EP-4239446-B1 - ELECTRONIC DEVICE ASSEMBLY AND EXPANSION COMPONENT THEREOF
Inventors
- YANG, JUI-LIN
- HSU, WAN-LIN
- CHOU, HSIN-CHIH
- LEE, KUN-CHENG
- CHANG, JUEI-CHI
Dates
- Publication Date
- 20260506
- Application Date
- 20230207
Claims (3)
- An electronic device assembly, comprising: an expansion component (E1), comprising: a first case (H1), comprising a top plate (H11) and a bottom plate (H12) that are opposite to each other, wherein a first accommodating space (S1) is formed between the top plate (H11) and the bottom plate (H12), and the top plate (H11) is provided with an opening (H111); a first circuit board (A1), arranged in the first accommodating space (S1); and at least one first connector (A2), electrically connected to the first circuit board (A1), wherein the at least one first connector (A2) is exposed from the top plate (H11) at the opening (H111); and a host (E2), comprising: a second case (H2), comprising a first surface (H21) and a second surface (H22) that are opposite to each other, wherein a second accommodating space (S2) is formed between the first surface (H21) and the second surface (H22); a main circuit board (A3), arranged in the second accommodating space (S2); and at least one main connector (A4), electrically connected to the main circuit board (A3) and exposed from the second surface (H22), wherein when the host (E2) is assembled to the expansion component (E1), the second surface (H22) of the second case (H2) covers the top plate (H11) of the first case (H1) and the opening (H111), and the at least one first connector (A2) is electrically connected to the at least one main connector (A4), so that the host (E2) is electrically connected to the first circuit board (A1) inside the expansion component (E1), to provide function expansion, characterized in that the expansion component (E1) further comprises a partition (10), wherein the partition (10) is parallel to the top plate (H11) and is arranged in the first accommodating space (S1), and divides the first accommodating space (S1) of the expansion component (E1) into an upper compartment (S11) and a lower compartment (S12).
- The electronic device assembly according to claim 1, wherein the opening (H111) is located in the middle of the expansion component (E1), and the expansion component (E1) further comprises a waterproof member (20) that is arranged around the opening (H111).
- The electronic device assembly according to claim 1, further comprising a second circuit board (A5), a plurality of batteries (A6), and a second connector (A7), wherein the first circuit board (A1) is arranged in the upper compartment (S11), the second circuit board (A5) and the plurality of batteries (A6) are arranged in the lower compartment (S12) and are electrically connected to each other, and the second connector (A7) penetrates the partition (10) and is electrically connected to the first circuit board (A1) and the second circuit board (A5).
Description
BACKGROUND OF THE INVENTION The present invention relates to an electronic device assembly and an expansion component thereof. With the popularization of electronic products, users have increasingly diversified requirements for the performance of electronic devices. To meet various requirements of the users, a quantity of electronic components in the electronic device is increasing, which also causes problems of space configuration and heat dissipation in the electronic device. How to increase configurations of the electronic components in a limited space of the electronic device to improve efficiency while taking into account a heat dissipation effect is a problem that the inventors are urgently trying to resolve. US 2002/0105783 A1 discloses a portable computer comprising a housing, a circuit board arranged in the housing, and a first expansion connector connected to the circuit board. An expansion apparatus for expanding the function of the portable computer is detachably coupled with the portable computer. This expansion apparatus comprises a flat box-shape base, a circuit board arranged in the base, and a second expansion connector connected to the circuit board. The first expansion connector and the second expansion connector are configured to engage with each other. US 10,468,812 B1 discloses an electrical connector structure used for a dock connector, comprising a waterproof ring. WO 2015/126270 A1 discloses a notebook cooling stand. US 2019/346893 A1 discloses a mobile device temperature-regulating case configured to at least partially encase a side of the mobile device and conductively cool and/or heat the side of the mobile device. US 20130083254 A1 discloses an electronic apparatus including a housing with a wall disposed therein. SUMMARY OF THE INVENTION The present invention is defined in the appended claims. BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a schematic three-dimensional external view of an embodiment of an electronic device assembly according to the present invention;FIG. 2 is a first schematic three-dimensional exploded diagram of an embodiment of an electronic device assembly according to the present invention;FIG. 3 is a second schematic three-dimensional exploded diagram of an embodiment of an electronic device assembly according to the present invention;FIG. 4 is a schematic cross-sectional view drawn along a division line 4-4 in FIG. 1;FIG. 5 is a schematic three-dimensional external view of an embodiment of an expansion component in an electronic device assembly according to the present invention;FIG. 6 is a schematic cross-sectional view drawn along a division line 6-6 in FIG. 2;FIG. 7 is a schematic cross-sectional view drawn along a division line 7-7 in FIG. 3;FIG. 8 is a schematic diagram of a partial structure of an embodiment of an expansion component according to the present invention;FIG. 9 is a first schematic exploded view of a partial structure of another embodiment of an expansion component according to the present invention;FIG. 10 is a second schematic exploded view of a partial structure of another embodiment of an expansion component according to the present invention;FIG. 11 is a schematic cross-sectional view drawn along a division line 11-11 in FIG. 2;FIG. 12 is a schematic partial enlarged view of a circle 12 in FIG. 11;FIG. 13 is a schematic three-dimensional external view of an embodiment of a heat dissipation module in an expansion component according to the present invention; andFIG. 14 is a schematic cross-sectional view drawn along a division line 14-14 in FIG. 13. DETAILED DESCRIPTION OF THE INVENTION Referring to FIG. 1 to FIG. 4, FIG. 1 is a schematic three-dimensional external view of an embodiment of an electronic device assembly according to the present invention; FIG. 2 is a first schematic three-dimensional exploded diagram of an embodiment of an electronic device assembly according to the present invention; FIG. 3 is a second schematic three-dimensional exploded diagram of an embodiment of an electronic device assembly according to the present invention; and FIG. 4 is a schematic cross-sectional view drawn along a division line 4-4 in FIG. 1. The present invention provides an electronic device assembly, including a plurality of overlapping electronic devices E. The electronic devices E include cases H and electronic components A, each of the cases H has an accommodating space S, the electronic components A are assembled in the accommodating space S of each of the cases H, and the electronic components A in adjacent cases H are assembled in an overlapping manner in the two cases H and can be electrically connected to each other. Therefore, the electronic device assembly may use the accommodating spaces S of the plurality of electronic devices E without external wiring to increase a quantity and types of assembled electronic components A, thereby satisfying diversified electronic function expansion. Referring to FIG. 4, in the electronic device a