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EP-4358664-B1 - IMMERSION COOLING SYSTEM

EP4358664B1EP 4358664 B1EP4358664 B1EP 4358664B1EP-4358664-B1

Inventors

  • CHANG, REN-CHUN
  • LIN, WEI-CHIH
  • FAN, ZIH-YANG

Dates

Publication Date
20260506
Application Date
20230719

Claims (13)

  1. An immersion cooling system (100), comprising: a pressure seal tank (110) configured to contain a cooling liquid (115), wherein a gas outlet (191) is disposed on a top (111) or a sidewall of the pressure seal tank (110), and a gas inlet (192) is disposed on a bottom (112) of the pressure seal tank (110), wherein the gas outlet (191) is higher than a liquid level (115A) of the cooling liquid (115); an electronic module (120) disposed in the pressure seal tank (110) and immersed in the cooling liquid (115); a blower (193) communicating with the pressure seal tank (110) and configured to extract the gas from the gas outlet (191) and inject the gas into the pressure seal tank (110) via the gas inlet (192); and a distributor plate (194) disposed in the pressure seal tank (110) and located between the electronic module (120) and the gas inlet (192), characterized in that the blower (193) is located in the pressure seal tank (110).
  2. The immersion cooling system as claimed in claim 1, wherein a vapor space (115B) is formed above the liquid level (115A) of the cooling liquid (115) in the pressure seal tank (110); and wherein the blower (193) extracts the gas in the vapor space (115B) through the gas outlet (191).
  3. The immersion cooling system as claimed in claim 1 or 2, wherein the blower (193) is disposed higher than the liquid level (115A) of the cooling liquid (115), or wherein the gas outlet (191) is located higher than the blower (193), and the gas inlet (192) is located lower than the blower (193).
  4. The immersion cooling system as claimed in any of the preceding claims, wherein the distributor plate (194) is disposed parallel to a bottom surface of the pressure seal tank (110).
  5. The immersion cooling system as claimed in any of the preceding claims, wherein a first distance (D1) between the distributor plate (194) and the electronic module (120) is less than a second distance (D2) between the distributor plate (194) and the gas inlet (192).
  6. The immersion cooling system as claimed in any of the preceding claims, wherein the distributor plate (194) comprises a uniform gas supply structure, or wherein the gas is injected into the pressure seal tank (110) at a flow rate of 0.05m/s to 0.5m/s.
  7. The immersion cooling system as claimed in any of the preceding claims, further comprising: a heat exchanger (150) communicating with the pressure seal tank (110) and configured to receive the cooling liquid (115) from the pressure seal tank (110) for heat exchange and inject the cooling liquid (115) into the pressure seal tank (110) after the heat exchange; and a pump (165) connected to the heat exchanger (150) and the pressure seal tank (110) and outputting a propulsion to drive the cooling liquid (115).
  8. The immersion cooling system as claimed in claim 7, wherein the pump (165) is connected between a cooling liquid inlet (161) of the heat exchanger (150) and a cooling liquid outlet (162) of the pressure seal tank (110), and the propulsion drives the cooling liquid (115) to flow into the heat exchanger (150).
  9. The immersion cooling system as claimed in claim 7, further comprising: a cooling water source (175) communicating with the heat exchanger (150) and configured to supply cold water to the heat exchanger (150) and receive the cold water from the heat exchanger (150) after the heat exchange.
  10. The immersion cooling system as claimed in any of the preceding claims, wherein the pressure seal tank (110) further comprises a partition wall (113) vertically disposed on the bottom (112) of the pressure seal tank (110), and the distributor plate (194) is connected to the partition wall (113), and the liquid level (115A) of the cooling liquid (115) is higher than the partition wall (113).
  11. The immersion cooling system as claimed in claim 10, wherein the partition wall (113) divides the pressure seal tank (110) into a first accommodating space (110A) and a second accommodating space (110B), the electronic module (120) and the gas inlet (192) are located in the first accommodating space (110A), and the cooling liquid (115) flows into the first accommodating space (110A) and the second accommodating space (110B).
  12. The immersion cooling system as claimed in any of the preceding claims, further comprising: a relief valve (140) communicating with the pressure seal tank (110), and the relief valve (140) is automatically opened and closed for keeping a pressure value in the pressure seal tank (110) from a first pressure value to a second pressure value, wherein the first pressure value is about 103 kPa, and the second pressure value is about 101.5 kPa; and a pressure balance pipe (130) disposed between the top of the pressure seal tank (110) and the relief valve (140).
  13. The immersion cooling system as claimed in any of the preceding claims, wherein the pressure seal tank (110) further comprises an opening (111A) on the top of the pressure seal tank (110), and a sealing cover (116) is configured to seal the opening (111A).

Description

CROSS REFERENCE TO RELATED APPLICATIONS This Application claims the benefit of U.S. Provisional Application No. 63/417,084, filed October 18, 2022, and claims priority of China Patent Application No. CN 202310222065.X, filed on March 9, 2023. BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to an immersion cooling system, and, in particular, to an immersion cooling system having a distributor plate disposed in the pressure seal tank. Description of the Related Art With the advance of technology, there are more applications for electronic apparatuses, and their widespread use has become more and more common. In particular, various communication apparatuses such as server apparatuses have gradually become an indispensable part of daily life. These electronic apparatuses generate a large amount of heat during operation, and therefore currently use immersion cooling systems. However, existing immersion cooling systems still have room for improvement in terms of operating cost and environmental performance. In a traditional immersion cooling system, a high-density insulating cooling liquid is used, and the cooling liquid is driven to flow in a pressure seal tank by a pump device. However, due to the limited flow rate provided by the pump device and the large flow area required for the cooling liquid in the pressure seal tank, the flow rate of the cooling liquid flowing through the electronic module is relatively slow. In addition, due to the large viscosity coefficient of the cooling liquid (for example, it is about 10 times to 40 times that of water), the cooling liquid has insufficient fluidity, resulting in the cooling capacity of the immersion cooling system for the electronic module being insufficient. However, if a high-speed or large-capacity pump device is used to increase the fluidity of the cooling liquid, the operating costs will increase, and instead of saving energy, energy consumption will also increase. US 20190219311A1 discloses an system and method for cooling of electronic equipment, for example a computer system, in a subsurface environment including a containment vessel in at least partial contact with subsurface liquid or solid material. The containment vessel may be disposed in a variety of subsurface environments, including boreholes, manmade excavations, subterranean caves, as well as ponds, lakes, reservoirs, oceans, or other bodies of water. The containment vessel may be installed with a subsurface configuration allowing for human access for maintenance and modification. Cooling is achieved by one or more fluids circulating inside and/or outside the containment vessel, with a variety of configurations of electronic devices disposed within the containment vessel. The circulating fluid(s) may be cooled in place by thermal conduction or by active transfer of the fluid(s) out of the containment vessel to an external heat exchange mechanism, then back into the containment vessel. US 20140318741A1 discloses an apparatus including a reservoir to hold a volume of liquid, a port to inject a flow of gas into a lower portion of the reservoir, and a structure to transform the flow of gas into one or more streams of bubbles in said liquid. The reservoir has a port for injecting the gas into a lower region of the volume of liquid and has a top opening to release the injected gas therefrom. The apparatus includes one or more active electronic or optical devices located in the reservoir or located physically adjacent and in thermal contact with the reservoir such that the volume of the liquid is able to absorb part of heat produced by the one of more electronic or optical devices. US2022087049A1 discloses a system and method for cooling electronic devices disposed within the inner volume of an enclosure. The inner volume of the enclosure contains one or more single phase or multi-phase thermally conductive fluids that use bubble assisted circulation for enhanced heat transfer. Therefore, for the immersion cooling system, how to effectively take the operation cost and the heat dissipation performance into account, and achieve the effect of energy saving will be an important issue. BRIEF SUMMARY OF THE INVENTION The present invention provides an immersion cooling system. The immersion cooling system comprises a pressure seal tank, an electronic module, a blower, and a distributor plate. The pressure seal tank contains a cooling liquid, and a gas outlet is disposed on the top or a sidewall of the pressure seal tank, a gas inlet is disposed on the bottom of the pressure seal tank. The gas outlet is higher than the liquid level of the cooling liquid. The electronic module is disposed in the pressure seal tank and immersed in the cooling liquid. The blower is communicated with the pressure seal tank and configured to extract the gas from the gas outlet and inject the gas into the pressure seal tank via the gas inlet. The distributor plate is disposed in the pressure seal tank