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EP-4386818-B1 - EDGE SCANNING APPARATUS AND METAL CONTAMINATION MEASUREMENT DEVICE

EP4386818B1EP 4386818 B1EP4386818 B1EP 4386818B1EP-4386818-B1

Inventors

  • YU, XIANG
  • CHENG, Shiran
  • ZHANG, Huaidong
  • YANG, Chaoquan
  • CUI, Hushan
  • LIU, PENGFEI
  • HU, Dongdong
  • XU, KAIDONG

Dates

Publication Date
20260506
Application Date
20211122

Claims (12)

  1. An apparatus for scanning an edge, comprising: a rotating component (1), wherein the rotating component (1) comprises a carrying portion (11) configured to carry a sample (A) which is to be tested, wherein the rotating component (1) is configured to drive the sample (A) to rotate; a scanning-liquid supplying-drawing component, which comprises a nozzle (2) configured to dribble and draw a droplet of a scanning fluid; and a supporting component (3), comprising a supporting arm (31), wherein the droplet is capable to be accommodated between the nozzle (2) and the supporting arm (31) while wrapping the edge of the sample (A), the apparatus further comprising a platform plate (5), wherein the rotating component (1) and the supporting component (3) are both mounted on the platform plate (5), the apparatus being characterized in that , an upper surface of the platform plate (5) is provided with a first annular groove (51) enclosing a mounting region (5a) on the upper surface of the platform plate (5); an orthographic projection of the sample (A) on the upper surface of the platform plate (5) is located in the mounting region (5a); a second drain port (52) for the platform plate (5) connects the first annular groove (51); the upper surface of the platform plate (5) is further provided with a second annular groove (54) located in the mounting region (5a); the second annular groove (54) surrounds the rotating component (1); and a first connection groove (55) connects the second annular groove (54) and the first annular groove (51); a part of the upper surface of the platform plate (5), which is between the second annular groove (54) and the first annular groove (51), slopes downward in a direction pointing from the second annular groove (54) to the first annular groove (51); the upper surface of the platform plate (5) is provided with a third annular groove (56); and a second connection groove (57) connects the third annular groove (56) and the first annular groove (51).
  2. The apparatus according to claim 1, further comprising a cleaning component (4) configured to clean the supporting arm (31).
  3. The apparatus according to claim 2, wherein: the supporting arm (31) has a supporting position and a cleaning position, and a driving mechanism of the supporting component (3) is configured to drive the supporting arm (31) to switch between the supporting position and the cleaning position.
  4. The apparatus according to claim 3, wherein: the cleaning component (4) comprises a shell (41) enclosing a cleaning chamber (413), wherein a wall of the shell (41) is provided with a first entrance (414) opening into the cleaning chamber (413), and the supporting arm (31) is capable to enter and exit the cleaning chamber (413) through the first entrance (414); and a cleaning member of the cleaning component (4) is capable to clean the supporting arm (31) in the cleaning chamber (413).
  5. The apparatus according to claim 4, wherein: the cleaning member comprises one or both of a liquid rinsing component and a gas purging component, and a lower part of the shell (41) is provided with a first drain port (415) connecting the cleaning chamber (413).
  6. The apparatus according to claim 1, wherein a height-adjusting member for the supporting component (3) is configured to adjust a height of the supporting arm (31) when mounting the supporting arm (31).
  7. The apparatus according to claim 1, wherein the carrying portion (11) is a suction cup for providing negative pressure.
  8. The apparatus according to any one of claims 1, 6 and 7, wherein the apparatus further comprises a cleaning component (4) configured to clean the supporting arm (31): the cleaning component (4) is mounted on the platform plate (5); and the third annular groove (56) surrounds the cleaning component (4).
  9. The apparatus according to claim 8, wherein: one or both of: at least a portion located above the upper surface of the platform plate (5), in each of the rotating component (1), the scanning-liquid supplying-drawing component, the supporting component (3), and the cleaning component (4), and the platform plate (5), is either made of a corrosion-resistant material or coated with a corrosion-resistant layer.
  10. The apparatus according to any one of claims 1 to 7, further comprising: a cover (6), configured to be mounted on the platform plate (5) and enclose an accommodation chamber (63) along with the platform plate (5), wherein the cover (6) is provided with a second entrance (61), and the sample (A) is capable to enter and exit the accommodation chamber (63) through the second entrance (61).
  11. The apparatus according to any one of claims 1 to 7, wherein the supporting arm (31) is made of an antistatic material, or coated with an antistatic layer.
  12. A device for detecting metallic contaminants, comprising the apparatus according to any one of claims 1 to 11.

Description

This application claims priority to Chinese Patent Application No. 202110914183.8, titled "APPARATUS FOR EDGE SCANNING AND DEVICE FOR DETECTING METALLIC COMTAMINANTS", filed on August 10, 2021 with the China National Intellectual Property Administration. FIELD The present disclosure relates to the technical field of sample scanning, and in particular to an apparatus for edge scanning and a device for detecting metallic contaminants. BACKGROUND In order to analyze an end region of a wafer, in a method and a device for analyzing impurities of the wafer, it is proposed in JP2010 060439 A that the method of analyzing the impurities of the wafer comprises a step of preparing a liquid drop between a lower drop cage and an upper drop cage so that the lower surface of the drop comes into contact with the lower drop cage and the top surface of the drop comes into contact with the upper drop cage, a step of scanning the wafer with the drop while the wafer is brought into contact with one surface of the drop and a step of sucking and analyzing the drop. A horizontal scanner, a vertical scanner, and a dual-configuration scanner that is able to convert between a horizontal scanner and a vertical scanner are described in US9196471 B1. JP 2005 109292 A aims at providing a collection method and device, having simple constitution and being capable of easily and stably collecting the substances to be measured from a wafer peripheral part. Since substances to be measured, which exist in a wafer peripheral part, are collected by bringing the wafer peripheral part into contact with a droplet on a collecting solution holding board, a wafer is set laterally; and the wafer peripheral part is brought into contact with the droplet on the collecting solution holding board differently from a conventional method, in which the wafer is set vertically, and the wafer peripheral part is dipped into chemicals in a dipping container. Consequently problems, such as pollution of chemicals and complexity of handling can be solved, the structure can be simplified and substances to be measured can be collected easily and stably from the wafer peripheral part. In order to provide a substrate inspection device and a recovery tool suitable for sticking a droplet to an edge of a substrate and moving it along the edge, it is proposed in JP 2015 099103 A that the substrate inspection device includes a substrate rotary apparatus, a recovery tool, and a recovery tool holding apparatus. The recovery tool includes: gas supplying means for supplying gas; a first tool for holding a droplet adhering to an edge of a substrate; and a second tool for guiding gas along the border of an adhesion region, as the region in which the droplet held by the first tool adheres to the edge of the substrate, so as to spray the gas to the surface of the substrate. Various new chemical elements are inevitably introduced when manufacturing chips with high performances and low power consumption, and such introduction renders metallic contamination difficult to control in the manufacture. At present, a system for collecting metallic contaminants using vapor phase decomposition and an inductively coupled plasma mass spectrometer form the most common devices for detecting metallic contaminants. These devices conduct detection mainly on central regions of to-be-detected wafers. SUMMARY An objective of the present disclosure is providing an apparatus for edge scanning and a device for detecting metallic contaminants. The apparatus is capable to perform scanning and sampling on an edge of a sample, and thereby provide a basis for conducting detection on the edge of the sample. In order to address at least the above issues, an apparatus for scanning an edge is provided as defined in claim 1. During operation, the sample may be disposed on the carrying portion, and then the scanning-liquid supplying-drawing component may dribble the droplet of the scanning fluid via the nozzle. An upper part of the droplet still suspends on the nozzle, that is, the droplet has not been separated from the nozzle, while a lower part of the droplet is supported by the supporting arm, thereby avoiding the droplet from dropping. At the same time, the droplet may wrap the edge of the sample. Afterwards, the rotating component may be activated to drive the sample to rotate for at least one revolution, so that the droplet is capable to perform sampling on every position along the edge of the sample. Then, the scanning-liquid supplying-drawing component may draw the droplet via the nozzle. Thereby, scanning and sampling on the edge of the sample is completed, thereby providing a basis for conducting detection on the edge of the sample. In other words, the apparatus for edge scanning provided herein is capable to fill the blank in conventional technology by facilitating sampling and detection on the edge of the sample. Thereby, the sampling and detection on the sample is more thorough and thus perfected. In one e