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EP-4360415-B1 - METHOD AND SYSTEM FOR INTELLIGENT SELECTIVITY OF MATERIAL APPLICATION

EP4360415B1EP 4360415 B1EP4360415 B1EP 4360415B1EP-4360415-B1

Inventors

  • KHASGIWALA, MUDIT SUNILKUMAR
  • KENGERI, SUBRAMANI

Dates

Publication Date
20260513
Application Date
20220621

Claims (15)

  1. A method of controlling processes for applying material to an electronic device, the method comprising: generating an electromagnetic (EM) map of an electronic device that indicates locations of EM radiation emitted from the electronic device; generating a thermal map of the electronic device that indicates locations of thermal energy emitted from the electronic device; generating, from the EM map and the thermal map, a shielding map comprising instructions to control a shielding apparatus, comprising: locations on the electronic device to apply an EM shielding material; and locations on the electronic device to apply a thermal material; and controlling, using the shielding map, a shielding apparatus to apply the EM shielding material and the thermal material to the electronic device.
  2. The method of claim 1, wherein generating the EM map further comprises: simulating a model of the electronic device to measure EM radiation; determining locations of EM radiation on the electronic device; creating a mapping of the locations of EM radiation on the electronic device; and determining EM shielding materials to be applied at locations on the electronic device, particularly further comprising: generating a model of the electronic device.
  3. The method of claim 1, wherein generating the thermal map comprises: simulating a model of the electronic device to measure a thermal behavior of the electronic device; determining locations of thermal energy on the electronic device; creating a heat map of the electronic device; and determining thermal materials to be applied at locations on the electronic device.
  4. The method of claim 1, wherein generating the EM map further comprises: receiving data from probing a prototype of the electronic device; measuring EM radiation from a scan of the electronic device; determining locations of EM radiation generated on the electronic device; and creating a map of the locations of EM radiation on the electronic device.
  5. The method of claim 1, wherein generating the thermal map further comprises: receiving data from probing a prototype of the electronic device; receiving data from a thermal scan of the electronic device; determining locations of thermal energy on the electronic device; and creating a heat map of the electronic device.
  6. The method of claim 1, wherein the EM map and the thermal map comprise (x,y,z) coordinates.
  7. The method of claim 1, wherein generating the EM map comprises identifying locations that are vulnerable to EM attacks, particularly wherein identifying the locations that are vulnerable to EM attacks comprises identifying locations of antennas.
  8. A non-transitory computer-readable medium comprising instructions that, when executed by one or more processors, cause the one or more processors to perform operations comprising: receiving an electromagnetic (EM) map of an electronic device that indicates locations of EM radiation generated on the electronic device; receiving a thermal map of the electronic device that indicates locations of thermal energy generated on the electronic device; and generating, from the EM map and the thermal map, a shielding map comprising instructions to control a shielding apparatus, comprising: locations on the electronic device to apply an EM shielding material; and locations on the electronic device to apply a thermal material; and providing the shielding map to a shielding apparatus to apply the EM shielding material and the thermal material to the electronic device.
  9. The non-transitory computer-readable medium of claim 8, wherein generating the shielding map further comprises: determining one or more EM shielding materials to be applied to each location based on one or more frequencies; and determining a depth of each thermal material to be applied to each location based on a magnitude of each frequency.
  10. The non-transitory computer-readable medium of claim 8, wherein generating the shielding map further comprises: mapping one or more thermal materials to each location based on a predetermined threshold of thermal performance; and mapping a shielding depth of each thermal material to each location based on a magnitude of thermal energy.
  11. The non-transitory computer-readable medium of claim 8, wherein providing the shielding map comprises sending the shielding map from a first computing device to a shielding apparatus operable to deposit an EM shielding material and a thermal material on the electronic device, or wherein providing the shielding map comprises causing components of a computing device to execute commands which control a shielding apparatus operable to deposit an EM shielding material and a thermal material on the electronic device.
  12. A system comprising: a shielding apparatus operable to deposit an electromagnetic (EM) shielding material and a thermal material on an electronic device; one or more processors; and one or more memory devices comprising instructions that, when executed by the one or more processors, cause the one or more processors to perform operations comprising: receiving an electromagnetic (EM) map of an electronic device that indicates locations of EM radiation generated on the electronic device; receiving a thermal map of the electronic device that indicates locations of thermal energy generated on the electronic device; generating, from the EM map and the thermal map, a shielding map comprising instructions to control the shielding apparatus, comprising: locations on the electronic device to apply an EM shielding material; and locations on the electronic device to apply a thermal material; and providing the shielding map to the shielding apparatus to apply the EM shielding material and the thermal material to the electronic device.
  13. The system of claim 12, wherein the shielding apparatus is operable to apply the EM shielding material and the thermal material according to the shielding map via electroplating.
  14. The system of claim 12, wherein the shielding apparatus is operable to apply the EM shielding material and the thermal material via sputtering according to the shielding map, wherein the shielding apparatus is further operable to deposit at least one layer of EM shielding material to a first shielding depth as a function of a frequency of EM radiation and deposit a layer of thermal material to a material depth, particularly wherein the at least one layer of EM shielding material comprises a layer of an electrical conductor for high frequency EM shielding and a layer of a magnetic conductor for low frequency shielding, or wherein the at least one layer of EM shielding material comprises a layer of alloy providing high frequency EM shielding and low frequency EM shielding to within a predetermined threshold.
  15. The system of claim 12, wherein the electronic device comprises one or more integrated circuit packages mounted on a substrate fabricated from glass or an organic material.

Description

CROSS-REFERENCES TO RELATED APPLICATIONS This application claims the benefit of Provisional U.S. Patent Application Number 63/213,553, filed June 22, 2021, entitled "METHOD AND SYSTEM FOR INTELLIGENT SELECTIVITY OF MATERIAL APPLICATION". TECHNICAL FIELD This disclosure generally relates to methods and systems for providing electromagnetic shielding and thermal materials to electronic devices. More specifically, this disclosure describes techniques for choosing and selectively layering materials on an electronic device to provide protection from electromagnetic interference, enhance security, and achieve predetermined thresholds of thermal performance. BACKGROUND OF THE INVENTION Electronic devices may require electromagnetic shielding for reasons such as security, noise mitigation, and protection from interference. As electromagnetic shielding may be provided for a variety of reasons, the materials used for a particular reason may not be suitable for another reason. Additionally, various thermal properties may be of concern on these electronic devices, which may require yet another material. Document US2017155746A1 discloses a method for manufacturing an electronic device. Document US10741501B1 discloses systems and methods for sheathing electronic components. BRIEF SUMMARY OF THE INVENTION In some embodiments, a method for applying materials to an electronic device may include generating an electromagnetic (EM) map of the electronic device. The EM map may indicate locations of EM radiation emitted from the electronic device. The method may also include generating a thermal map of the electronic device that may indicate locations of thermal energy emitted from the electronic device. The method may also include generating a shielding map from the EM map and the thermal map. The shielding map may include instructions to control a shielding apparatus, including locations on the electronic device to apply an EM shielding material and locations to apply a thermal material. The method may also include controlling a shielding apparatus to apply the EM shielding material and thermal material to the electronic device, according to the shielding map. In some embodiments, a non-transitory computer-readable medium includes instructions that cause one or more processors to perform operations. The operations may include receiving an EM map of an electronic device that indicates location of EM radiation generated on the electronic device. The operations may also include receiving a thermal map of an electronic device that indicates locations of thermal energy generated on the electronic device. The operations may also include generating a shielding map, from the EM map and the thermal map that includes instructions to control a shielding apparatus. The shielding map may include locations on the electronic device to apply an EM shielding material and/or a thermal material. The operations may also include providing the shielding map to a shielding apparatus to apply the EM shielding material and/or the thermal material. In some embodiments, a system may include a shielding apparatus that may deposit an EM shielding material and a thermal material on an electronic device. The system may include one or more processors and one or more memory devices. The memory devices may include instructions that cause the one or more processors to perform operations. The operations may include receiving an EM map of the electronic device that indicates locations of EM radiation generated from the electronic device. The operations may also include receiving a thermal map of the electronic device that indicates locations thermal energy generated on the electronic device. The operations may also include generating a shielding map, from the EM map and the thermal map that includes instructions to control a shielding apparatus. The shielding map may include locations on the electronic device to apply an EM shielding material and/or a thermal material. The operations may also include providing the shielding map to a shielding apparatus to apply the EM shielding material and/or the thermal material. In some embodiments, generating the EM map may include simulating a model of the electronic device to measure EM radiation. Generating the EM map may also include determining locations of EM radiation on the electronic device and creating a mapping of the locations. Generating the EM map may also include determining EM shielding materials to be applied at location on the EM shielding device. In some embodiments, generating the EM map may include generating a model of the electronic device. Generating the EM map may also include identifying locations on the electronic device that are vulnerable to EM attacks, such as unintentional antennas. In all embodiments, generating the thermal map may also include simulating a model of the electronic device to measure the thermal behavior of the electronic device. Generating the thermal map may also include determ