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EP-4617599-B1 - HEAT DISSIPATION STRUCTURE COMBINING VAPOR CHAMBER WITH HEAT PIPE AND MANUFACTURING METHOD THEREOF

EP4617599B1EP 4617599 B1EP4617599 B1EP 4617599B1EP-4617599-B1

Inventors

  • LIN, CHUN-HUNG

Dates

Publication Date
20260506
Application Date
20240419

Claims (10)

  1. A heat dissipation structure, comprising: a vapor chamber (1), comprising an upper shell (11), a lower shell (12) correspondingly sealed with the upper shell (11), and a first wick structure (13) disposed on an inner surface of the upper shell (11), wherein a chamber (S) is defined between the upper shell (11) and the lower shell (12), a penetration hole (111) communicating with the chamber (S) is defined on the upper shell (11), and a through hole (131) corresponding to the penetration hole (111) is defined on the first wick structure (13); a heat pipe (2), comprising a pipe (21) inserted to and sealed with the penetration hole (111) and a second wick structure (22) disposed on an inner surface of the pipe (21), and a working fluid, filled in the chamber (S), characterized in that a hollow slot (211) corresponding to the through hole (131) is defined on the pipe (21), the second wick structure (22) comprises a revealing section (221) exposed from the hollow slot (211); and in that an inner diameter of the through hole (131) is smaller than an inner diameter of the penetration hole (111), and the first wick structure (13) is embedded in the hollow slot (211) and attached to the revealing section (221).
  2. The heat dissipation structure according to claim 1, wherein the hollow slot (211) is structured in a manner of the pipe (21) being scrapped or cut.
  3. The heat dissipation structure according to claim 1, wherein the first wick structure (13) and the second wick structure (22) comprise a metal braided mesh or a combination of a metal braided mesh and a powder sintered body, respectively.
  4. The heat dissipation structure according to claim 1, wherein the pipe (21) comprises a bottom edge (212), and a gap (H) is defined between a lower edge of the hollow slot (211) and the bottom edge (212).
  5. The heat dissipation structure according to claim 1, wherein the lower shell (12) comprises a plurality of protrusions (121) extending toward the chamber (S), and the pipe (21) comprises a bottom edge (212) abutting against tops of the plurality of protrusions (121).
  6. The heat dissipation structure according to claim 1, wherein the hollow slot (211) is an annular groove arranged along an entire circumference of the pipe (21).
  7. The heat dissipation structure according to claim 1, wherein the hollow slot (211) is a C-shaped groove (214) arranged along a partial circumference of the pipe (21).
  8. A manufacturing method of a heat dissipation structure as defined in claim 1, the manufacturing method comprising: A) preparing an upper shell (11), and processing and forming a penetration hole (111) on the upper shell (11); B) preparing a first wick structure (13), and processing and forming a through hole (131) corresponding to the penetration hole (111) on the first wick structure (13), wherein an inner diameter of the through hole (131) is smaller than an inner diameter of the penetration hole (111); C) disposing the first wick structure (13) on a surface of the upper shell (11), and aligning the through hole (131) with the penetration hole (111); D) preparing a lower shell (12), and sealing the upper shell (11) and the lower shell (12) correspondingly, wherein a chamber (S) is defined between the upper shell (11) and the lower shell (12); E) preparing a heat pipe (2), wherein the heat pipe (2) comprises a pipe (21) and a second wick structure (22) disposed on an inner surface of the pipe (21), processing and forming a hollow slot (211) on the pipe (21), and exposing a revealing section (221) of the second wick structure (22) from the hollow slot (211); F) inserting the heat pipe (2) into the penetration hole (111) and sealing the heat pipe (2) with the penetration hole (111), disposing the revealing section (221) corresponding to the through hole (131) to embed the first wick structure (13) in the hollow slot (211), and attaching the first wick structure (13) with the revealing section (221); and G) performing a filling process and a degassing and sealing processes on a semi-finished product in step F).
  9. The manufacturing method according to claim 8, wherein the D) further comprises stamping the lower shell (12) to form a plurality of protrusions (121); and the F) further comprises abutting a bottom edge (212) of the pipe (20) against tops of the plurality of protrusions (121).
  10. The manufacturing method according to claim 8, wherein the E) further comprises scraping or cutting the pipe (21) to form the hollow slot (211).

Description

BACKGROUND OF THE DISCLOSURE Technical Field The technical field relates to a heat dissipation structure and a manufacturing method thereof, and more particularly relates to a heat dissipation structure combining a vapor chamber with a heat pipe and a manufacturing method thereof. Description of Related Art With the increasing computing speed of electronic components, the generated heat is also rising. To effectively solve the issue of high heat, the industry has developed heat pipes and vapor chambers with excellent thermal conductivity for widespread use. While the heat pipe maintains the direction of the gaseous working fluid flow, the heat conduction is limited by its volume. Additionally, vapor chambers offer a large heating area for direct contact with the heat source. However, the turbulent flow of the gaseous working fluid may restrict heat conduction and dissipation effectiveness. In order to solve the aforementioned issues, the industry has assembled heat pipes and vapor chambers to constitute a thermal conductive structure. The manufacturing process is as follows. First, the shell plate of the vapor chamber and the heat pipe are welded together. Second, a mandrel is inserted, and metal powder is filled, then subjected to sintering processing in heating equipment, then subjected to sintering processing in heating equipment. Afterward, the mandrel is removed from the heat pipe. Following this, processes such as sealing with another shell plate of the vapor chamber are performed to complete the thermal conductive structure. Although the thermal conductive structures in the related art possess properties of heat conduction and dissipation, their production process is quite complicated and not conducive to mass production. Furthermore, since the mandrel extends into the bottom end (closed end) of the heat pipe, extracting it from the heat pipe after the sintering process is completed may be challenging. The mandrel adheres to the wick structure over a large area. During the extracting process, the mandrel may easily cause damage or cracking to the wick structure, and that results in poor production yield of the product that needs improvement. US 2017/312871 A1, for instance, discloses a heat dissipation structure according to the preamble of claim 1. In view of the above drawbacks, the inventor proposes this disclosure based on his expert knowledge and elaborate researches in order to solve the problems of related art. SUMMARY OF THE DISCLOSURE In particular it is an object of the present disclosure to provide a heat dissipation structure, in particular a heat dissipation structure for cooling electronic components, enabling a more efficient heat dissipation with a simple and low-cost configuration of the heat dissipation structure. It is a further object of the present disclosure to provide a method for manufacturing such a heat dissipation structure. According to the present disclosure, this problem is solved by a heat dissipation structure as claimed in claim 1 and by a method for manufacturing such a heat dissipation structure as claimed in claim 8. Further advantageous embodiments are the subject-matter of the dependent claims. This disclosure discloses a heat dissipation structure combining a vapor chamber with a heat pipe and a manufacturing method thereof, in which the vapor chamber and the heat pipe are manufactured separately, and then the heat pipe is directly inserted into the vapor chamber to enhance the easy production of the heat dissipation structure for mass production. This disclosure is a heat dissipation structure combining a vapor chamber with a heat pipe. The heat dissipation structure includes a vapor chamber, a heat pipe, and a working fluid. The vapor chamber includes an upper shell, a lower shell correspondingly sealed with the upper shell, and a first wick structure disposed on the inner surface of the upper shell. A chamber is defined between the upper shell and the lower shell. A penetration hole communicating with the chamber is defined on the upper shell. A through hole corresponding to the penetration hole is defined on the first wick structure. The heat pipe includes a pipe inserted to and sealed with the penetration hole and a second wick structure disposed on an inner surface of the pipe. A hollow slot corresponding to the through hole is defined on the pipe. The second wick structure includes a revealing section exposed from the hollow slot. The working fluid is filled in the chamber. An inner diameter of the through hole is smaller than an inner diameter of the penetration hole. The first wick structure is embedded in the hollow slot and attached to the revealing section. This disclosure is a manufacturing method of a heat dissipation structure combining a vapor chamber with a heat pipe. The manufacturing method includes the following steps: A) preparing an upper shell, and processing and forming a penetration hole on the upper shell; B) preparing a first wick stru