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EP-4735554-A1 - A PROCESS FOR MAKING TEMPERATURE REGULATING POLYMERIC RETROFITS THROUGH FORM STABILIZATION

EP4735554A1EP 4735554 A1EP4735554 A1EP 4735554A1EP-4735554-A1

Abstract

The present disclosure relates generally to the field of phase changing material (PCM). Particularly, the present disclosure provides a process for preparing a form stabilized temperature regulating polymer retrofit, the process comprising the steps of: (a) preparing a slurry by mixing one or more polymers and one or more organic materials at a first temperature; (b) encapsulating the slurry; (c) optionally, compressing the encapsulated slurry; (d) exposing the encapsulated slurry to a second temperature ranging from about 60°C to 200°C for a time period ranging from about 30 minutes to about 10 hours; and (e) allowing the heated slurry to cool down to a third temperature ranging from about 2°C to about 35°C to obtain the form stabilized temperature regulating polymer retrofit.

Inventors

  • Christy, John Victor
  • JAISWAL, Amrit
  • Yadav, Rajkumar
  • AGRAWAL, Nidhi
  • JAIN, Samit

Assignees

  • Pluss Advanced Technologies Limited

Dates

Publication Date
20260506
Application Date
20240627

Claims (10)

  1. 1. A process for preparing a form stabilized temperature regulating polymer retrofit, the process comprising the steps of: (a) preparing a slurry by mixing one or more polymers and one or more organic materials at a first temperature; (b) encapsulating the slurry; (c) optionally, compressing the encapsulated slurry; (d) exposing the encapsulated slurry to a second temperature ranging from about 60°C to 200°C for a time period ranging from about 30 minutes to about 10 hours; and (e) allowing the heated slurry to cool down to a third temperature ranging from about 2°C to about 35°C to obtain the form stabilized temperature regulating polymer retrofit.
  2. 2. The process as claimed in claim 1, wherein the slurry was prepared at the first temperature ranging from about 35°C to about 85°C, preferably, at a temperature ranging from about 60°C to about 70°C.
  3. 3. The process as claimed in claim 1, wherein the polymers and organic materials are mixed in a ratio of 9: 1.
  4. 4. The process as claimed in claim 1, wherein the organic PCM and polymer are processed to form a form stable PCM by an in situ reaction mechanism and contents of the PCM are packed and processed in the same container in which it is packed.
  5. 5. The process as claimed in claim 1, wherein the one or more polymers is selected from any or a combination of polystyrene, High-density polyethylene (HDPE), Low-density polyethylene (LDPE), Ethylene vinyl alcohol (EVOH), Styrene -butadiene block copolymer (SBS) or a hydrogenated styrene-butadiene block copolymer (SEBS) and polymethyl methacrylate (PMMA).
  6. 6. The process as claimed in claim 1, wherein the one or more organic materials is selected from any or a combination of paraffin, fatty acid, fatty alcohol and fatty ester.
  7. 7. The process as claimed in claim 1, wherein the step of encapsulation comprises filling the slurry in a mold.
  8. 8. The process as claimed in claim 1, wherein the slurry has a viscosity ranging from about 50 to 1000 cps.
  9. 9. The process as claimed in claim 1, wherein the step of encapsulation comprises filling the slurry in a container and sealing the container; wherein, the container is a rigid container or a flexible container.
  10. 10. The process as claimed in claim 1, wherein the encapsulated slurry is compressed at a weight ranging from about 0.5 to 5 kg/cm 2 ’ preferably from about 2 to 5 kg/cm 2 and more preferably from about 3 to 5 kg/cm 2 .

Description

A PROCESS FOR MAKING TEMPERATURE REGULATING POLYMERIC RETROFITS THROUGH FORM STABILIZATION FIELD OF THE INVENTION [0001] The present disclosure relates generally to the field of phase changing material (PCM). Particularly, the present disclosure relates to a process for preparation of form stabilized temperature regulating polymeric retrofits of organic materials. BACKGROUND OF THE INVENTION [0002] Background description includes information that may be useful in understanding the present invention. It is not an admission that any of the information provided herein is prior art or relevant to the presently claimed invention, or that any publication specifically or implicitly referenced is prior art. [0003] A phase change material (PCM) is a substance that releases/absorbs sufficient energy during phase transition to provide useful thermal regulation. Generally, the transition will be from one of the first two fundamental states of matter - solid and liquid - to the other at a particular temperature. The phase transition may also be between non-classical states of matter, such as the conformity of crystals, where the material goes from conforming to one crystalline structure to conforming to another, which may be a higher or lower energy state. By melting and solidifying at the phase change temperature (PCT), a PCM is capable of storing and releasing large amounts of energy compared to sensible heat storage. Heat is absorbed or released when the particle changes from solid to liquid and vice versa or when the internal structure of the material changes. The PCM embedded in a polymer matrix where the complete material does not undergo the phase change into the liquid state is called as Form Stabilized Panel (FSP), alternatively and synonymously referred to as form stabilized temperature regulating polymeric retrofits hereinafter. [0004] The form stabilized panel finds application in multiple areas where energy storage and/or stable temperatures are required, including, among others, construction materials, heating pads, panels, temperature-controlled packaging solutions for temperaturesensitive pharmaceutical products and perishable food items, cooling for telephone switching boxes, cosmetic products like capsules in lotions, facewash, perfumes and scrub solutions, and clothing. Since PCM transform between solid and liquid in thermal cycling, therefore, encapsulation naturally became the obvious choice to prevent the leakage of PCM. [0005] Different methods of form stabilization are reported in the literature. However, none of the current approaches/reports seems to satisfy the existing needs and leads to leakage of PCM due to mechanical pressure, sudden rise in temperature, encapsulation rupture during crystal growth patterns, and fatigue stresses generated during melting and freezing cycles. In conventional processes, the reactants are processed at higher temperature, resulting in degradation of the reactant as well the final product, form stabilized panel. [0006] CA1304873C, focuses on form stable PCM of long alkyl chain phase change material such as fatty acid or paraffin wax with polymer matrix of Polyolefin (polyethylene (high or low-density), polypropylene, polybutene, crystalline polystyrene or poly(4-methyl-pentene- 1)). [0007] CN111394066A reports form stable paraffin or myristic acid with polymer matrix of styrene-butadiene block copolymer (SBS) or a hydrogenated styrene-butadiene block copolymer (SEBS). The organic phase change material is heated to 80-90 °C to melt it, adding the thermoplastic elastomer and heating and stirring at 120-140 °C for 30-50 min, carrying out ultrasonic treatment at 80-90 °C and 28-53 kHz for 20-30 min. The material is transferred to a mold and cooling to 20-30 °C for more than 30 min and forming and obtaining the material after complete solidification. [0008] US2013228308A1 reports coated pallets based form stable organic PCM of paraffins, fatty acids, fatty acid esters, fatty alcohols, sugar alcohols, or glycols with polymer matrix of thermoplastic polymer (high-density polyethylene). Organic PCM and a polymer are fed to an extruder to form a homogenous molten plastic compound, extruding the molten plastic compound through a die to form an extrudate. Cooling and cutting the extrudate into pellets and further coating the pellets. [0009] CN107936930A reports paraffin, fatty acid or sugar alcohol PCMs with high density polyethylene (HDPE) polymer matrix. High density polyethylene (HDPE) is dissolved in an organic solvent at 120-130 °C and the organic phase change material is added and solution stirred until the mixture is fully mixed, the mixture is then dried in a constant temperature oven at 100-110 °C to obtain the polymer-shaped composite phase change material. [0010] There is therefore an unmet need in the art to develop a new and improved process for preparing form stabilized temperature regulating polymeric retrofits that may overcome one or more limitations asso