) comprises providing the growth substrate (1) having elastic properties.
  8. A method for placing seeds (2) inside a growth substrate (1) according to any preceding claim, characterized in that the method further comprises a step of applying pressing force to the growth substrate (1) for further closing the growth pocket (4).
  9. A method for placing seeds (2) inside a growth substrate (1) according to any preceding claim, characterized in that the method further comprises a step of applying heat to the growth substrate (1) for further closing the growth pocket (4).
  10. A seed insertion device (3) for placing seeds (2) inside a growth substrate (1), wherein the seed insertion device (3) comprises: a tip (30) arranged to penetrate the growth substrate (1) and to form a growth pocket (4) inside the growth substrate (1); an insertion tube (13) forming a feed channel (32) into which the seeds (2) are fed for feeding to the growth substrate (1), the feed channel (32) having a feed head (35) adapted to be arranged inside the growth substrate (1) such that the seeds (2) are fed through the feed head (35) to the growth pocket (4); and an aperture (31) provided at the feed head (35) through which the seeds (2) are fed from the feed channel (32) into the growth pocket (4) of the growth substrate (1), characterized in that the tip (30) is provided at the feed head (35) of the feed channel (32) such that the aperture (31) extends through the feed head (35) at the tip (30), and the feed head (35) of the insertion tube (13) is tapered.
  11. A seed insertion device (3) according to claim 10, characterized in that the seed insertion device (3) is further provided with a seed tube (20) connected to the feed channel (32), the seed tube (20) is connected to a pressurized air source such that the seed tube (20) is arranged to supply pressurized air together with the seeds (2) to the feed channel (32).

Description

FIELD OF THE INVENTION The present invention relates to a method for placing seeds inside a growth substrate and more particularly to a method for placing seeds as defined in the preamble of the independent claim 1. The present invention further relates to a seed insertion device and more particularly to a seed insertion device as defined in the preamble of the independent claim 10. BACKGROUND OF THE INVENTION Prior art document WO 2016/129996 A1 discloses a method of manufacturing a grow plug in which components of organic material are formed into a body and are dried and at least a single seed grain is deposited on the top side of the body and is connected to the body. Forming the organic material components into a dried body is realized by bonding together components of the organic material by means of a glue and drying them. One of the problems associated with the prior art is that the deposition of the seed on the top side of the body requires the step of attaching the seed to the grow plug which is performed as presented in the description of the document by bonding the seed to the body by glue. The method is therefore complex as it requires extra steps for the gluing as well as for drying the glue such that the seed remains in connection with the body. Further gluing of the seed to the body requires preciseness so that the seed is securely bonded to the body such that it can grow. Another problem is that exposing the seed to a solvent such as water used in the glue may have a negative impact on the viability of the seed. The prior art document US 4 703 704 A discloses a method for placing seeds inside a growth substrate according to the preamble of claim 1 and a seed insertion device for placing seeds inside a growth substrate according to the preamble of claim 10. BRIEF DESCRIPTION OF THE INVENTION An object of the present invention is to provide a method for placing seeds inside a growth substrate which is safe and simple to operate so that the seeds can be effectively provided inside the growth substrate. A further object of the present invention is to provide a seed insertion device which provides an effective tool for placing the seed inside the growth substrate without a need for adding any further components to the growth substrate. A still further object of the present invention is to provide a growth substrate in which seeds are placed with the method for placing seeds inside a growth pocket or with the seed insertion device according to the invention. The objects of the invention are achieved by a method for placing seeds inside a growth substrate and a seed insertion device which are characterized by what is stated in the independent claims. The preferred embodiments of the invention are disclosed in the dependent claims. The invention is based on the idea of simplifying the seed placing into the growth substrate so that the growth pocket and the seed placing is provided with the same device without multiple phases which require different tools. The invention is further based on the idea of placing seeds inside the growth substrate which keeps the seeds inside it only by forces that result from the inherent properties of the substrate. In a first aspect of the invention according to claim 1 a method for placing seeds inside a growth substrate comprises steps of arranging a seed insertion device in contact with the growth substrate such that a tip of the seed insertion device penetrates through an outer surface of the growth substrate; creating a growth pocket inside the growth substrate with the seed insertion device; supplying seeds to the growth pocket of the growth substrate via the seed insertion device; removing the seed insertion device from contact with the growth substrate; and closing the growth pocket of the growth substrate formed of growth material comprising elastic properties by elastic force of the growth substrate for forming a closed growth pocket such that the seeds remain in the closed growth pocket inside the growth substrate. The elastic modulus (Young's modulus) of the growth material of the growth substrate measured at macroscopic scale is at least 3 kPa. The seed insertion device preferably penetrates through the outer surface of the growth substrate such that the opening of the growth pocket formed inside the growth substrate is on the side of the growth substrate through which the plants formed by the seeds grow. The growth pocket together with the opening of the growth pocket closes when the seed insertion device is pulled out from the growth pocket. The growth substrate is formed of growth material which comprises elastic properties. The growth substrate may be a porous material with a structure of a sponge, foam, arrangement of fibrous elements or particles bound by elastic binder which provides the growth material elasticity at macroscopic scale. Alternatively, the growth substrate may comprise a thermal memory material that provides elastic forces when subjec