EP-4736230-A1 - CHIPLET-TO-CHIPLET PROTOCOL SWITCH

Abstract

A bonded structure is disclosed. The bonded structure can include a carrier. The bonded structure can include a first die having a first communications circuitry to format a communication signal according to a first communication protocol and to transmit the communication signal. The bonded structure can also include a protocol switch die having circuitry to receive the communications signal and to convert the communication signal from the first communication protocol to a second communication protocol, wherein the second communication protocol is different from the first communication protocol. The protocol switch die can transmit the communication signal according to the second communication protocol. The bonded structure can also include a second die having a second communications circuitry to receive the communication signal formatted in the second communication protocol.

Inventors

• HABA, BELGACEM
• KATKAR, RAJESH
• NURUZZAMAN, Abul

Assignees

• Adeia Semiconductor Bonding Technologies Inc.

Dates

Publication Date

20260506

Application Date

20240624

Claims (20)

1. 1. A bonded structure comprising: a carrier; a first die comprising a first communications circuitry to format a communication signal according to a first communication protocol and to transmit the communication signal, the first die directly bonded to the carrier without an intervening adhesive; a protocol switch die directly bonded to the carrier without an intervening adhesive, the protocol switch die comprising circuitry to receive the communication signal and to convert the communication signal from the first communication protocol to a second communication protocol, wherein the second communication protocol is different from the first communication protocol, wherein the protocol switch die transmits the communication signal according to the second communication protocol; and a second die comprising a second communications circuitry to receive the communication signal formatted in the second communication protocol, the second die directly bonded to the carrier without an intervening adhesive.
2. 2. The bonded structure of Claim 1, wherein the protocol switch die further converts the second communication protocol to the first communication protocol.
3. 3. The bonded structure of any one of Claims 1 to 2, wherein the first communications circuitry receives the communication signal from the protocol switch die.
4. 4. The bonded structure of any one of Claims 1 to 3, wherein the second communications circuitry transmits the communication signal.
5. 5. The bonded structure of any one of Claims 1 to 4, wherein the protocol switch die further comprises processing circuitry to convert between communication protocols.
6. 6. The bonded structure of Claim 5, wherein the processing circuitry further converts the first communication protocol to the second communication protocol.
7. 7. The bonded structure of any one of Claims 5 to 6, wherein the processing circuitry further converts the first communication protocol to a plurality of communication protocols.
8. 8. The bonded structure of Claim 7, wherein the processing circuitry further converts the plurality of communication protocols to the first communication protocol.
9. 9. The bonded structure of any one of Claims 7 to 8, wherein the processing circuitry further converts the plurality of communication protocols to a second plurality of communication protocols.
10. 10. The bonded structure of any one of Claims 1 to 9, wherein at least 90% of the circuitry is configured to convert between communication protocols.
11. 11. The bonded structure of any one of Claims 1 to 10, wherein the protocol switch die comprises additional active circuitry configured for other processing functionalities.
12. 12. The bonded structure of any one of Claims 1 to 11, wherein the protocol switch die further comprises a memory to store various communication protocols.
13. 13. The bonded structure of any one of Claims 1 to 12, wherein a format of the first communication protocol and a format of the second communication protocol is based on at least one of architecture, data rate, number of input/output interconnects, voltages, clock speed, power, latency, bit error rate, or channel loss.
14. 14. The bonded structure of Claim 13, wherein the architecture comprises a serial architecture or a parallel architecture.
15. 15. The bonded structure of any one of Claims 13 to 14, wherein the protocol switch die detects the format of the first communication protocol and the format of the second communication protocol.
16. 16. The bonded structure of Claim 15, wherein the protocol switch die detects the format of the first communication protocol and the format of the second communication protocol during an initial powering on state.
17. 17. The bonded structure of any one of Claims 1 to 16, wherein the carrier comprises a semiconductor element or an interposer die.
18. 18. The bonded structure of any one of Claims 1 to 17, wherein a first nonconductive bonding layer of the carrier is directly bonded to a second nonconductive layer of the first die without an intervening adhesive, and wherein a first contact feature of the carrier is directly bonded to a second contact feature of the first die without an intervening adhesive.
19. 19. The bonded structure of Claim 18, wherein the first nonconductive bonding layer of the carrier is directly bonded to a third nonconductive layer of the second die without an intervening adhesive; and wherein the first contact feature of the carrier is directly bonded to a third contact feature of the second die without the intervening adhesive.
20. 20. The bonded structure of any one of Claims 18 to 19, wherein the first nonconductive bonding layer of the carrier is directly bonded to a fourth nonconductive layer of the protocol switch die without an intervening adhesive; and wherein the first contact feature of the carrier is directly bonded to a fourth contact feature of the protocol switch die without an intervening adhesive.

Description

CHIPLET-TO-CHIPLET PROTOCOL SWITCH BACKGROUND Field [0001] The field relates to a bonded structure with a chiplet-to-chiplet protocol switch die. Description of the Related Art [0002] Semiconductor devices, in particular system on chip (SoC) devices, have increased in complexity while also decreased in size and dimension. As semiconductor devices become more complex, the importance of chiplet-to-chiplet communication of these devices has increased. SUMMARY [0003] For purposes of summarizing the disclosure and the advantages achieved over the prior art, certain objects and advantages of the disclosure are described herein. Not all such objects or advantages may be achieved in any particular embodiment. Thus, for example, those skilled in the art will recognize that the invention may be embodied or carried out in a manner that achieves or optimizes one advantage or group of advantages as taught herein without necessarily achieving other objects or advantages as may be taught or suggested herein. [0004] All of these implementations are intended to be within the scope of the invention herein disclosed. These and other implementations will become readily apparent to those skilled in the ail from the following detailed description of the preferred implementations having reference to the attached figures, the invention not being limited to any particular preferred implementations disclosed. [0005] In one implementations, a bonded structure can include: a carrier; a first die comprising a first communications circuitry to format a communication signal according to a first communication protocol and to transmit the communication signal, the first die directly bonded to the carrier without an intervening adhesive; a protocol switch die directly bonded to the carrier without an intervening adhesive, the protocol switch die comprising circuitry to receive the communications signal and to convert the communication signal from the first communication protocol to a second communication protocol, wherein the second communication protocol is different from the first communication protocol, wherein the protocol switch die transmits the communication signal according to the second communication protocol; and a second die comprising a second communications circuitry to receive the communication signal formatted in the second communication protocol, the second die directly bonded to the carrier without an intervening adhesive. [0006] In some implementations, the protocol switch die converts the second communication protocol to the first communication protocol. In some implementations, the first communication circuitry receives the communication signal from the protocol switch die. In some implementations, the second communication circuitry transmits the communication signal. In some implementations, the protocol switch die includes processing circuitry to convert the first communication protocol to the second communication protocol. In some implementations, the processing circuitry converts the first communication protocol to a plurality of communication protocols. In some implementations, the processing circuitry converts the plurality of communication protocols to the first communication protocol. In some implementations, the processing circuitry converts the plurality of communication protocols to a second plurality of communication protocols. In some implementations, at least 90% of the circuitry is configured to convert between the communication protocols. In some implementations, the protocol switch die includes additional active circuitry configured for other processing functionalities. [0007] In some implementations, the protocol switch die includes a memory to store various communication protocols. In some implementations, a format of the first communication protocol and a format of the second communication protocol is based on at least one of architecture, data rate, number of input/output interconnects, voltages, clock speed, power, latency, bit error rate, or channel loss. In some implementations, the architecture includes a serial architecture or a parallel architecture. In some implementations, the protocol switch die detects the format of the first communication signal and the format of the second communication signal. In some implementations, the protocol switch die detects the format of the first communication protocol and the format of the second communication protocol during an initial powering on state. [0008] In some implementations, the carrier includes a semiconductor element or an intcrposcr die. In some implementations, a first nonconductivc bonding layer of the carrier is directly bonded to a second nonconductivc layer of the first die without an intervening adhesive, and wherein a first contact feature of the carrier is directly bonded to a second contact feature of the first die without an intervening adhesive. [0009] In some implementations, the first nonconductivc bonding layer of the carrier