EP-4507120-B1 - ANTENNA-IN-PACKAGE CONSTRUCTION WITH FREQUENCY DIVISION DUPLEX TECHNOLOGY

EP4507120B1EP 4507120 B1EP4507120 B1EP 4507120B1EP-4507120-B1

Inventors

CHIANG, CHING-WEN
CHEN, HUAN-TA
HO, CHUNG-LIEN
CHEN, Chin Pin

Dates

Publication Date: 20260506
Application Date: 20231013

Claims (15)

An antenna-in-package construction which is configured to transmit an uplink signal and to receive a downlink signal that have different frequency bands, comprising: a chip layer (10) comprising at least one transmitting chip (11) and at least one receiving chip (13); a first dielectric layer (21) on the chip layer, wherein the first dielectric has a dielectric constant that is higher than 3.5; a second dielectric layer (23) between the chip layer and the first dielectric layer; a transmitting array antenna (31) comprising a plurality of first antennas (311), electrically connected to the transmitting chip and extending from the transmitting chip to the first dielectric layer, wherein each of the first antennas is spaced a first distance from an adjacent one of the first antennas, and the first distance is close to a half-wave length; a receiving array antenna (33) comprising a plurality of second antennas (333), electrically connected to the receiving chip and extending from the receiving chip to the second dielectric layer, wherein the transmitting array antenna (31) and the receiving array antenna (33) are arranged in an alternating interleaved sequence, and each of the second antennas is spaced a second distance from an adjacent one of the second antennas, and the second distance is close to the half-wave length and is different from the first distance; and a plurality of metal isolation pillars (41) surrounding each of the first antennas and each of the second antennas.
The antenna-in-package construction as claimed in claim 1, wherein the first distance is less than the second distance.
The antenna-in-package construction as claimed in claims 1 or 2, wherein an area of each of the first antennas is different from an area of each of the second antennas.
The antenna-in-package construction as claimed in any of claims 1 to 3, wherein an area of each of the first antennas is smaller than an area of each of the second antennas.
The antenna-in-package construction as claimed in any of claims 1 to 4, wherein a length of each of the first antennas is longer than a length of each of the second antennas.
The antenna-in-package construction as claimed in any of claims 1 to 5, wherein each of the first antennas comprises at least one side edge, and each of the second antennas includes at least one edge corner, wherein the edge corner of the second antenna faces the side edge of an adjacent one of the first antennas.
The antenna-in-package construction as claimed in any of claims 1 to 6, wherein each of the first antennas and each of the second antennas have the same shape.
The antenna-in-package construction as claimed in any of claims 1 to 7, wherein the number of first antennas is an integer multiple of the number of second antennas.
The antenna-in-package construction as claimed in any of claims 1 to 8, wherein the uplink signal has a first frequency band ranging from 27 GHz to 40 GHz, and the downlink signal has a second frequency band ranging from 17 GHz to 27 GHz.
The antenna-in-package construction as claimed in any of claims 1 to 9, wherein a dielectric constant of the second dielectric layer is different from a dielectric constant of the first dielectric layer.
The antenna-in-package construction as claimed in any of claims 1 to 9, wherein the dielectric constant of the second dielectric layer is the same as the dielectric constant of the first dielectric layer.
The antenna-in-package construction as claimed in any of claims 1 to 11, further comprising: a redistribution wiring layer (25) comprising a plurality of conductive lines (35, 36) and disposed between the chip layer and the second dielectric layer, wherein the redistribution wiring layer is used for electrically connecting each of the first antennas to the transmitting chip and electrically connecting each of the second antennas to the receiving chip.
The antenna-in-package construction as claimed in any of claims 1 to 12, wherein the metal isolation pillars are also around the transmitting chip and the receiving chip.
The antenna-in-package construction as claimed in any of claims 1 to 13, further comprising: a grounding layer (27) comprising a plurality of grounding pillars (37), wherein the grounding layer is used for grounding the metal isolation pillars.
An antenna-in-package construction which is configured to transmit an uplink signal and to receive a downlink signal that have different frequency bands, comprising: a chip layer (10) comprising at least one transmitting chip (11) and at least one receiving chip (13); a first dielectric layer (21) on the chip layer, wherein the first dielectric has a dielectric constant that is higher than 3.5; a second dielectric layer (23) between the chip layer and the first dielectric layer; a transmitting array antenna (31) comprising a plurality of first antennas (311), electrically connected to the transmitting chip and extending from the transmitting chip to the second dielectric layer, wherein each of the first antennas is spaced a first distance from an adjacent one of the first antennas, and the first distance is close to a half-wave length; a receiving array antenna (33) comprising a plurality of second antennas (333), electrically connected to the receiving chip and extending from the receiving chip to the first dielectric layer, wherein the transmitting array antenna (31) and the receiving array antenna (33) are arranged in an alternating interleaved sequence, and each of the second antennas is spaced a second distance from an adjacent one of the second antennas, and the second distance is close to the half-wave length and is different from the first distance; and a plurality of metal isolation pillars (41) surrounding each of the first antennas and each of the second antennas.

Description

TECHNICAL FIELD The disclosure relates to an antenna-in-package construction, and in particular, relates to an antenna-in-package construction that includes a transmitting antenna array and a receiving antenna array arranged in an alternating interleaved sequence on the same plane, which can simultaneously transmit uplink signals and receive downlink signals in different frequency bands. BACKGROUND With the development of 5G communication technology, it is anticipated that future trends will lead to a 6G communication technology. Recently, phased array antennas have been applied to satellite communications, particularly low-Earth orbit (LEO) satellite communications. Technically, LEO satellite communications can address the challenges faced in mobile communications, wherein radio frequency (RF) signals cannot cover rugged terrain. Moreover, from a business perspective, companies like Starlink and Amazon in the West have already launched satellites into low-Earth orbit, aiming to establish communications between ground-based transceivers and LEO satellites. This shows that the global market for ground communication equipment for LEO satellites is booming. A phased array antenna consists of multiple antennas combined with communication devices that control their phases. By adjusting the phase of each individual antenna, beams can be directed in specific orientations at different times and in different spatial regions. For example, a high-directivity array 32×32 antenna has a gain that is greater than 30 dBi and a beam width of less than 3.5°. The space between adjacent antennas can range from a half-wave length (λ/2) to a quarter-wave length (λ/4), with the preferred space being a half-wave length (λ/2). Additionally, these high-directivity array antennas also exhibit minimal point errors and reduced grating lobes. In reality, when a transceiver transmits RF signals (also referred to as uplink signals), it operates at frequencies from 27.5 GHz to 30 GHz. However, when the transceiver receives RF signals (also referred to as downlink signals), it operates from 17.7 GHz to 20.2 GHz. If a transceiver transmits and receives uplink and downlink signals in different frequency bands simultaneously, the uplink signal and the downlink signal may interfere with each other between the phase-array antenna at the transmitting end (also referred to as transmitting array antenna) and the phase-array antenna at the receiving end (also referred to as receiving array antenna). Moreover, with antenna-in-package construction, the space between transmitting array antennas is 5.36 mm, whereas the space between receiving array antennas is 8.33 mm. This results in the space between a transmitting antenna and the adjacent receiving antenna not adhering to the optimal ratio of 12. To resolve the interference between uplink and downlink signals, a common solution is to arrange transmitting array antennas and receiving array antennas in a staggered arrangement. However, in this arrangement, because the area of the transmitting array antenna is smaller than the area of the receiving array antenna, the transmitting array antenna and the receiving array antenna partially overlap each other. Therefore, the uplink signal and downlink signal will still interfere with each other. Although the current transceiver is expected to encapsulate the above-mentioned antennas in a housing of the same size to effectively reduce the size of the transceiver, the aforementioned problems cannot be solved. US 2020/0035625 A1 discloses a semiconductor package including a semiconductor die and a first insulating encapsulation, a substrate, and a second insulating encapsulation. The first insulating encapsulation encapsulates the semiconductor die. The substrate includes a redistribution circuitry, wherein the substrate is electrically coupled to the semiconductor package through the redistribution circuitry. The second insulating encapsulation is disposed on and partially covers the substrate, wherein the substrate is sandwiched between the semiconductor package and the second insulating encapsulation. US 11,217,543 B2 discloses an antenna module that includes a fan-out semiconductor package including an IC, an encapsulant encapsulating at least a portion of the IC, a core member having a first side surface facing the IC or the encapsulant, and a connection member including at least one wiring layer electrically connected to the IC and the core member and at least one insulating layer, and an antenna package including a plurality of first directional antenna members configured to transmit or receive a first RF signal. The fan-out semiconductor package further includes at least one second directional antenna member disposed on a second side surface of the core member opposing the first side surface of the core member, stood up from a position electrically connected to at least one wiring layer, and configured to transmit or receive a second RF signal. US 10,505