COMPONENT CARRIER WITH EMBEDDED TRACKS PROTRUDING UP TO DIFFERENT HEIGHTS

Abstract

Component carrier (100) comprising a stack (102) comprising at least one electrically conductive layer structure (104) and/or at least one electrically insulating layer structure (106), at least one first electrically conductive track (108) extending from a vertical level (110) defined by one of the layer structures (104, 106) up to a first height (h1), at least one second electrically conductive track (112) extending from the vertical level (110) defined by the one of the layer structures (104, 106) up to a second height (h2) being larger than the first height (h1), and at least one further electrically insulating layer structure (122) in which the at least one first electrically conductive track (108) and the at least one second electrically conductive track (112) are embedded, an undercut (199) is provided at a bottom portion of at least one of the at least one first electrically conductive track (108) and/or at least one of the at least one second electrically conductive track (112) and/or at least one of the at least one first electrically conductive track (108) and the at least one second electrically conductive track (112) is a multilevel track composed of at least two stacked track constituents (114, 116) and a lateral extension (I1) of an upper one of the at least two stacked track constituents (114, 116) is larger than a lateral extension (I2) of a lower one of the at least two stacked track constituents (114, 116).

Inventors

Wilfing, Roland

Assignees

AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

Dates

Publication Date: 20260506
Application Date: 20200313