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EP-4160705-B1 - OPTICAL WAVEGUIDE PACKAGE AND LIGHT EMITTING DEVICE

EP4160705B1EP 4160705 B1EP4160705 B1EP 4160705B1EP-4160705-B1

Inventors

  • ITAKURA, YOSHIAKI

Dates

Publication Date
20260506
Application Date
20210518

Claims (14)

  1. An optical waveguide package (2), comprising: a substrate (7) including a first surface (5) and a second surface (6) opposite to the first surface (5); a cladding (11) on the second surface (6), the cladding (11) including a third surface (8) facing the second surface (6), a fourth surface (9) opposite to the third surface (8), and an element-receiving portion (10) with an opening in the fourth surface (9); a core (12) in the cladding (11), the core (12) extending from the element-receiving portion (10); and a first metal member (14) in the element-receiving portion (10) in a plan view as viewed in a direction toward the fourth surface (9), the first metal member (14) including an element mount (13), wherein the first metal member (14) is connected to a second metal member (16) with a first via conductor (15) extending through the substrate (7) from the first surface (5) to the second surface (6), wherein the first metal member (14) includes a first area (14a) being the element mount (13) and a second area (14b) other than the first area (14a), characterized in that the first via conductor (15) is in contact with the second area (14b) and located to avoid the first area (14a).
  2. The optical waveguide package (2) according to claim 1, wherein the element-receiving portion (10) extends from the fourth surface (9) to the third surface (8).
  3. The optical waveguide package (2) according to claim 1 or 2, wherein the first metal member (14) is located in the opening alone in the plan view.
  4. The optical waveguide package (2) according to any one of claims 1 to 3, wherein the second metal member (16) is larger than the first metal member (14) in a transparent plan view as viewed through in a direction toward the fourth surface (9).
  5. The optical waveguide package (2) according to claim 4, wherein the second surface (6) includes a third area (25) inward from an outer periphery of the cladding (11) and a fourth area (26) other than the third area (25), the optical waveguide package (2) further includes a third metal member (27) located in the fourth area (26), and the third metal member (27) is connected to the second metal member (16) with a second via conductor (28) extending through the substrate (7) from the first surface (5) to the second surface (6).
  6. The optical waveguide package (2) according to any one of claims 1 to 3, wherein the first metal member (14) and the second metal member (16) have a same shape and are plane symmetrical with respect to the first surface (5).
  7. The optical waveguide package (2) according to any one of claims 1 to 6, wherein the second metal member (16) is on the first surface (5), and the second metal member (16) includes a flat surface opposite to a surface facing the first surface (5).
  8. The optical waveguide package (2) according to any one of claims 1 to 7, wherein the second metal member (16) is on the first surface (5), and the second metal member (16) includes a surface opposite to a flat surface facing the first surface (5), the first surface (5) includes a fifth area (29) in which the second metal member (16) is located and a sixth area (30) other than the fifth area (29), the optical waveguide package (2) further includes a fourth metal member (31) in the sixth area (30), and the fourth metal member (31) includes, similarly to the second metal member (16), a flat surface opposite to a surface facing the first surface (5).
  9. The optical waveguide package (2) according to any one of claims 1 to 8, wherein the second metal member (16) is on the first surface (5), the first surface (5) includes a fifth area (29) in which the second metal member (16) is located and a sixth area (30) other than the fifth area (29), the optical waveguide package (2) further includes a fourth metal member (31) in the sixth area (30), and the second metal member (16) and the fourth metal member (31) are line symmetrical with respect to a central line (L1) including a center of the first surface (5).
  10. The optical waveguide package (2) according to any one of claims 1 to 9, wherein a contact area between the first via conductor (15) and the first metal member (14) is larger than or as large as the first area (14a).
  11. The optical waveguide package (2) according to any one of claims 1 to 10, further comprising: a lid (23) sealing the element-receiving portion (10).
  12. The optical waveguide package (2) according to claim 11, further comprising: a metal layer between the element-receiving portion (10) and the lid (23).
  13. A light-emitting device (1), comprising: the optical waveguide package (2) according to any one of claims 1 to 12; a light-emitting element (3R, 3G, 3B) connected to the first metal member (14); and a lens (4) on an optical path of light emitted from the core (12).
  14. The light-emitting device (1) according to claim 13, wherein the lid (23) includes a recess, and the light-emitting element (3R, 3G, 3B) extends from the element-receiving portion (10) into the recess.

Description

TECHNICAL FIELD The present disclosure relates to an optical waveguide package and a light-emitting device. BACKGROUND OF INVENTION A known technique is described in, for example, Patent Literature 1. US 10 663 660 B2 discloses an optical subassembly comprising: a substrate; a waveguide disposed on the substrate, wherein the waveguide comprises a patterned stack of adjacent and discrete SiON layers, wherein the stack of adjacent and discrete SiON layers has a stress having a magnitude less than or equal to 20 MPa and an optical loss less than or equal to 1 dB/cm; an electrical interconnection layer disposed on the substrate and on the waveguide, wherein the electrical interconnection layer comprises at least an electrical interconnection line; a device disposed on the substrate and aligned to the waveguide, wherein the device comprises at least a device terminal configured to be coupled to the electrical interconnection A similar assembly is disclosed in US 5 521 992 A. CITATION LIST PATENT LITERATURE Patent Literature 1: Japanese Patent No. 4579868 SUMMARY The present invention provides an optical waveguide package according to claim 1 and a light-emitting device according to claim 13. Further embodiments of the present invention are disclosed in the dependent claims. BRIEF DESCRIPTION OF THE DRAWINGS The objects, features, and advantages of the present disclosure will become more apparent from the following detailed description and the drawings. FIG. 1 is a cross-sectional view of a light-emitting device 1 including an optical waveguide package 2 according to an embodiment not according to the claimed invention.FIG. 2 is a plan view of the light-emitting device 1.FIG. 3 is a perspective view of the light-emitting device 1.FIG. 4A is a cross-sectional view of a light-emitting device 1a according to an embodiment according to the claimed invention.FIG. 4B is a plan view of the light-emitting device 1a illustrating its internal structure.FIG. 5A is a cross-sectional view of a light-emitting device 1b according to an embodiment according to the claimed invention.FIG. 5B is a bottom view of the light-emitting device 1b.FIG. 6A is a cross-sectional view of a light-emitting device 1b with an example structure similar to the structure according to the the embodiment of figure 5A.FIG. 6B is a bottom view of the light-emitting device 1b.FIG. 7 is a partial cross-sectional view of a light-emitting device 1c according to an embodiment not according to the claimed invention.FIG. 8A is a cross-sectional view of a light-emitting device 1d according to an embodiment according to the claimed invention.FIG. 8B is a plan view of the light-emitting device 1d without a lid 23.FIG. 8C is a bottom view of the light-emitting device 1d.FIG. 9A is a cross-sectional view of a light-emitting device 1e an embodiment according to the claimed invention.FIG. 9B is a plan view of the light-emitting device 1e without the lid 23.FIG. 9C is a bottom view of the light-emitting device 1e.FIG. 10A is a cross-sectional view of a light-emitting device 1f according to an eighth embodiment.FIG. 10B is a plan view of the light-emitting device 1f without the lid 23.FIG. 10C is a bottom view of the light-emitting device 1f.FIG. 11A is a cross-sectional view of a light-emitting device 1g according to an embodiment according to the claimed invention.FIG. 11B is a plan view of the light-emitting device 1g without the lid 23.FIG. 11C is a bottom view of the light-emitting device 1g.FIG. 12A is a cross-sectional view of a light-emitting device 1h according to an embodiment not according to the claimed invention.FIG. 12B is a plan view of the light-emitting device 1h without the lid 23.FIG. 12C is a bottom view of the light-emitting device 1h.FIG. 13 is a cross-sectional view of a light-emitting device 1i according to an embodiment not according to the claimed invention. DESCRIPTION OF EMBODIMENTS The structure that forms the basis of an optical waveguide package according to one or more embodiments of the present disclosure and a light-emitting device including the optical waveguide package includes an optical integrated circuit including a gas-barrier optical waveguide including a non gas-barrier core and a non gas-barrier cladding having a permeability coefficient for helium lower than or equal to 5 × 10-9 cm3(STP)mm/(cm2·sec·cmHg) (25 °C) coated with a gas-barrier thin film, a gas-barrier cap, an optical element including a light receiver or a light emitter mounted on a first surface of the optical waveguide at a position to be optically coupled to the core, and a metal wiring member on the first surface of the waveguide and direct below the thin film to be electrically connected to the optical element on the first surface of the optical waveguide. To mount the optical waveguide and the cap on the optical integrated circuit, the thin film on the first surface of the optical waveguide and on the metal wiring member and a second surface of the cap are jo