EP-4345468-B1 - ADAPTIVE CONDITIONING CIRCUIT SUPPORTING ULTRASONIC-VIBRATION FUSION, AND FLEXIBLE MODULE

EP4345468B1EP 4345468 B1EP4345468 B1EP 4345468B1EP-4345468-B1

Inventors

JIANG, Jiongting
SHAO, Zhipeng
ZHANG, ZHAOYU
HAN, Xutao
JIANG, Keruo
SONG, Yanfeng
MA, LIJUN
LI, Junhao
QIAN, KAI
XIA, QIAOQUN
YANG, Yueping

Dates

Publication Date: 20260513
Application Date: 20221209

Claims (9)

An adaptive conditioning circuit supporting ultrasonic-vibration fusion, wherein the adaptive conditioning circuit supporting ultrasonic-vibration fusion comprises a front-end conditioning unit, a vibration conditioning unit, an ultrasonic conditioning unit, and a microcontroller unit, MCU, wherein the vibration conditioning unit and the ultrasonic conditioning unit both comprise a voltage following unit, a filtering unit, and a program-controlled amplification unit, an input terminal of the MCU is connected to an output terminal of the program-controlled amplification unit, and an output terminal of the MCU is separately connected to an input terminal of the filtering unit and an input terminal of the program-controlled amplification unit; the front-end conditioning unit is configured to obtain an ultrasonic-vibration fusion signal collected by a sensor, and process the ultrasonic-vibration fusion signal to obtain two analog voltage signals; the vibration conditioning unit is configured to perform adaptive filtering, denoising, and amplification on a vibration signal in the analog voltage signal; the ultrasonic conditioning unit is configured to perform adaptive filtering, denoising, and amplification on an ultrasonic signal in the analog voltage signal; and the MCU is configured to control the filtering and the denoising of the vibration conditioning unit and the ultrasonic conditioning unit, and adjust an amplification factor of the adaptive amplification based on feedback signals output by the vibration conditioning unit and the ultrasonic conditioning unit; wherein the MCU comprises an MCU controller, an analog-digital converter, ADC, and a digital-analog converter, DAC; an output terminal of the vibration conditioning unit is connected to a signal input terminal of the ADC, and an analog signal on the output terminal of the vibration conditioning unit is output from a vibration feedback terminal of the ADC after undergoing analog-to-digital conversion; the vibration feedback terminal of the ADC is connected to an input terminal of the MCU controller, and an amplification factor used by the vibration conditioning unit for the vibration signal is controlled through a vibration amplification port of the MCU controller after internal processing by the MCU controller; a vibration filtering control port of the MCU controller is connected to an input terminal of the DAC, and a digital signal on the vibration filtering control port of the MCU controller is output from a vibration filtering port of the DAC after undergoing digital-to-analog conversion; and the vibration filtering port of the DAC is connected to an input terminal of the vibration conditioning unit to control the vibration conditioning unit to filter and denoise the vibration signal; and an output terminal of the ultrasonic conditioning unit is connected to the signal input terminal of the ADC, and an analog signal on the output terminal of the ultrasonic conditioning unit is output from an ultrasonic feedback terminal of the ADC after undergoing the analog-to-digital conversion; the ultrasonic feedback terminal of the ADC is connected to the input terminal of the MCU controller, and an amplification factor used by the ultrasonic conditioning unit for the ultrasonic signal is controlled through an ultrasonic amplification port of the MCU controller after the internal processing by the MCU controller; an ultrasonic filtering control port of the MCU controller is connected to the input terminal of the DAC, and a digital signal on the ultrasonic filtering control port of the MCU controller is output from an ultrasonic filtering port of the DAC after undergoing the digital-to-analog conversion; and the ultrasonic filtering port of the DAC is connected to an input terminal of the ultrasonic conditioning unit to control the ultrasonic conditioning unit to filter and denoise the ultrasonic signal.
The adaptive conditioning circuit supporting ultrasonic-vibration fusion according to claim 1, wherein the vibration conditioning unit comprises a first voltage following unit, a vibration signal filtering unit, and a vibration program-controlled amplification unit, and the vibration signal filtering unit comprises a fixed vibration signal filtering unit and a differential vibration signal denoising unit; an input terminal of the first voltage following unit is connected to a first analog voltage signal, and an output terminal of the first voltage following unit is connected to an input terminal of the fixed vibration signal filtering unit; an output terminal of the fixed vibration signal filtering unit is connected to an input terminal of the differential vibration signal denoising unit, the input terminal of the differential vibration signal denoising unit is also connected to a vibration filtering port of the MCU, and an output terminal of the differential vibration signal denoising unit is connected to an input terminal of the vibration program-controlled amplification unit; and the input terminal of the vibration program-controlled amplification unit is also connected to a vibration amplification port of the MCU, and an output terminal of the vibration program-controlled amplification unit is connected to the input terminal of the MCU.
The adaptive conditioning circuit supporting ultrasonic-vibration fusion according to claim 1, wherein the ultrasonic conditioning unit comprises a second voltage following unit, an ultrasonic signal filtering unit, and an ultrasonic program-controlled amplification unit, and the ultrasonic signal filtering unit comprises a fixed ultrasonic signal filtering unit and a differential ultrasonic signal denoising unit; an input terminal of the second voltage following unit is connected to a second analog voltage signal, and an output terminal of the second voltage following unit is connected to an input terminal of the fixed ultrasonic signal filtering unit; an output terminal of the fixed ultrasonic signal filtering unit is connected to an input terminal of the differential ultrasonic signal denoising unit, the input terminal of the differential ultrasonic signal denoising unit is also connected to an ultrasonic filtering port of the MCU, and an output terminal of the differential ultrasonic signal denoising unit is connected to an input terminal of the ultrasonic program-controlled amplification unit; and the input terminal of the ultrasonic program-controlled amplification unit is also connected to an ultrasonic amplification port of the MCU, and an output terminal of the ultrasonic program-controlled amplification unit is connected to the input terminal of the MCU.
The adaptive conditioning circuit supporting ultrasonic-vibration fusion according to claim 1, wherein the front-end conditioning unit comprises a signal input interface and a third voltage following unit, an input terminal of the signal input interface receives the ultrasonic-vibration fusion signal collected by the sensor, an output terminal of the signal input interface is connected to an input terminal of the third voltage following unit, and an output terminal of the third voltage following unit outputs the two analog voltage signals.
The adaptive conditioning circuit supporting ultrasonic-vibration fusion according to claim 1, wherein the adjusting an amplification factor of the adaptive amplification based on feedback signals of the ultrasonic-vibration fusion signal comprises: step 1: initializing the MCU, and setting the amplification factor of the program-controlled amplification unit to a maximum multiple, wherein the maximum multiple is used to amplify a small signal to a full scale by default; step 2: connecting a vibration output signal to an ADC module for analog-to-digital conversion, obtaining a vibration feedback digital signal, and inputting the vibration feedback digital signal to the MCU for digital processing; step 3: obtaining an extreme value of a signal output by the program-controlled amplification unit; step 4: determining whether an absolute value of the extreme value of the signal is between 1/3 of the full scale and 2/3 of the full scale; and ending adaptive adjustment if the absolute value of the extreme value of the signal is between 1/3 of the full scale and 2/3 of the full scale, or performing step 5 if the absolute value of the extreme value of the signal is not between 1/3 of the full scale and 2/3 of the full scale; and step 5: adjusting the amplification factor of the program-controlled amplification unit by the MCU based on a preset step size, and repeating the steps 2 to 4 based on an adjusted amplification factor.
The adaptive conditioning circuit supporting ultrasonic-vibration fusion according to claim 5, wherein the maximum multiple is a multiple used by the program-controlled amplification unit to amplify a unit signal to the full scale.
The adaptive conditioning circuit supporting ultrasonic-vibration fusion according to claim 5, wherein the adjusting the amplification factor of the program-controlled amplification unit by the MCU based on a preset step size comprises: increasing the amplification factor by the preset step size when the absolute value of the extreme value of the signal is smaller than 1/3 of the full scale; or decreasing the amplification factor by the preset step size when the absolute value of the extreme value of the signal is greater than 2/3 of the full scale.
A flexible module, wherein the flexible module is provided with the adaptive conditioning circuit supporting ultrasonic-vibration fusion according to any one of claims 1 to 7.
The flexible module according to claim 8, wherein the flexible module is a flexible printed circuit board covered with an electromagnetic shielding film, and the flexible printed circuit board is installed on a housing of a sensor.

Description

TECHNICAL FIELD The present disclosure relates to the technical field of detection, and in particular, to an adaptive conditioning circuit supporting ultrasonic-vibration fusion, and a corresponding flexible module. BACKGROUND For an electrical device suffering from electrical stress, a partial discharge occurs when there is an insulation defect inside the electrical device. During the partial discharge, an ultrasonic signal is radiated outward. An insulation status of the electrical device can be detected and analyzed by measuring the ultrasonic signal. Similarly, for a mechanical device suffering from mechanical stress, an abnormal vibration occurs when there is a mechanical defect inside the mechanical device. A mechanical status of the mechanical device can be detected and analyzed by measuring and analyzing a vibration signal of the device. Partial discharge ultrasonic and mechanical vibration detection is widely used in many fields such as electric power, transportation, and aerospace. With the rapid development of science and technology, a core device in a power grid is often both a power device and a mechanical device, and bears joint action of the electrical stress and the mechanical stress in an actual operation process, such as a power transformer, a gas insulated switchgear (GIS), and a wind generator. During operation of these devices, the mechanical status and the insulation status are coupled with each other, and have an extremely prominent reciprocal effect. Therefore, when an operation status of such a device is detected, a partial discharge ultrasonic signal reflecting the electrical status of the device and a vibration signal reflecting the mechanical status of the device need to be detected simultaneously. An ultrasonic-vibration fusion detection sensor can detect ultrasonic and vibration signals of the device simultaneously at a same place to realize fusion measurement of the signals from a sensing level, so as to obtain more comprehensive operation status information of the device. The ultrasonic-vibration fusion detection sensor has a broad application prospect in effective and comprehensive detection of the operation status of the device. A physical signal sensed by the sensor needs to undergo amplification, filtering, and other processing to improve a signal-to-noise ratio of a detection signal. However, an existing ultrasonic signal conditioning circuit and vibration signal conditioning circuit can only process a single signal and cannot meet a conditioning requirement of an ultrasonic-vibration fusion signal. This is mainly reflected in that the power device in a new power system has a complex and changeable operation condition and operation environment, which leads to great uncertainty in amplitudes and frequencies of the ultrasonic signal and the vibration signal that are excited when the device operates, and an interference signal at an operation site is also increasingly complex and changeable. Signal conditioning needs to adapt to an operation condition status and the operation condition of the device. In addition, a common single parameter conditioning module is integrated into an ultrasonic sensor or a vibration sensor. However, due to introduction of a variety of sensing units, internal space of the vibration-ultrasonic fusion sensor is compact. Therefore, modules and units of a traditional conditioning circuit are difficult to be placed inside the vibration-ultrasonic fusion sensor. Therefore, a new and applicable signal conditioning circuit and a corresponding circuit module easy to be placed in the fusion sensor are needed for conditioning of the ultrasonic-vibration fusion signal. Reference document CN110687388A discloses an internal defect detection circuit of a converter transformer which is composed of a broadband acoustic wave sensor, a signal separator, a low-frequency signal conditioning unit, a high-frequency signal conditioning unit, a digital-to-analog conversion unit, and a wireless data transmission unit, and the circuit couples acoustic wave signals through a sensor, separates the signals into vibration wave signals and ultrasonic signals. By performing digital-to-analog conversion on the vibration waves and ultrasonic signals, and transmitting digital signals through wireless technology, internal defects of commutation can be obtained. Reference document CN109444691A discloses a ultrasonic acquisition device which is used for acquiring ultrasonic partial discharge signals, including a composite sensor, an amplification circuit, a filter circuit, a detection circuit, and a voltage feedback amplification and voltage stabilization circuit, which are sequentially connected in series. An output of the voltage feedback amplification and voltage stabilization circuit is connected to the input of a data transmission unit. SUMMARY In order to overcome the shortcomings and deficiencies of the prior art, and to realize effective conditioning of an ultrasonic-vibratio