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EP-4188054-B1 - DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME

EP4188054B1EP 4188054 B1EP4188054 B1EP 4188054B1EP-4188054-B1

Inventors

  • YOU, CHUNG

Dates

Publication Date
20260506
Application Date
20221125

Claims (15)

  1. A display apparatus (1) comprising: a first substrate (100) comprising a display area (DA), and a pad area (PADA) located outside the display area (DA); a lower conductive layer (200) located on the first substrate (100), and comprising a fan-out wiring (FWL) extending from the pad area to the display area (DA); a first inorganic insulating layer (410) located on the lower conductive layer (200); a semiconductor layer (Act) located on the first inorganic insulating layer (410), and overlapping with the display area (DA); a second inorganic insulating layer (420) covering the semiconductor layer (Act), and overlapping with the display area (DA) and the pad area (PADA); a pad electrode (PE) on the second inorganic insulating layer (420), the pad electrode (PE) overlapping with the pad area (PADA), and electrically connected to the fan-out wiring (FWL); and a display element layer (DEL) located on the second inorganic insulating layer (420), and comprising a display element (DPE) overlapping with the display area (DA) characterized by a first conductive layer (CDL1) located on the second inorganic insulating layer (420), and comprising a gate electrode (GE) overlapping with the semiconductor layer (Act); a third inorganic insulating layer (430) covering the gate electrode (GE); and a second conductive layer (CDL2) located between the third inorganic insulating layer (430) and the display element layer (DEL), and comprising a source electrode (SE) and a drain electrode (DE), wherein the lower conductive layer (200) further comprises a first lower connection wiring (LCL1) overlapping with the display area (DA), and wherein one of the source electrode (SE) and the drain electrode (DE) is electrically connected to the first lower connection wiring (LCL1) through a first insulating layer hole (410IH) of the first inorganic insulating layer (410), a semiconductor layer hole (ActH) of the semiconductor layer (Act), a second insulating layer hole (420IH) of the second inorganic insulating layer (420), and a third insulating layer hole (430IH) of the third inorganic insulating layer (430), which overlap each other.
  2. The display apparatus (1) of claim 1, wherein the pad electrode (PE) is electrically connected to the fan-out wiring (FWL) through a first pad hole (410PH) of the first inorganic insulating layer (410) and a second pad hole (420PH) of the second inorganic insulating layer (420).
  3. The display apparatus (1) of claims 1 or 2, wherein the lower conductive layer (200) comprises: a first layer (L1) comprising a first metal; and a second layer (L2) located on the first layer (L1), and comprising a second metal different from the first metal.
  4. The display apparatus (1) of claim 3, wherein the first metal comprises aluminum, and the second metal comprises titanium.
  5. The display apparatus (1) of claims 3 or 4, wherein the first layer (L1) comprises aluminum and an aluminum oxide, and the second layer (L2) comprises titanium.
  6. The display apparatus (1) of 1 or 2, wherein the lower conductive layer (200) comprises: a first layer (L1) comprising a first metal; and a second layer (L2) located on the first layer (L1), and comprising an inorganic material.
  7. The display apparatus (1) of at least one of claims 1 to 6, further comprising a planarization layer (300) located between the lower conductive layer (200) and the first inorganic insulating layer (410).
  8. The display apparatus (1) of at least one of claims 1 to 7, further comprising a fourth inorganic insulating layer (440) covering at least a part of the pad electrode (PE), and comprising an upper pad hole (440PH) overlapping with the pad electrode (PE).
  9. The display apparatus (1) of at least one of claims 1 to 8, further comprising: a second substrate (500) located on the display element layer (DEL); and a sealing member (600) located between the first substrate (100) and the second substrate (500), and surrounding around a periphery of the display area (DA), wherein the sealing member (600) at least partially overlaps with the lower conductive layer (200) in a plan view.
  10. The display apparatus (1) of at least one of claims 1 to 9, wherein the first substrate (100) comprises glass.
  11. A method of manufacturing a display apparatus (1), the method comprising the steps of: forming a lower conductive layer (200) on a first substrate (100); sequentially forming a first inorganic insulating layer (410), a semiconductor layer (Act), a second inorganic insulating layer (420), a first conductive layer (CDL1), and a third inorganic insulating layer (430) on the lower conductive layer (200); characterized by forming a first insulating layer hole (410IH) in the first inorganic insulating layer (410), a semiconductor layer hole (ActH) in the semiconductor layer (Act), a second insulating layer hole (420IH) in the second inorganic insulating layer (420), and a third insulating layer hole (430IH) in the third inorganic insulating layer (430); and forming a second conductive layer (CDL2) located on the third inorganic insulating layer (430), and electrically connected to the lower conductive layer (200) through the first insulating layer hole (410IH), the semiconductor layer hole (ActH), the second insulating layer hole (420IH), and the third insulating layer hole (430IH), which overlap each other.
  12. The method of claim 11, wherein the step of forming of the lower conductive layer (200) comprises: forming a first layer (L1) comprising a first metal; forming a second layer (L2) on the first layer (L1), the second layer (L2) comprising at least one inorganic material or a second metal that is different from the first metal; and etching the first layer (L1) and the second layer (L2).
  13. The method of claim 12, wherein the forming of the first layer (L1) comprises oxidizing the first layer (L1).
  14. The method of claims 12 or 13, wherein the step of forming of the lower conductive layer (200) further comprises heat-treating the first layer (L1) and the second layer (L2) before the etching of the first layer (L1) and the second layer (L2).
  15. The method of at least one of claims 11 to 14, further comprising the step of forming a fourth inorganic insulating layer (440) on the second conductive layer (CDL2), wherein: the first substrate (100) comprises a display area (DA), and a pad area (PADA) located outside the display area (DA); the second conductive layer (CDL2) comprises a pad electrode (PE) overlapping with the pad area (PADA); and the fourth inorganic insulating layer (440) covers at least a part of the pad electrode (PE), and comprises an upper pad hole (440PH) overlapping with the pad electrode (PE).

Description

BACKGROUND 1. Field Aspects of one or more embodiments of the present disclosure relate to a display apparatus, and a method of manufacturing the same. 2. Description of the Related Art Display apparatuses visually display data. A display apparatus is used as a display for a small electronic product, for example, such as a mobile phone, or is used as a display for a large electronic product, for example, such as a television. Also, a display apparatus may be used as a display for other electronic products, for example, such as a tablet PC or a laptop computer. A display apparatus may include a plurality of sub-pixels that receive an electrical signal to emit light in order to display an image to the outside. Each of the plurality of sub-pixels may include a display element. Recently, there may be increasing demand for a display apparatus that uses a wiring having low resistance and high reliability. US 2021/091163 A1 discloses a display apparatus, as known in the prior art. SUMMARY The subject matter of the present invention is defined in independent claims 1 and 11. The invention relates to a display apparatus including a wiring having low resistance and high reliability, and a method of manufacturing the display apparatus. However, the present disclosure is not limited to the aspects and features set forth above, and additional aspects and features will be set forth, in part, in the description that follows, and in part, will be apparent from the description, or may be learned by practicing one or more of the presented embodiments of the present disclosure. The above mentioned problem will be solved by a display apparatus including a first substrate, having a display area, a pad area outside the display area; a lower conductive layer located on the first substrate, and including a fan-out wiring extending from the pad area to the display area; a first inorganic insulating layer located on the lower conductive layer; a semiconductor layer located on the first inorganic insulating layer, and overlapping with the display area; a second inorganic insulating layer covering the semiconductor layer, and overlapping with the display area and the pad area; a pad electrode on the second inorganic insulating layer, the pad electrode overlapping with the pad area, and electrically connected to the fan-out wiring; and a display element layer located on the second inorganic insulating layer, and including a display element overlapping with the display area. In an embodiment, the pad electrode may be electrically connected to the fan-out wiring through a first pad hole of the first inorganic insulating layer and a second pad hole of the second inorganic insulating layer. In an embodiment, the lower conductive layer may include: a first layer including a first metal; and a second layer located on the first layer, and including a second metal different from the first metal. In an embodiment, the first metal may include aluminum, and the second metal may include titanium. In an embodiment, the first layer may include aluminum and an aluminum oxide, and the second layer may include titanium. In an embodiment, the lower conductive layer may include: a first layer including a first metal; and a second layer located on the first layer, and including an inorganic material. In an embodiment, the display apparatus may further include a planarization layer located between the lower conductive layer and the first inorganic insulating layer. In an embodiment, the display apparatus may further include: a first conductive layer located on the second inorganic insulating layer, and including a gate electrode overlapping with the semiconductor layer; a third inorganic insulating layer covering the gate electrode; and a second conductive layer located between the third inorganic insulating layer and the display element layer, and including a source electrode and a drain electrode. The lower conductive layer may further include a first lower connection wiring overlapping with the display area, and one of the source electrode and the drain electrode may be electrically connected to the first lower connection wiring through a first insulating layer hole of the first inorganic insulating layer, a semiconductor layer hole of the semiconductor layer, a second insulating layer hole of the second inorganic insulating layer, and a third insulating layer hole of the third inorganic insulating layer. In an embodiment, the display apparatus may further include: a third inorganic insulating layer located on the second inorganic insulating layer; and a first connection wiring located on the third inorganic insulating layer. The lower conductive layer may further include a second lower connection wiring, and the first connection wiring may be electrically connected to the second lower connection wiring through a hole of the first inorganic insulating layer, a hole of the second inorganic insulating layer, and a hole of the third inorganic insulating la