EP-4735837-A1 - SENSOR MOUNTING DEVICE AND METHOD FOR MOUNTING THE SENSOR MOUNTING DEVICE TO A POWER SEMICONDUCTOR DEVICE

Abstract

Sensor mounting device and method for mounting the sensor mounting device to a power semiconductor device Sensor mounting device (10) comprising a device body (11) with a first side surface (111) and an opposing second side surface (112), wherein a locating structure (12) is located at the first side surface (111), and at least a sensor location (14). At least one sensor element (15) is accommodated inside the at least one sensor location (14). The sensor mounting device (10) further comprises at least one first mounting structure (18), adapted for mounting the sensor mounting device (10) to a corresponding at least one second mounting structure (35) of a semiconductor power device (30).

Inventors

• KELLER, TOBIAS
• TRUESSEL, DOMINIK
• FISCHER, Fabian

Assignees

• Hitachi Energy Ltd

Dates

Publication Date

20260506

Application Date

20230628

Claims (1)

1. P2023,0467 WO E / P220350WO01 June 28, 2023 - 19 - Claims 1. Sensor mounting device (10) comprising - a device body (11) with a first side surface (111) and an opposing second side surface (112), wherein − at least one locating structure (12) is located at the first side surface (111) - at least one sensor location (14), wherein − at least one sensor element (15) is accommodated inside the at least one sensor location (14), - at least one first mounting structure (18), adapted for mounting the sensor mounting device (10) to a corresponding at least one second mounting structure (35) of a semiconductor power device (30). 2. Sensor mounting device (10) according to claim 1, wherein the locating structure (12) is a recess and/or a groove. 3. Sensor mounting device (10) according to claim 1 or 2, comprising at least one first aligning structure (50). 4. Sensor mounting device (10) according to claim 3, wherein the at least one first aligning structure (50) is accommodated inside or next to the at least one locating structure (12). 5. Sensor mounting device (10) according to claim 3 or 4, wherein the at least one first aligning structure (50) comprises a slot (17). 6. Sensor mounting device (10) according to any of the preceding claims, wherein a magnetic core (13) is accommodated inside the at least one locating structure (12). P2023,0467 WO E / P220350WO01 June 28, 2023 - 20 - 7. Sensor mounting device (10) according to claim 6, wherein the magnetic core (13) surrounds the at least one first aligning structure (50). 8. Sensor mounting device (10) according to any of the preceding claims, wherein the magnetic core (13) comprises a gap (16) and wherein the at least one sensor location (14) is located in the gap (16). 9. Sensor mounting device (10) according to any of the preceding claims, wherein the device body (11) comprises an electrically isolating material, which comprises a transfer molding component and/or an injection molding component. 10. Sensor mounting device (10) according to any of the preceding claims, wherein the at least one sensor element (15) is a sensor for detection of electrical and/or electro- magnetic and/or magnetic parameters. 11. Sensor mounting device (10) according to any of the preceding claims, wherein the at least one sensor element (15) is a sensor for detection of electric current. 12. Sensor mounting device (10) according to any of the preceding claims, wherein the at least one sensor element (15) is a Hall sensor and/or a Rogowski coil and/or a fiber optic sensor. 13. Sensor mounting device (10) according to any of the preceding claims, comprising at least one third mounting structure (19), adapted for mounting the sensor mounting P2023,0467 WO E / P220350WO01 June 28, 2023 - 21 - device (10) to a corresponding at least one fourth mounting structure (41) of at least one another device. 14. Sensor mounting device (10) according to any of the preceding claims, wherein the at least one first, second, third and fourth mounting structure (18,35,19,41) comprise at least one of a clamp, a shoulder, a screw, a thread, glue or another adhesive. 15. Power semiconductor device (30) comprising - a third side surface (34), - at least one terminal (33), wherein the at least one terminal (33) is located at the third side surface (34), - at least one second mounting structure (35), adapted for mounting the power semiconductor device (30) to the corresponding at least one first mounting structure (18) of the sensor mounting device (10) according to any of the preceding claims. 16. Method for mounting the sensor mounting device (10) according to claim 1 to 14 to a power semiconductor device (30), comprising the steps of - providing the sensor mounting device (10), - providing the power semiconductor device (30), - mounting the sensor mounting device (10) to the power semiconductor device (30), wherein the at least first mounting structure (18) of the sensor mounting device (10) is fixed to the corresponding at least one second mounting structure (32) of the power semiconductor device (30). 17. Method according to claim 16, comprising the step of aligning the sensor mounting device (10) to the power semiconductor device (30), wherein the at least one sensor P2023,0467 WO E / P220350WO01 June 28, 2023 - 22 - location (14) is located next to a current carrying structure (90) of the power semiconductor device (30). 18. Method according to claim 16 or 17, wherein the aligning of the sensor mounting device (10) to the power semiconductor device (30) is supported by the current carrying structure (90) fitting to the at least one first aligning structure (50). 19. Method according to any of claim 16 to 18, comprising the step of mounting the sensor mounting device (10) to at least one another structure, wherein the at least one third mounting structure (19) of the sensor mounting device (10) is fixed to the corresponding at least one fourth mounting structure (41) of the at least one another device.

Description

P2023,0467 WO E / P220350WO01 June 28, 2023 - 1 - Description Sensor mounting device and method for mounting the sensor mounting device to a power semiconductor device The present disclosure relates to a sensor mounting device, a power semiconductor device and a method for mounting the sensor mounting device to the power semiconductor device. The supervision of power semiconductor modules for health monitoring, predictive maintenance, or improved reaction in a failure case is getting more and more important. So different physical parameters like chip temperature, input and output current, or applied voltage can be temporarily or regularly monitored during device operation. Especially the monitoring of the output current is an important feature for an improvement of the operation and control of power modules in an application, but also for an improved control of a short circuit failure mode. This monitoring is typically realized by a current sensor, which is located next to the output or AC terminal of a power module or next to the output bus bar in the application. Power modules with integrated current sensors, especially Hall sensors are a further option. It is an object to attach sensor elements to a power semiconductor device in a simple manner while still enable accurate measurements of the sensor elements. This object is solved by the features of the independent claims. Advantageous embodiments are indicated in the dependent claims. P2023,0467 WO E / P220350WO01 June 28, 2023 - 2 - Embodiments of the disclosure, for instance as claimed in the independent claims, address the above shortcomings in the art in whole or in part. Further embodiments of the power semiconductor device, the sensor mounting device and of the method for mounting the sensor mounting device to a power semiconductor device are subject matter of the further claims. There is provided, a sensor mounting device comprising a device body with a first side surface and an opposing second side surface, wherein at least one locating structure is located at the first side surface. The sensor mounting device further comprises at least one sensor location. At least one sensor element is accommodated inside the at least one sensor location. The sensor mounting device further comprises at least one first mounting structure, adapted for mounting the sensor mounting device to a corresponding at least one second mounting structure of a semiconductor power device. The sensor mounting device provides a simple structure with a sensor element, which is easy to retrofit to an existing power semiconductor device. This makes it easier to use sensor elements for power semiconductor devices. Thus, the setup and the assembly of power semiconductor devices, like power modules is simpler and less expensive. A further advantage is more flexibility for designing power semiconductor devices, like power modules. It is up to the customer to mount sensor elements to the power modules. A simple assembly is possible with the first mounting structures. The first mounting structure can be fixed permanently or just temporarily to the second mounting structure. Correspondingly, the sensor mounting device is P2023,0467 WO E / P220350WO01 June 28, 2023 - 3 - fixed permanently or just temporarily to the power semiconductor device. It is not necessary to build a product with an integrated sensor element on the power semiconductor device and a second product without a sensor element on the power semiconductor device. With a mountable sensor mounting device, parallel manufacturing of two product versions is omitted. This further safes production costs. Furthermore it is possible to use more than one sensor element to operate multiple power semiconductor devices with one common sensor mounting device. The locating structure is a recess and/or a groove, but can also be a notch, cut-out or a different deepening or a combination of these deepenings. Alternatively it is a hole, for example a punch-through or a through hole. The locating structure is for example c-shaped, but can have any suitable geometrical shape, like a circular, oval, triangular, squared, rectangular or other polygonal shape. The shape depends on the shape of the sensor element or parts of the sensor element to be located. The sensor mounting device further comprises at least one first aligning structure. The first aligning structure facilitates the aligning of the sensor mounting device with corresponding or fitting structures of the power semiconductor device. The first aligning structure can be for example located inside the locating structure or next to the locating structure. Thus, already existing structures of the power semiconductor device can be used as a further aligning structure for an improved mounting. Since the sensor element in the locating structure is located in a defined position P2023,0467 WO E / P220350WO01 June 28, 2023 - 4 - due to the first aligning structure, more accurate measurement