EP-4647474-A3 - CHEMICAL MECHANICAL POLISHING COMPOSITIONS AND METHODS OF USE THEREOF
EP4647474A3EP 4647474 A3EP4647474 A3EP 4647474A3EP-4647474-A3
Abstract
A polishing composition includes at least one abrasive, at least one organic acid, at least one anionic surfactant comprising at least a phosphate, at least one phosphonic acid compound having a molecular weight below 500 g/mol, at least one azole containing compound, at least one alkylamine compound having a 6-24 carbon alkyl chain, and an aqueous solvent, and optionally, a pH adjuster.
Inventors
- LIANG, Yannan
- HU, BIN
- HUANG, TING-KAI
- CHANG, SHU-WEI
- WEN, Liqing (Richard)
Assignees
- FUJIFILM Electronic Materials U.S.A., Inc.
Dates
- Publication Date
- 20260513
- Application Date
- 20211210