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EP-4582844-B1 - HEAT DISSIPATION ARCHITECTURE OF PHOTOELECTRIC MODULE AND ELECTRONIC DEVICE

EP4582844B1EP 4582844 B1EP4582844 B1EP 4582844B1EP-4582844-B1

Inventors

  • LV, XIAOLONG
  • LIU, WEI
  • LAI, Guohong

Dates

Publication Date
20260513
Application Date
20230831

Claims (15)

  1. A heat dissipation structure for an optoelectronic module, comprising: an electronic chip; a plurality of optical engines, distributed along a periphery of the electronic chip; and a cold plate, comprising: a main cold plate (1) for dissipating heat for the electronic chip; a secondary cold plate (2) for dissipating heat for at least one of the plurality of optical engines; and a heat pipe assembly (3) corresponding to the secondary cold plate (2), the heat pipe assembly (3) comprising at least one heat pipe (31, 33, 34, 35), wherein the at least one heat pipe (31, 33, 34, 35) has an evaporating end (36) connected to the secondary cold plate (2), and a condensing end (37) connected to the main cold plate (1); wherein the main cold plate (1) is provided with a flow channel (6) for dissipating heat for the heat pipe assembly (3), and the secondary cold plate (2) has a maintenance operation position, wherein when the secondary cold plate (2) is in the maintenance operation position, there is an operational space between the secondary cold plate (2) and a respective one of the optical engines for maintaining the corresponding optical engine.
  2. The heat dissipation structure according to claim 1, wherein the electronic chip is of a polygonal structure, the at least one heat pipe (31, 33, 34, 35) comprises two first heat pipes (31) spaced apart along a length direction of a corresponding edge of the electronic chip, and the two first heat pipes (31) each comprise an evaporating end (36) rotationally arranged on the corresponding secondary cold plate (2), a condensing end (37) rotationally arranged on the main cold plate (1), and a connecting section connecting the evaporating end (36) and the condensing end (37); and the two first heat pipes (31) together with the main cold plate (1) and the secondary cold plate (2) form a double crank mechanism, wherein a connecting line between the two condensing ends of the two first heat pipes on the main cold plate is a frame (S) of the double crank mechanism, allowing the secondary cold plate (2) to switch from an installation operation position to the maintenance operation position.
  3. The heat dissipation structure according to claim 2, wherein the double crank mechanism is an unequal-length double crank mechanism or an equal-length double crank mechanism.
  4. The heat dissipation structure according to claim 2, wherein the at least one heat pipe (31, 32, 33, 34, 35) further comprises a virtual constraint heat pipe (32), the virtual constraint heat pipe (32) comprises an evaporating end (36) arranged on the secondary cold plate (2), a condensing end (37) arranged on the main cold plate (1), and a connecting section connecting the evaporating end (36) and the condensing end (37), and the virtual constraint heat pipe (32) forms a virtual constraint between the main cold plate (1) and the secondary cold plate (2).
  5. The heat dissipation structure according to claim 1, wherein the electronic chip is of a polygonal structure, the at least one heat pipe (31, 33, 34, 35) comprises a second heat pipe (33) arranged at one side of a corresponding edge of the electronic chip, the second heat pipe (33) comprises a first part (331) rotationally arranged on the main cold plate (1) and a second part (332) connected to the first part (331) and away from the main cold plate (1), and the second part (332) is fixedly connected to the secondary cold plate (2).
  6. The heat dissipation structure according to claim 5, wherein a length direction of the secondary cold plate (2) is parallel to a length direction of the corresponding edge of the electronic chip; and the first part (331) and the second part (332) form an angle with each other, and the first part (331) and the secondary cold plate (2) are sequentially arranged along the length direction of the secondary cold plate (2).
  7. The heat dissipation structure according to claim 1, wherein the electronic chip is of a polygonal structure, wherein the at least one heat pipe (31, 33, 34, 35) comprises at least one third heat pipe (34) arranged at one side of a corresponding edge of the electronic chip, the third heat pipe (34) comprises a third part (341) detachably connected to the main cold plate (1) and a fourth part (342) connected to the third part (341) and away from the main cold plate (1), and the fourth part (342) is fixedly connected to the secondary cold plate (2); or wherein the at least one heat pipe (31, 33, 34, 35) comprises at least one fourth heat pipe (35) arranged at one side of a corresponding edge of the electronic chip, and the fourth heat pipe (35) comprises a fifth part (351) detachably connected to the main cold plate (1) and a sixth part (352) connected to the fifth part (351) and away from the main cold plate (1), the sixth part (352) being fixedly connected to the corresponding secondary cold plate (2).
  8. The heat dissipation structure according to any one of claims 1 to 7, wherein the plurality of optical engines are divided into a plurality of optical engine groups, and the plurality of optical engine groups respectively correspond to different edges of the electronic chip, wherein each of the optical engine groups comprises a plurality of optical engines arranged along a length direction of the corresponding edge of the electronic chip, and the secondary cold plate (2) corresponds to one of the plurality of optical engine groups.
  9. The heat dissipation structure according to any one of claims 1 to 8, wherein the main cold plate (1) is provided with a first limiting insertion hole corresponding to the condensing end (37) of the at least one heat pipe (31, 33, 34, 35), the condensing end (37) is inserted into the first limiting insertion hole, and an inner wall of the first limiting insertion hole or an outer peripheral surface of the at least one heat pipe (31, 33, 34, 35) is provided with a first thermally conductive layer (41); and/or wherein the secondary cold plate (2) is provided with a second limiting insertion hole corresponding to the evaporating end (36) of the at least one heat pipe (31, 33, 34, 35), the evaporating end (36) of the at least one heat pipe (31, 33, 34, 35) is inserted into the corresponding second limiting insertion hole, and an inner wall of the second limiting insertion hole or an outer peripheral surface of each of the at least one heat pipe (31, 33, 34, 35) is provided with a second thermally conductive layer (42).
  10. The heat dissipation structure according to any one of claims 1 to 9, wherein the flow channel (6) is arranged around a periphery of the heat pipe assembly (3) to achieve heat dissipation for the electronic chip and the heat pipe assembly (3).
  11. The heat dissipation structure according to claim 10, wherein the main cold plate (1) is provided with a coolant inlet (7) and a coolant outlet (8), and one end of the flow channel (6) communicates with the coolant inlet (7) and another end of the flow channel (6) communicates with the coolant outlet (8).
  12. The heat dissipation structure according to claim 11, wherein the coolant inlet (7) communicates with the flow channel (6) through a liquid distribution structure (91), and the coolant outlet (8) communicates with the flow channel (6) through a liquid collection structure (92).
  13. The heat dissipation structure according to any one of claims 1 to 12, wherein the main cold plate (1) is a rectangular cold plate, the at least one heat pipe (31, 33, 34, 35) is connected to a periphery of the rectangular cold plate, and the rectangular cold plate is provided with a radiator (5).
  14. The heat dissipation structure according to claim 13, wherein the at least one heat pipe (31, 33, 34, 35) is arranged on the main cold plate (1) and is located in a peripheral area of the radiator (5).
  15. An electronic device, comprising the heat dissipation structure for the optoelectronic module according to any one of claims 1 to 14.

Description

TECHNICAL FIELD This application relates to the technical field of optoelectronic modules and particularly to a heat dissipation structure for an optoelectronic module, and an electronic device. BACKGROUND Under the strong pull of technologies such as High Performance Computing (HPC) and Artificial Intelligence (AI) exerted on the demand for exchange bandwidth in data centers, optical components of electronic devices are rapidly evolving along the technological routes of Co-packaged Optics CPO (CPO) and Near-packaged Optics (NPO). This has led to significant changes in the thermal source distribution of optoelectronic modules within electronic devices. Taking an optoelectronic module that includes an ASIC chip and 16 Optical Engines (OEs) closely surrounding the ASIC chip as an example, the total heat dissipation power of the optoelectronic module is as high as 1100-1850 W. Thus, the heat dissipation for the optoelectronic module has become a challenge and hinders the practical application of CPO/NPO technology. US 2021/0280566 A1, US2022/0151095 A1 and US 2014/0160679 A1 disclose heat dissipation structures for optoelectronic modules. SUMMARY The exemplary embodiments of this application provide a heat dissipation structure for an optoelectronic module and an electronic device, which can improve the cumbersome process of optical module replacement in replacing an optoelectronic module that requires removing the entire cold plate. The invention provides a heat dissipation structure for an optoelectronic module, including: an electronic chip;a plurality of optical engines, the plurality of optical engines being distributed along a periphery of the electronic chip; anda cold plate, the cold plate including: a main cold plate for dissipating heat for the electronic chip;a secondary cold plate for dissipating heat for at least one of the plurality of optical engines; anda heat pipe assembly corresponding to the secondary cold plate, the heat pipe assembly including at least one heat pipe, where the at least one heat pipe has an evaporating end connected to the secondary cold plate and a condensing end connected to the main cold plate;where the main cold plate is provided with a flow channel for dissipating heat for the heat pipe assembly, andthe secondary cold plate has a maintenance operation position, where when the secondary cold plate is in the maintenance operation position, there is an operational space between the secondary cold plate and the corresponding optical engine for maintaining the corresponding optical engine. In the heat dissipation structure for an optoelectronic module provided by the exemplary embodiments of this application, the main cold plate dissipates heat for the electronic chip, the evaporating end of the heat pipe assembly takes away the heat from the secondary cold plate, and the main cold plate cools the condensing end of the heat pipe assembly, thereby dissipating heat for each optical engine. The secondary cold plate has a maintenance operation position, and when the secondary cold plate is in the maintenance operation position, there is an operational space between the secondary cold plate and the corresponding optical engine for maintaining the optical engine. Consequently, for maintenance tasks on the optical engines (such as repairs or replacements), there is no need to remove the entire cold plate system; instead, simply positioning the secondary cold plate in the maintenance operation position suffices. Compared with traditional technology, the heat dissipation structure for an optoelectronic module provided by the exemplary embodiments of this application makes the replacement and maintenance of the optical engines more convenient and quicker. Furthermore, in the heat dissipation structure for an optoelectronic module provided by this application, no liquid pipeline or connector is introduced for the connection between the main cold plate and the secondary cold plate. Thus, there is no risk of coolant leakage on the connection between the main cold plate and the secondary cold plate, which is more conducive to the safe operation of the electronic device provided with this heat dissipation structure. Optionally, the electronic chip is of a polygonal structure, the at least one heat pipe includes two first heat pipes spaced apart along a length direction of a corresponding edge of the electronic chip, and the two first heat pipes each include an evaporating end rotatably arranged on the corresponding secondary cold plate, a condensing end rotatably arranged on the main cold plate, and a connecting section connecting the evaporating end and the condensing end; and the two first heat pipes together with the main cold plate and the secondary cold plate constitute a double crank mechanism, and a connecting line between the two condensing ends of the two first heat pipes on the main cold plate is a frame of the double crank mechanism, allowing the secondary cold plate to switch