Search

EP-4664516-A3 - PACKAGED SEMICONDUCTOR DEVICE AND METHOD FOR PACKAGING

EP4664516A3EP 4664516 A3EP4664516 A3EP 4664516A3EP-4664516-A3

Abstract

A packaged semiconductor device includes a device die, at least one device contact, a substrate, and at least one substrate contact. The device die has a first device side and a second device side opposite to the first device side. The at least one device contact is arranged on the first device side of the device die. The substrate has a first substrate side and a second substrate side opposite to the first substrate side. The at least one substrate contact is arranged on the first substrate side of the substrate. The device die is attached to the substrate with the first device side facing the first substrate side. The at least one device contact is in direct contact with a corresponding one of the at least one substrate contact. Either or both of the at least one device contact and the at least one substrate contact are elastic.

Inventors

  • GE, You
  • WANG, ZHIJIE
  • LEE, YIT MENG

Assignees

  • NXP USA, Inc.

Dates

Publication Date
20260506
Application Date
20250602