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EP-4349771-B1 - SENSING DEVICE AND METHOD OF MANUFACTURING SENSING DEVICE

EP4349771B1EP 4349771 B1EP4349771 B1EP 4349771B1EP-4349771-B1

Inventors

  • YAO, I-AN
  • LIU, YU-TSUNG

Dates

Publication Date
20260513
Application Date
20230905

Claims (14)

  1. A sensing device (10), comprising: a substrate (SB); a circuit layer (CIL) disposed on the substrate (SB), and the circuit layer (CIL) comprising a plurality of driving circuits (DC); and a plurality of sensing units (SC) disposed on the circuit layer (CIL), and each of the sensing units (SC) comprising: a supporting part (SUP) electrically connected to one of the plurality of driving circuits (DC); and a sensing part (SEN) electrically connected to the supporting part (SUP), wherein the sensing part (SEN) is separated from the circuit layer (CIL) by a first cavity (R1) through the supporting part (SUP), wherein in a normal direction (n) of the substrate (SB), at least a portion of the supporting part (SUP) is disposed between the circuit layer (CIL) and the sensing part (SEN), wherein the sensing part (SEN) comprises an absorbing layer (AB) and a sensing layer (SN), and the absorbing layer (AB) is disposed between the sensing layer (SN) and the supporting part (SUP), characterized in that a second cavity (R2) separates the sensing layer (SN) and the supporting part (SUP).
  2. The sensing device (10) according to claim 1, wherein the circuit layer (CIL) further comprises a reflective layer (RL), the reflective layer (RL) is electrically insulated from the driving circuit (DC), and at least a portion of the first cavity (R1) is disposed between the reflective layer (RL) and the sensing part (SEN).
  3. The sensing device (10) according to claim 1, wherein the supporting part (SUP) comprises a cantilever (CB), a first terminal part (CB_T1) of the cantilever (CB) is fixed to the circuit layer (CIL), and a second terminal part (CB_T2) of the cantilever (CB) supports the sensing part (SEN).
  4. The sensing device (10) according to claim 3, wherein the supporting part (SUP) further comprises a first fixing member (F1), and the first fixing member (F1) is disposed on the first terminal part (CB_T1).
  5. The sensing device (10) according to claim 4, wherein the supporting part (SUP) further comprises a supporting layer (SU), and the first fixing member (F1) is disposed on the supporting layer (SU).
  6. The sensing device (10) according to claim 1, wherein the sensing part (SEN) further comprises a second fixing member (F2), and the second fixing member (F2) is disposed on the absorbing layer (AB).
  7. The sensing device (10) according to claim 1, wherein respective sides of the sensing layer (SN) and the absorbing layer (AB) are aligned in the normal direction (n) of the substrate (SB).
  8. The sensing device (10) according to claim 1, wherein a material of the absorbing layer (AB) comprises Ti, TiN, Pt, Au, Ni, Nb, or a combination thereof.
  9. The sensing device (10) according to claim 1, wherein a material of the sensing layer (SN) comprises a-Si, VOx, YBaCuO, GeSiO, SiGe, BiLaSrMnO, or a combination thereof.
  10. The sensing device (10) according to claim 1, further comprising a readout circuit (RIC) and a logic circuit (LIC), the readout circuit (RIC) is coupled to the plurality of driving circuits (DC), and the logic circuit (LIC) is coupled to the readout circuit (RIC).
  11. A method of manufacturing a sensing device (10), comprising: providing a substrate (SB); forming a circuit layer (CIL) on the substrate (SB), and the circuit layer (CIL) comprises a plurality of driving circuits (DC); forming a first sacrificial layer (SAC1) on the circuit layer (CIL); forming a supporting part (SUP) on the first sacrificial layer (SAC1), and the supporting part (SUP) being electrically connected to one of the plurality of driving circuits (DC); forming a second sacrificial layer (SAC2) on the supporting part (SUP); forming a sensing part (SEN) on the second sacrificial layer (SAC2), and the sensing part (SEN) being electrically connected to the supporting part (SUP); and removing the first sacrificial layer (SAC1) and the second sacrificial layer (SAC2).
  12. The method of manufacturing the sensing device (10) according to claim 11, wherein a method of forming the supporting part (SUP) comprises: patterning the first sacrificial layer (SAC1) to form a first opening (SAC1_OP1, SAC1_OP2); forming a supporting layer (SU) on the first sacrificial layer (SAC1), and the supporting layer (SU) partially filling into the first opening (SAC1_OP1, SAC1_OP2); and forming a first metal layer (M4) on the portion of the supporting layer (SU) filling into the first opening (SAC1_OP1, SAC1_OP2).
  13. The method of manufacturing the sensing device (10) according to claim 11, wherein a method of forming the sensing part (SEN) comprises: patterning the second sacrificial layer (SAC2) to form a second opening (SAC2_OP); forming an absorbing layer (AB) on the second sacrificial layer (SAC2), and the absorbing layer (AB) partially filling into the second opening (SAC2_OP); forming a second metal layer (M5) on the portion of the absorbing layer (AB) filling into the second opening (SAC2_OP); and forming a sensing layer (SN) on the second metal layer (M5).
  14. The method of manufacturing a sensing device (10) according to claim 11, wherein a method of removing the first sacrificial layer (SAC1) and the second sacrificial layer (SAC2) comprises injecting O2 plasma.

Description

BACKGROUND Technical Field The disclosure relates to a sensing device and a method of manufacturing a sensing device. Description of Related Art The existing sensing device includes a supporting part and a sensing part, in which the supporting part may be used, for example, to form a resonant cavity with a reflective layer and a cavity, so as to improve an absorption rate of the sensing part. However, a sensing area of the sensing part is easily affected by a disposed position of the supporting part and thus is limited. FR 3 113 126 A1 discloses an infrared imaging microbolometer comprising a membrane suspended above a substrate by means of support arms fixed to anchor pins. Said membrane comprises a support layer traversed by the anchor pins, an absorber deposited on the support layer and on the anchor pins. The absorber is patterned to form two electrodes. The membrane further comprises a dielectric layer deposited on said absorber and on the support layer, two conductive vias formed through the dielectric layer in contact with said two electrodes and a thermoresistive material disposed on a flat surface formed at the upper ends of said conductive vias. SUMMARY The invention provides a sensing device device according to claim 1 and a method of manufacturing a sensing device according to claim 11. A sensing device according to the invention includes a substrate, a circuit layer, and a plurality of sensing units. The circuit layer is disposed on the substrate and includes a plurality of driving circuits. The plurality of sensing units are disposed on the circuit layer, and each of the sensing units includes a supporting part and a sensing part. The supporting part is electrically connected to one of the plurality of driving circuits. The sensing part is electrically connected to the supporting part, and the sensing part is separated from the circuit layer by a first cavity through the supporting part. In a normal direction of the substrate, at least a portion of the supporting part is disposed between the circuit layer and the sensing part. The sensing part comprises an absorbing layer and a sensing layer. The absorbing layer is disposed between the sensing layer and the supporting part, so that a second cavity separates the sensing layer and the supporting part. A method of manufacturing a sensing device according to the invention includes the following. A substrate is provided. A circuit layer is formed on the substrate, and the circuit layer includes a plurality of driving circuits. A first sacrificial layer is formed on the circuit layer. A supporting part is formed on the first sacrificial layer, and the supporting part is electrically connected to one of the plurality of driving circuits. A second sacrificial layer is formed on the supporting part. A sensing part is formed on the second sacrificial layer, and the sensing part is electrically connected to the supporting part. The first sacrificial layer and the second sacrificial layer are removed. In order to make the above-mentioned features and advantages of the disclosure more comprehensible, the following embodiments are described in detail with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 to FIG. 10 are schematic flowcharts of a method of manufacturing a sensing device according to an embodiment of the disclosure.FIG. 11 is a schematic circuit diagram of a sensing device according to an embodiment of the disclosure. DESCRIPTION OF THE EMBODIMENTS Reference will now be made in detail to the exemplary embodiments of the disclosure, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numerals are used in the drawings and descriptions to refer to the same or like parts. The disclosure may be understood by referring to the following detailed description in conjunction with the accompanying drawings. It should be noted that, for the ease of understanding by readers and for the brevity of the accompanying drawings, multiple drawings in the disclosure only depict a portion of an electronic device, and certain elements in the drawings are not drawn according to the actual scale. In addition, the number and size of each of the elements in the drawings are for illustration purposes only and are not intended to limit the scope of the disclosure. Certain terms are used throughout the description and the appended claims to refer to particular elements. Persons skilled in the art should understand that electronic device manufacturers may refer to the same element by different names. This disclosure does not intend to distinguish between elements that have the same function but have different names. In the following description and claims, words such as "comprising", "including", and "having" are openended words and should be interpreted as meaning "including but not limited to...". Accordingly, when the terms "comprising", "including", and/or "having" are used in the description of the dis