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EP-4239445-B1 - ELECTRONIC DEVICE ASSEMBLY, EXPANSION COMPONENT THEREOF, AND HEAT DISSIPATION MODULE

EP4239445B1EP 4239445 B1EP4239445 B1EP 4239445B1EP-4239445-B1

Inventors

  • YANG, JUI-LIN
  • HSU, WAN-LIN
  • CHOU, HSIN-CHIH
  • LEE, KUN-CHENG
  • CHANG, JUEI-CHI

Dates

Publication Date
20260513
Application Date
20230207

Claims (14)

  1. An expansion component (E1) for a host electronic device, comprising: a case (H, H1), comprising a bottom plate (H12), a top plate (H11), and an accommodating space (S) located between the bottom plate (H12) and the top plate (H11); a partition (10), arranged in the accommodating space (S) and parallel to the bottom plate (H12), wherein the partition (10) divides the accommodating space (S) into an upper compartment (S11) and a lower compartment (S12); a plurality of electronic components (A), scattered in the upper compartment (S11) and the lower compartment (S12), wherein one of the electronic components (A) located in the upper compartment (S11) abuts against the partition (10); and a heat dissipation module (30), arranged in the case (H, H1) and comprising: a flow guide case (33), comprising an input section (331) and an output section (332) that are connected, wherein an angle is defined between an extending direction of the input section (331) and an extending direction of the output section (332), the flow guide case (33) is accommodated in the lower compartment (S12), and the output section (332) abuts against the partition (10) and one of the electronic components (A) located in the lower compartment (S12); and a fan (31), arranged at a junction of the input section (331) and the output section (332).
  2. The expansion component (E1) according to claim 1, wherein the bottom plate (H12) comprises a plurality of through holes (H121), and the flow guide case (33) comprises an edge (334), the edge (334) surrounds and forms an opening (3341), the edge (334) abuts against the bottom plate (H12), and the opening (3341) covers the through holes (H121).
  3. The expansion component (E1) according to claim 2, wherein the through holes (H121) comprise a plurality of first through holes (H1211) and a plurality of second through holes (H1212), the first through holes (H1211) correspond to a position of the input section (331), and the second through holes (H1212) correspond to a position of the output section (332).
  4. The expansion component (E1) according to claim 2, wherein the flow guide case (33) comprises an inner surface (335), the inner surface (335) faces toward the bottom plate (H12), the output section (332) comprises a first heat dissipation section (3321) and a second heat dissipation section (3322), the inner surface (335) has a first height (L1) between the first heat dissipation section (3321) and the opening (3341), the inner surface (335) has a second height (L2) between the second heat dissipation section (3322) and the opening (3341), and the first height (L1) is different from the second height (L2).
  5. The expansion component (E1) according to claim 4, wherein the first heat dissipation section (3321) abuts against the electronic component (A) located in the lower compartment (S12), and the second heat dissipation section (3322) abuts against a position at which the partition (10) corresponds to the electronic component (A) located in the upper compartment (S11).
  6. The expansion component (E1) according to claim 4, wherein the first heat dissipation section (3321) is farther away from the fan (31) than the second heat dissipation section (3322), and the first height (L1) is less than the second height (L2).
  7. The expansion component (E1) according to claim 6, wherein the inner surface (335) is inclined to the bottom plate (H12) in an extending direction between the first heat dissipation section (3321) and the second heat dissipation section (3322).
  8. The expansion component (E1) according to claim 4, wherein the output section (332) further comprises a third heat dissipation section (3323), the inner surface (335) has a third height (L3) between the third heat dissipation section (3323) and the opening (3341), and the third height (L3) is different from the first height (L1) and the second height (L2).
  9. The expansion component (E1) according to claim 8, wherein the third heat dissipation section (3323) is closer to the fan (31) than the first heat dissipation section (3321) and the second heat dissipation section (3322), and the third heat dissipation section (3323) abuts against another electronic component (A) located in the lower compartment (S12).
  10. The expansion component (E1) according to claim 8, wherein the third heat dissipation section (3323) is flush with the fan (31), and the third height (L3) is greater than the first height (L1) and less than the second height (L2).
  11. The expansion component (E1) according to claim 4, wherein the input section (331) of the flow guide case (33) comprises an inlet section (3311), the inlet section (3311) has a first end (3313) and a second end (3314), the inner surface (335) is inclined to the bottom plate (H12) at the inlet section (3311), the second end (3314) is closer to the fan (31) than the first end (3313), and a height of the inner surface (335) from the second end (3314) to the opening (3341) is greater than a height of the inner surface (335) from the first end (3313) to the opening (3341).
  12. The expansion component (E1) according to claim 11, wherein the input section (331) of the flow guide case (33) further comprises a collecting section (3312), the collecting section (3312) is located between the inlet section (3311) and the fan (31), the inner surface (335) has the second height (L2) from the collecting section (3312) to the opening (3341), and the collecting section (3312) abuts against the partition (10).
  13. The expansion component (E1) according to claim 4, wherein the fan (31) comprises a case (311), the case (311) is provided with an air inlet (3111) and an air outlet (3112) that are perpendicular to each other, the air inlet (3111) faces toward the inner surface (335) and is spaced apart from the inner surface (335) by a distance, and the air outlet (3112) faces toward the output section (332).
  14. An electronic device assembly, characterized by comprising: the expansion component (E1) as claimed in any one of the preceding claims, comprising: a first connector (A2), electrically connected to a first circuit board (A1) and exposed from the top plate (H11) at an opening (H111), wherein the top plate (H11) is provided with the opening (H111); and a host (E2), comprising: a second case (H, H2), having a second accommodating space (S2); a main circuit board (A3), accommodated in the second accommodating space (S2); and a main connector (A4), electrically connected to the main circuit board (A3) and arranged on a surface of the second case (H, H2), wherein after the host (E2) is assembled to the expansion component (E1), the second case (H, H2) covers the top plate (H11) of the first case (H, H1) and the opening (H111), and the first connector (A2) is electrically connected to the main connector (A4).

Description

BACKGROUND OF THE INVENTION The present invention relates to an electronic device assembly and an expansion component thereof. With the popularization of electronic products, users have increasingly diversified requirements for the performance of electronic devices. To meet various requirements of the users, a quantity of electronic components in the electronic device is increasing, which also causes problems of space configuration and heat dissipation in the electronic device. How to increase configurations of the electronic components in a limited space of the electronic device to improve efficiency while taking into account a heat dissipation effect is a problem that the inventors are urgently trying to resolve. WO 2021/185018 A1 discloses a wireless charger for charging a terminal device. The terminal device is provided with a display surface and a back surface which are opposite to each other. The wireless charger comprises a housing having a contact plate for being in contact with the back surface of the terminal device; a wireless charging module; a first fan capable of dissipating heat of the wireless charging module, wherein the wireless charging module and the first fan are both provided in the housing, and the position of the housing close to the first fan is provided with an air inlet; and an airflow guide structure provided on the side surface of the housing adjacent to the contact plate and extending towards the display surface of the terminal device, wherein a flow channel is provided in the airflow guide structure, a first air outlet communicated with the flow channel is provided at the position of the airflow guide structure close to the display surface of the terminal device; an air passing opening communicated with a space where the first fan is located is provided at the position of the housing provided with the airflow guide structure, and the air passing opening is communicated with the flow channel. WO 2015/126270 A1 discloses a notebook cooling stand. US 2007/0193720 A1 discloses a composite heat-dissipating module including a heat-dissipating plate, an impeller, and a pump. US 2002/0105783 A1 discloses a portable computer comprising a housing, a circuit board arranged in the housing, and a first expansion connector connected to the circuit board. An expansion apparatus for expanding the function of the portable computer is detachably coupled with the portable computer. This expansion apparatus comprises a flat box-shape base, a circuit board arranged in the base, and a second expansion connector connected to the circuit board. The first expansion connector and the second expansion connector are configured to engage with each other. SUMMARY OF THE INVENTION According to the present invention, an expansion component according to claim 1 and an electronic device assembly according to claim 14 are provided. Preferred embodiments are further defined in the dependent claims. The present invention provides an expansion component, including a case, a partition, a plurality of electronic components, and a heat dissipation module. The case includes a bottom plate, a top plate, and an accommodating space located between the bottom plate and the top plate. The partition is arranged in the accommodating space and parallel to the bottom plate, and the partition divides the accommodating space into an upper compartment and a lower compartment. The electronic components are scattered in the upper compartment and the lower compartment, where one of the electronic components located in the upper compartment abuts against the partition. The heat dissipation module is arranged in the case and includes a flow guide case and a fan. The flow guide case includes an input section and an output section that are connected, an angle is defined between an extending direction of the input section and an extending direction of the output section, the flow guide case is accommodated in the lower compartment, and the output section abuts against the partition and one of the electronic components located in the lower compartment. The fan is arranged at a junction of the input section and the output section. In some embodiments, the bottom plate includes through holes, and the flow guide case includes an edge, the edge surrounds and forms an opening, the edge abuts against the bottom plate, and the opening covers the through holes. In some embodiments, the through holes include first through holes and second through holes, the first through holes correspond to a position of the input section, and the second through holes correspond to a position of the output section. In some embodiments, the flow guide case includes an inner surface, the inner surface faces toward the bottom plate, the output section includes a first heat dissipation section and a second heat dissipation section, the inner surface has a first height between the first heat dissipation section and the opening, the inner surface has a second height bet