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EP-4736213-A1 - ENDPOINT DETECTION SYSTEM AND METHODS OF USING THE SAME

EP4736213A1EP 4736213 A1EP4736213 A1EP 4736213A1EP-4736213-A1

Abstract

A system includes a byproduct analysis processor for use with a byproduct detector in fluid communication with a foreline of a processing chamber having a plasma source configured to generate a reactive species adapted to clean an interior of the processing chamber during a chamber cleaning process. The processor can obtain detection data representing a cleaning byproduct concentration exhausted from an interior of the processing chamber and determine an endpoint of the chamber cleaning process based and/or determine a fault condition associated with the processing chamber based on the detection data.

Inventors

  • YE, HONGKE
  • BOSCO, ROBERTO

Assignees

  • MKS Instruments, Inc.

Dates

Publication Date
20260506
Application Date
20240607

Claims (17)

  1. 1. A system, comprising: a byproduct analysis processor for use with a byproduct detector in fluid communication with a foreline of a processing chamber having a plasma source configured to generate a reactive species adapted to clean an interior of the processing chamber during a chamber cleaning process, the processor being configured to: obtain detection data representing a cleaning byproduct concentration exhausted from an interior of the processing chamber; and determine an endpoint of the chamber cleaning process based, at least in part, on at least one selected from the group of: a time-derivative of the obtained detection data and a time-integral of the obtained detection data.
  2. 2. The system of claim 1, wherein the processor is further configured to process the obtained detection data to determine the at least one selected from the group of: the time- derivative of the obtained detection data and the time-integral of the obtained detection data.
  3. 3. The system of claim 1, wherein the processor is configured to determine the endpoint of the chamber cleaning process based, at least in part, on the time-derivative of the obtained detection data.
  4. 4. The system of claim 1, wherein the processor is configured to determine the endpoint of the chamber cleaning process based, at least in part, on the time-integral of the obtained detection data.
  5. 5. The system of claim 4, wherein the processor is configured to determine the endpoint of the chamber cleaning process when the time-derivative of the obtained detection data is within a predetermined range for a predetermined period of time.
  6. 6. The system of claim 1, wherein the processor is configured to determine the endpoint of the chamber cleaning process based, at least in part, on the time-integral of the obtained detection data.
  7. 7. The system of claim 6, wherein the processor is configured to determine the endpoint of the chamber cleaning process when the time-integral of the obtained detection data at least substantially constant for a predetermined period of time.
  8. 8. The system of claim 1, further comprising the byproduct detector.
  9. 9. The system of claim 8, wherein the byproduct detector is a non-dispersive infra-red (NDIR) detector.
  10. 10. A system, comprising: a byproduct analysis processor for use with a byproduct detector in fluid communication with a foreline of a processing chamber having a plasma source configured to generate a reactive species adapted to clean an interior of the processing chamber during a chamber cleaning process, the processor being configured to: obtain detection data representing a cleaning byproduct concentration exhausted from an interior of the processing chamber; compare the detection data with reference data associated with the chamber cleaning process; and output a signal when a result of the comparison indicates a predetermined relationship between the detection data and the reference data.
  11. 11. The system of claim 10, wherein the detection data includes at least one selected from the group consisting of: raw detection data output by the byproduct detector, a time-derivative of the raw detection data and a time-integral of the raw detection data.
  12. 12. The system of claim 10, wherein the detection data has the predetermined relationship with the reference data when a statistic associated with the detection data is outside a predetermined tolerance range.
  13. 13. The system of claim 12, wherein the processor is configured to output a warning signal indicating that a process performed within the processing chamber before the chamber cleaning process was or may have been improperly performed.
  14. 14. The system of claim 10, wherein the detection data has the predetermined relationship with the reference data when a statistic associated with the detection data is outside a predetermined fault level.
  15. 15. The system of claim 14, wherein the processor is configured to output an interrupt signal indicating that processes performed by the processing chamber should be terminated.
  16. 16. The system of claim 10, further comprising the byproduct detector.
  17. 17. The system of claim 16, wherein the byproduct detector is a non-dispersive infra-red (NDIR) detector.

Description

ENDPOINT DETECTION SYSTEM AND METHODS OF USING THE SAME BACKGROUND L _ Technical Field [0001] Embodiments of the present disclosure generally relate to endpoint detection systems and methods of using the same and, more particularly, to endpoint detection systems and methods for determining processing chamber cleaning endpoints and providing process chamber diagnostics using endpoint detection systems. II. Background [0002] Modem semiconductor processing techniques, such as those used in manufacturing semiconductor devices, solar panels, display devices, etc., are typically performed as batch processes involving many deposition and etching steps performed within one or more chambers for maintaining a controlled environment. If one step is performed out of specification, the entire batch of semiconductor devices can contain significant defects. When a batch is defective, it can be extremely difficult to identify the root cause of the failure. Although many components of a semiconductor processing chamber have self-diagnostic functions, adequate process-level fault detection or diagnostic tools are not known to exist. SUMMARY [0003] One embodiment can be broadly characterized as a system that includes a byproduct analysis processor for use with a byproduct detector in fluid communication with a foreline of a processing chamber having a plasma source configured to generate a reactive species adapted to clean an interior of the processing chamber during a chamber cleaning process. The processor can be configured to obtain detection data representing a cleaning byproduct concentration exhausted from an interior of the processing chamber and determine an endpoint of the chamber cleaning process based, at least in part, on one or more of: a time-derivative of the obtained detection data and a time-integral of the obtained detection data. [0004] Another embodiment can be broadly characterized as a system that includes a byproduct analysis processor for use with a byproduct detector in fluid communication with a foreline of a processing chamber having a plasma source configured to generate a reactive species adapted to clean an interior of the processing chamber during a chamber cleaning process. The process can be configured to obtain detection data representing a cleaning byproduct concentration exhausted from an interior of the processing chamber, compare the detection data with reference data associated with the chamber cleaning process and output a signal when a result of the comparison indicates a predetermined relationship between the detection data and the reference data. BRIEF DESCRIPTION OF THE DRAWINGS [0005] FIG. 1 illustrates semiconductor processing system according to some embodiments of the present invention. [0006] FIG. 2 is a flow chart illustrating how an active endpoint detection process may be used to facilitate a chamber cleaning process, according to one embodiment. [0007] FIG. 3 graphically illustrates a representation of raw detection data that may be recorded in association with the timing data. [0008] FIG. 4 graphically illustrates a representation of derivative detection data that may be recorded in association with the timing data. [0009] FIG. 5 graphically illustrates a representation of integral detection data that may be recorded in association with the timing data. [0010] FIG. 6 is a flow chart illustrating a fault detection process, according to one embodiment, that may be executed by the byproduct analysis processor and/or system host shown in FIG. 1. [0011] FIGS. 7 and 8 are graphs illustrating an example of measured and reference cleaning traces corresponding to raw detection data and integral detection data, respectively, associated with the same chamber cleaning process. [0012] FIGS. 9 and 10 are graphs illustrating another example of measured and reference cleaning traces corresponding to raw detection data and integral detection data, respectively, associated with the same chamber cleaning process. DETAILED DESCRIPTION [0013] Example embodiments are described herein with reference to the accompanying FIGS. Unless otherwise expressly stated, in the drawings the sizes, positions, etc., of components, features, elements, etc., as well as any distances therebetween, are not necessarily to scale, but are exaggerated for clarity. [0014] The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting. As used herein, the singular forms “a,” “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should be recognized that the terms “comprises” and/or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. Unless otherwi