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EP-4641628-B1 - CYLINDER PLATE OF A DEVICE FOR CONNECTING A COMPONENT TO A SUBSTRATE

EP4641628B1EP 4641628 B1EP4641628 B1EP 4641628B1EP-4641628-B1

Inventors

  • ULZHÖFER, CHRISTIAN
  • EYRICH, Tobias

Dates

Publication Date
20260513
Application Date
20250410

Claims (15)

  1. A cylinder plate (19) for a device for connecting a component to a substrate, comprising a chamber that can be divided into at least two parts, wherein the cylinder plate (19) is provided on a first part (1) of the chamber, and formed in the cylinder plate (19) are: a cylinder bore (118; 118a, 118b, 118c) for receiving a reciprocating piston (117) which, when pressurized with a gaseous pressure medium, can be brought into abutment with a punch (11, 111) for pressure transmission so as to press the punch against a counter-punch (31) provided on a second part (3), and a pressure supply line (115; 115a, 115b, 115c) via which a pressure medium can be supplied to the cylinder bore (118; 118a, 118b, 118c) to actuate the piston (117), characterized in that the cylinder plate (19) is manufactured by additive manufacturing.
  2. The cylinder plate according to claim 1, wherein a plurality of cylinder bores (118) are provided in the cylinder plate (19), with reciprocating pistons (117) received therein, and each cylinder bore can be supplied with a pressure medium via a pressure supply line (115; 115a, 115b, 115c) formed in the cylinder plate.
  3. The cylinder plate according to claim 1 or 2, wherein a plurality of cylinder bores (118a, 118b, 118c) are provided in the cylinder plate (19), and individual cylinder bores (118a, 118b, 118c) are grouped together, and the cylinder bores (118a, 118b, 118c) of a group can be supplied with a pressure medium via a separate pressure supply line (115a, 115b, 115c) formed in the cylinder plate (19).
  4. The cylinder plate according to any one of claims 1 to 3, wherein multiple pressure supply lines (115a, 115b, 115c) are provided in a single plane of the cylinder plate (19), and intersections or crossings (115a:115b, 115a:115c, 115c:115b) of two different pressure supply lines are avoided by bypassing the first pressure supply line (115b; 115c) by the second pressure supply line (115a; 115c; 115a) via a second plane of the cylinder plate (19).
  5. The cylinder plate according to any one of claims 1 to 4, wherein at least one portion of the pressure supply line (115; 115a, 115b, 115c) is formed in a shape deviating from a straight shape.
  6. The cylinder plate according to any one of claims 1 to 5, wherein the pressure supply line (115) has a circular cross-section or a cross-section deviating from a circular shape.
  7. The cylinder plate according to any one of claims 1 to 6, wherein the pressure supply line (115) has a diameter between 0.1 mm and 1 mm.
  8. The cylinder plate according to any one of claims 1 to 7, wherein the cylinder plate (19) is made of aluminum or an aluminum alloy.
  9. The cylinder plate according to any one of claims 1 to 8, wherein the cylinder plate comprises multiple parts (19a, 19b, 19c, 19d).
  10. The cylinder plate according to any one of claims 1 to 9, wherein the cylinder plate (19; 19a, 19b, 19c, 19d) includes holes (195a, 195b, 195c, 195d) in corner regions for supporting via pins (20a, 20b, 20c, 20d) on an upper part (1) of a device for connecting a component to a substrate.
  11. The cylinder plate according to claim 10, wherein the holes (195a, 195b, 195c, 195d) are designed as elongated holes the longitudinal axes of which have an intersection point that defines a zero point.
  12. The cylinder plate according to claim 11, wherein each longitudinal axis lies on a line connecting the respective corner of the cylinder plate (19; 19a, 19b, 19c, 19d) to a center point (A) of the cylinder plate (19) or a contact point (A) of multiple parts (19a, 19b, 19c, 19d) of the cylinder plate.
  13. Device for connecting a component to a substrate, comprising a chamber which can be divided into at least two parts, wherein a punch (11, 111) is provided on a first part (1), and a counter-punch (31) is provided on a second part (3), wherein the first part (1) can be brought into abutment with the second part (3) to close the chamber, wherein the counter-punch (31) can be loaded with starting materials in an open state of the chamber, and in a closed state of the chamber pressure can be exerted via the punch (11) on the starting materials provided between the punch (11, 111) and the counter-punch (31), wherein a cylinder plate according to any one of claims 1 to 12 is provided on the first part, and the pressure of the gaseous pressure medium in the pressure supply line (115; 115a, 115b, 115c) is transmitted to the punch (11, 111) by means of a piston (117).
  14. A method for manufacturing a cylinder plate (19) having cylinder bores (118) that are connected via a pressure supply line (115) to a port (193), wherein the cylinder plate (19) is additively manufactured by applying a material that solidifies after application in layers onto a manufacturing surface, wherein the cylinder bores (118) and the pressure supply lines (115) are left out during the application of the material.
  15. The method according to claim 14, wherein the pressure supply lines (115, 115a, 115b, 115c) lie in a single plane of the cylinder plate, and intersections or crossings of two different pressure supply lines (115a:115b; 115a, 115c; 115c; 115b) are formed by bypassing one pressure supply line (115b; 115c) by the other pressure supply line (115a; 115a, 115c) via a second plane.

Description

The invention relates to a cylindrical plate of a device for connecting a component to a substrate and to such a device. BACKGROUND OF THE INVENTION With the increasing need of the electronics industry for the development of efficient and high-temperature resistant components such as chips, the sintering of a bonding layer between the component and the substrate is gaining in popularity. Sintering is known, among other things, as a process for manufacturing metal or ceramic parts. In this process, a fine- or coarse-grained green body is created by compressing a powdered starting material. This green body then undergoes a subsequent heat treatment to achieve its final shape and become a solid workpiece. Sintering, as defined in the application and used in the manufacturing and processing of components such as semiconductor chips, refers to a similar process of pressing a component and a substrate together under predetermined pressure and temperature for a specific period of time, thereby creating a bond between the two elements. The current state of the art involves the use of pasty materials such as silver or copper paste, or even nanostructured platelets, which serve as a connection between the chip and the substrate and are sintered by the application of pressure and temperature. Such sintering as a method for bonding a component to a substrate is known and has proven advantageous compared to previously used tin- or lead-based soldering processes. For such a sintering process, certain parameters, such as a set temperature, pressure, and holding time, must be defined to ensure effective bonding of the component to the substrate. These parameters can be determined based on experiments, depending on the requirements. In such sintering processes, a bonding agent can also be advantageously used, applied between the component and the substrate. The thickness of the bonding agent layer can then be another parameter. A silver paste is preferably used as such a bonding agent. Preferably, during a sintering process, the binder, e.g., a silver paste, does not undergo a phase transformation, as is the case in tin- and lead-based soldering processes. Through appropriate temperature and pressure application, particles of the binder diffuse into the surface of the substrate and the component to be bonded. This creates a surface-to-surface bond instead of a phase-change bond. Effective fastening requires a parallel, uniform force distribution across the component's surface, and this must be ensured. Therefore, a custom force application component is a preferred solution for modern electronics manufacturers, guaranteeing a high-quality connection. Custom force application means a separate tool for each component-substrate pairing, which can result in high tooling costs. The application of temperature and pressure is necessary to achieve an effective bond between the component and the substrate; otherwise, the quality of the bond could be poor or too slow for practical purposes. The principle of the process does not involve a phase transformation of the joining medium (e.g., silver paste), as is the case with tin- and lead-based soldering processes. Through appropriate application of temperature and pressure, Silver components diffuse into the surface of the substrate and the component being attached. This results in a surface-to-surface contact rather than a phase-change contact. The terms "die attach" or "die packaging" are also commonly used for this type of process. The printed matter DE 10 2013 101 124 Figure 1 shows a device and a process for sintering a product. The sintered product comprises a component and a substrate. To join these, the sintered product is placed in a device with a press table and a press ram. By increasing the temperature using a heating device, a pressure element in the press ram expands, thereby exerting pressure on the sintered product. This bonds the component to the substrate. The printed matter DE 10 2015 120 156 A1 Disclosing a device for the material-locking connection of connection partners of a power electronics component. Here, a dimensionally stable frame acts on one of the connection partners, while an elastic cushion acts on a second connection partner to build up the pressure required for joining. The printed matter JP H11 - 121 532 A discloses a sintering device in which pistons are pneumatically actuated to exert pressure on a product to be sintered. The printed matter EP 2 954 550 B1 Disclosing a sintering device in which several pistons are housed in cylinder bores of a cylinder plate. The pistons can be pneumatically actuated to transmit pressure via rams to a product to be sintered. To actuate the pistons, a pressure medium must be supplied to the cylinder bores via pressure supply lines. According to the state of the art, these pressure supply lines are manufactured by drilling holes from outside the cylinder plate. In the case of more extensive For piping systems, it is