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EP-4325154-B1 - VAPOR CHAMBER, HOUSING ASSEMBLY AND ELECTRONIC DEVICE

EP4325154B1EP 4325154 B1EP4325154 B1EP 4325154B1EP-4325154-B1

Inventors

  • CHEN, ANQI
  • HUANG, Duzi
  • LIU, MINGYAN

Dates

Publication Date
20260506
Application Date
20221028

Claims (13)

  1. A housing assembly, comprising: a vapor chamber (100), comprising: a body (110) comprising an accommodating cavity (111); a wick structure layer (120) located in the accommodating cavity (111); and a wick structure channel (130) located in the accommodating cavity (111); wherein the wick structure channel (130) is located in the wick structure layer (120), and fluid resistance of the wick structure channel (130) is smaller than fluid resistance of the wick structure layer (120); characterised in that the housing assembly further comprises a housing body (200), wherein the housing body (200) comprises a mounting groove (211), and the vapor chamber (100) is at least partially located in the mounting groove (211).
  2. The housing assembly according to claim 1, wherein the wick structure layer (120) comprises an evaporation region (121), and the wick structure channel (130) extends from the evaporation region (121) in a direction away from the evaporation region (121).
  3. The housing assembly according to claim 2, wherein the wick structure layer (120) comprises a condensation region (122), the wick structure channel (130) extends from the evaporation region (121) to the condensation region (122), a first fluid space (140) extending from the evaporation region (121) to the condensation region (122) is located in the wick structure layer (120), and the first fluid space (140) is at least used for circulation of a gaseous medium.
  4. The housing assembly according to claim 3, wherein a plurality of the first fluid spaces (140) is arranged at intervals; wherein the plurality of the first fluid spaces (140) are located between two of the wick structure channels (130); or, a plurality of wick structure channels (130) and the plurality of the first fluid spaces (140) are arranged alternately in sequence.
  5. The housing assembly according to any one of claims 1 to 4, wherein the accommodating cavity (111) has a first inner wall surface (1111) and a second inner wall surface (1112) opposite to each other, a second fluid space (150) at least used for circulation of a gaseous medium is located between the wick structure layer (120) and the first inner wall surface (1111), and a side, facing away from the second fluid space (150), of the wick structure layer (120) is attached to the second inner wall surface (1112).
  6. The housing assembly according to claim 5, wherein the wick structure channel (130) is constructed as a grooved wick structure.
  7. The housing assembly according to claim 5, wherein the wick structure channel (130) is constructed as a grooved wick structure located in the second inner wall surface (1112), and the wick structure layer (120) has an accommodating region (124) for accommodating the grooved wick structure.
  8. The housing assembly according to any one of claims 1 to 4, wherein the accommodating cavity (111) has a first inner wall surface (1111) and a second inner wall surface (1112) opposite to each other, two opposite sides of the wick structure layer (120) are attached to the first inner wall surface (1111) and the second inner wall surface (1112) respectively, the wick structure channel (130) is constructed as a grooved wick structure located in the first inner wall surface (1111) or the second inner wall surface (1112), and the wick structure layer (120) has an accommodating region (124) for accommodating the grooved wick structure.
  9. The housing assembly according to any one of claims 5 to 8, wherein the body (110) comprises a first sub-body part (112) and a second sub-body part (113) connected to each other, the accommodating cavity (111) is defined between the first sub-body part (112) and the second sub-body part (113), the first inner wall surface (1111) is located on the first sub-body part (112), and the second inner wall surface (1112) is located on the second sub-body part (113); particularly, a first support part (114) is located on the first inner wall surface (1111), and the first support part (114) abuts against the wick structure layer (120); or, the first support part (114) abuts against the second inner wall surface (1112); or, the first support part (114) abuts against a second support part (115) located on the second inner wall surface (1112).
  10. The housing assembly according to any one of claims 1 to 4, wherein the wick structure channel (130) is constructed as a grooved wick structure; particularly, the grooved wick structure comprises a plurality of protrusions (131) arranged side by side and extending in a same direction, and grooves (132) located between every two adjacent protrusions (131); particularly, a width of the grooves (132) is 0.1 mm-0.2 mm, and/or a depth of the grooves (132) is 0.05 mm-0.15 mm.
  11. The housing assembly according to claims 1 to 10, wherein the housing body (200) comprises a middle frame (210), a first side of the middle frame (210) is used for disposing a battery (300) and/or a heat source element, and the mounting groove (211) is located in a second side, opposite to the first side, of the middle frame (210).
  12. The housing assembly according to claims 1 to 10, wherein the housing body (200) comprises a rear cover, and the mounting groove (211) is disposed in an inner wall surface of the rear cover.
  13. An electronic device, comprising the housing assembly according to any one of claims 1 to 12.

Description

TECHNICAL FIELD The disclosure relates to the technical field of electronic devices, in particular to a housing assembly with a a vapor chamber and an electronic device. BACKGROUND In the field of electronic heat dissipation, especially portable electronic devices such as mobile phones and tablets are gradually becoming thinner and lighter, and the problem about effective heat dissipation under a limited size is becoming more and more serious. Ultra-thin vapor chambers, as phase change heat transfer components, are widely used for heat dissipation of portable electronic devices due to excellent heat transfer performance and temperature uniformity. US2019/141855A1 relates to a vapor chamber. The vapor chamber is extremely thin but nonetheless allows a working fluid to smoothly flow back, prevents dry-out and provides a superior heat transport capability, regardless of an installation orientation such as a top heat orientation or a change in the installation orientation. The vapor chamber has a container having a hollow portion, the hollow portion being formed by one plate-shaped body and another plate-shaped body facing the one-plate shaped body; a working fluid enclosed in the hollow portion; a first wick structure provided in the hollow portion; and a second wick structure on an inner surface of the one plate-shaped body thermally connected to a heating element, the second wick structure having a lower flow path resistance to the working fluid than the first wick structure, the second wick structure including a groove portion, wherein a vapor flow path is provided inside of the other plate-shaped body, the first wick structure is provided between the other plate-shaped body and the second wick structure, and an aperture size of the first wick structure is 75% or more of a groove width of the second wick structure and an open area rate of the first wick structure is 35% or more. CN216852857U relates a vapor chamber, a shell assembly and a terminal equipment. The vapor chamber comprises a cavity, a wick structure layer and a working medium, the cavity comprises a first space; the wick structure layer is arranged in the cavity, the first space is formed between the wick structure layer and part of the inner wall of the cavity, and a backflow channel is formed in the side, away from the first space, of the wick structure layer; the working medium at least has a liquid state and a gaseous state, the backflow channel is at least used for circulating the working medium in the liquid state, the first space is at least used for circulating the working medium in the gaseous state, and the working medium in the gaseous state is in the state obtained after the working medium in the liquid state is heated and converted. The vapor chamber, the shell assembly and the terminal equipment can adapt to light and thin design and are good in heat dissipation performance. SUMMARY The purpose of the invention is to provide a housing assembly with a vapor chamber and an electronic device. The vapor chamber is conducive to enhancing a backflow effect of a liquid medium, and has desirable heat dissipation performance. The housing assembly according to the invention is defined by the features of claim 1. The electronic device according to the invention is defined by the features of claim 13. A vapor chamber, which is located in a housing assembly according to the invention includes: a body including an accommodating cavity; a wick structure layer located in the accommodating cavity; and a wick structure channel located in the accommodating cavity. The wick structure channel is at least partially located outside the wick structure layer. Alternatively, the wick structure channel is located in the wick structure layer, and fluid resistance of the wick structure channel is smaller than fluid resistance of the wick structure layer. Optionally, the wick structure layer includes an evaporation region, and the wick structure channel extends from the evaporation region in a direction away from the evaporation region. Optionally, the wick structure layer includes a condensation region, the wick structure channel extends from the evaporation region to the condensation region, a first fluid space extending from the evaporation region to the condensation region is located in the wick structure layer, and the first fluid space is at least used for circulation of a gaseous medium. Optionally, a plurality of the first fluid spaces is arranged at intervals; the plurality of the first fluid spaces are located between two of the wick structure channels; or, a plurality of wick structure channels and the plurality of the first fluid spaces are arranged alternately in sequence. Optionally, the wick structure layer has grooves and/or through holes penetrating through the wick structure layer, and the first fluid space includes the grooves and/or the through holes. Optionally, the accommodating cavity has a first inner wall surface and a second inner wal