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EP-4736200-A1 - INTEGRATED INDUCTOR INCLUDING MAGNETIC LAYER

EP4736200A1EP 4736200 A1EP4736200 A1EP 4736200A1EP-4736200-A1

Abstract

An inductive device includes a first set of conductive lines, a second set of conductive lines, and conductive pillars connecting the first set of conductive lines to the second set of conductive lines to form an integrated inductor. The inductive device also includes one or more magnetic layers extending along a length of the integrated inductor and within an aperture of the integrated inductor.

Inventors

  • CHIU, JUI-YI
  • LIU, KAI
  • KIM, JONGHAE

Assignees

  • QUALCOMM INCORPORATED

Dates

Publication Date
20260506
Application Date
20240521

Claims (20)

  1. 1. An inductive device comprising: a first set of conductive lines; a second set of conductive lines; conductive pillars connecting the first set of conductive lines to the second set of conductive lines to form an integrated inductor; and one or more magnetic layers extending along a length of the integrated inductor and within an aperture of the integrated inductor.
  2. 2. The inductive device of claim 1, wherein the integrated inductor is within or on a package substrate.
  3. 3. The inductive device of claim 1, wherein the one or more magnetic layers include one or more of CoZrTa, CoZrTaB, or FeCoB.
  4. 4. The inductive device of claim 1, wherein the first set of conductive lines is above a wafer surface, wherein a magnetic layer of the one or more magnetic layers is above the first set of conductive lines and below the second set of conductive lines, and further comprising a mold compound between the first set of conductive lines and the second set of conductive lines.
  5. 5. The inductive device of claim 4, wherein the mold compound includes an epoxy material.
  6. 6. The inductive device of claim 4, further comprising an insulation layer between the magnetic layer and the first set of conductive lines or the second set of conductive lines.
  7. 7. The inductive device of claim 6, wherein the insulation layer includes a polyimide material.
  8. 8. The inductive device of claim 6, wherein the insulation layer is between the magnetic layer and the first set of conductive lines, and wherein the magnetic layer is below the mold compound.
  9. 9. The inductive device of claim 6, wherein the insulation layer is between the magnetic layer and the second set of conductive lines, and wherein the magnetic layer is above the mold compound.
  10. 10. The inductive device of claim 1, wherein the one or more magnetic layers includes two magnetic layers within the aperture.
  11. 11. The inductive device of claim 1, wherein the one or more magnetic layers includes three magnetic layers within the aperture.
  12. 12. The inductive device of claim 1, wherein the first set of conductive lines are in a first redistribution layer, and wherein the second set of conductive lines are in a second redistribution layer.
  13. 13. The inductive device of claim 1, wherein the integrated inductor is formed on a surface of a power management integrated circuit (PMIC), and wherein an input of the integrated inductor is coupled to circuitry of the PMIC.
  14. 14. The inductive device of claim 1, wherein at least one of an input of the integrated inductor and an output of the integrated inductor is coupled to a solder ball.
  15. 15. A device comprising: an integrated device comprising: a first set of conductive lines; a second set of conductive lines; conductive pillars connecting the first set of conductive lines to the second set of conductive lines to form an integrated inductor; and one or more magnetic layers extending along a length of the integrated inductor and within an aperture of the integrated inductor.
  16. 16. The device of claim 15, further comprising a package substrate, and wherein the integrated inductor is within or on the package substrate.
  17. 17. The device of claim 15, wherein the one or more magnetic layers include one or more of CoZrTa, CoZrTaB, or FeCoB.
  18. 18. The device of claim 15, wherein the first set of conductive lines is above a wafer surface, wherein a magnetic layer of the one or more magnetic layers is above the first set of conductive lines and below the second set of conductive lines, and further comprising a mold compound between the first set of conductive lines and the second set of conductive lines.
  19. 19. The device of claim 15, wherein the one or more magnetic layers includes one magnetic layer within the aperture.
  20. 20. The device of claim 15, wherein the one or more magnetic layers includes multiple magnetic layers within the aperture.

Description

INTEGRATED INDUCTOR INCLUDING MAGNETIC LAYER Cross-Reference to Related Applications [0001] The present application claims the benefit of priority from the commonly owned U.S. Non-Provisional Patent Application No. 18/343,595, filed June 28, 2023, the contents of which are expressly incorporated herein by reference in their entirety. Field [0002] Various features relate to inductive devices. Background [0003] Integrated circuit (IC) technology has achieved great strides in advancing computing power through miniaturization of active components. Integrated passive components have also been miniaturized, and the trend for further miniaturization of such components continues. Passive inductive elements are often some of the larger elements in a circuit in part because characteristic electrical properties of an inductive element are related to physical dimensions of the inductive element. For example, inductance of the inductive element is related to an aperture of a coil of the inductive element, and current carrying capacity of the inductive element is related to dimensions of conductive elements of the coil. Due to these and other factors, there is a need for high current, high inductance inductive devices that have a small form factor. SUMMARY [0004] Various features relate to integrated circuit devices. [0005] One example provides an inductive device that includes a first set of conductive lines and a second set of conductive lines. The inductive device includes conductive pillars connecting the first set of conductive lines to the second set of conductive lines to form an integrated inductor. The inductive device also includes one or more magnetic layers extending along a length of the integrated inductor and within an aperture of the integrated inductor. [0006] Another example provides a device that includes an integrated device. The integrated device includes a first set of conductive lines and a second set of conductive lines. The integrated device includes conductive pillars connecting the first set of conductive lines to the second set of conductive lines to form an integrated inductor. The integrated device also includes one or more magnetic layers extending along a length of the integrated inductor and within an aperture of the integrated inductor. [0007] Another example provides a method for fabricating an inductive device. The method includes forming a first set of conductive lines. The method includes forming one or more magnetic layers above the first set of conductive lines. The method includes forming conductive pillars connected to the first set of conductive lines. The method also includes forming a second set of conductive lines above the one or more magnetic layers and connected to the conductive pillars to form an integrated inductor. The one or more magnetic layers extend along a length of the integrated inductor and within an aperture of the integrated inductor. BRIEF DESCRIPTION OF THE DRAWINGS [0008] Various features, nature and advantages may become apparent from the detailed description set forth below when taken in conjunction with the drawings in which like reference characters identify correspondingly throughout. [0009] FIG. 1 illustrates a schematic cross sectional profile view of a device that includes an exemplary integrated inductor including multiple magnetic layers. [0010] FIG. 2 illustrates a schematic cross sectional profile view of a device that includes an exemplary integrated inductor including a magnetic layer. [0011] FIG. 3 illustrates a schematic cross sectional profile view of a device that includes an exemplary integrated inductor including a magnetic layer. [0012] FIG. 4 illustrates a schematic cross sectional profile view of a device that includes an exemplary integrated inductor including multiple magnetic layers. [0013] FIG. 5 illustrates a schematic cross sectional profile view of a device that includes an exemplary integrated inductor including multiple magnetic layers. [0014] FIG. 6A illustrates a schematic top view of a device that includes an exemplary integrated inductor including multiple magnetic layers. [0015] FIG. 6B illustrates a schematic perspective view of the device of FIG. 6 A. [0016] FIG. 6C illustrates a schematic cross sectional profile view of a portion of the device of FIG. 6 A. [0017] FIGS. 7A, 7B, and 7C illustrate an exemplary sequence for fabricating an exemplary integrated inductor that includes multiple magnetic layers. [0018] FIG. 8 illustrates an exemplary flow diagram of a method for fabricating an exemplary integrated inductor that includes a magnetic layer. [0019] FIG. 9 illustrates various electronic devices that may integrate a die, an electronic circuit, an integrated device, an integrated passive device (IPD), a passive component, a package, and/or a device package described herein. DETAILED DESCRIPTION [0020] In the following description, specific details are given to provide a thorough understanding of the various aspe