EP-4664518-A3 - CHIP PACKAGING STRUCTURE AND DOMAIN CONTROLLER
Abstract
Disclosed are a chip packaging structure and a domain controller, including: a heat-generating chip; a substrate, the substrate carrying the heat-generating chip; a heat dissipating cover covering the substrate to form an accommodating space for the heat-generating chip enclosed by the substrate, an inner bottom wall of the heat dissipating cover, and an inner side wall of the heat dissipating cover; a thermal conductive medium provided between a first surface of the heat-generating chip and a first region of an inner bottom wall; and a reinforcing structure abutting against a second region of the inner bottom wall other than the first region and an inner side wall, wherein a second surface of the reinforcing structure facing the heat-generating chip meets that: the closer a part of the second surface is to the inner side wall, the further it is away from the second region in distance, and vice versa.
Inventors
- GUO, Mao
- ZHANG, MIN
Assignees
- Horizon Journey (Shanghai) Technology Co., Ltd.
Dates
- Publication Date
- 20260506
- Application Date
- 20251021