EP-4736242-A1 - DIRECTLY BONDED OPTICAL COMPONENTS

Abstract

An optical component can comprise a first optical element and a second optical element disposed over the first optical element. A first optical channel through at least a portion of the first optical element can extend between a first port at a first side of the optical component and a second port at a second side of the optical component. A second optical channel through at least a portion of the second optical element can extend between a third port at the first side of the optical component and a fourth port. The first and third ports are spaced apart by a first distance along the first side, and the second and fourth ports are spaced apart by a second distance along an exterior surface of the optical component. The first distance is different from the second distance.

Inventors

• HABA, BELGACEM
• KATKAR, RAJESH
• HOSSEIN-ZADEH, MANI

Assignees

• Adeia Semiconductor Bonding Technologies Inc.

Dates

Publication Date

20260506

Application Date

20240626

Claims (20)

1. 1. An optical component comprising: a first optical element; a second optical element disposed over the first optical element; a first optical channel through at least a portion of the first optical element, the first optical channel extending between a first port at a first side of the optical component and a second port at a second side of the optical component; and a second optical channel through at least a portion of the second optical element, the second optical channel extending between a third port at the first side of the optical component and a fourth port, wherein the first and third ports arc spaced apart by a first distance along the first side, and the second and fourth ports are spaced apart by a second distance along an exterior surface of the optical component, the first distance different from the second distance.
2. 2. The optical component of claim 1, wherein the second optical element is directly bonded to the first optical element without an intervening adhesive.
3. 3. The optical component of claim 1, wherein the fourth port is disposed at the second side of the optical component.
4. 4. The optical component of claim 3, wherein the second side is parallel to or at an angle to the first side of the optical component.
5. 5. The optical component of claim 1, wherein the fourth port is disposed at a third side of the optical component different from the second side.
6. 6. The optical component of claim 1, wherein the first optical channel is a waveguide.
7. 7. The optical component of claim 1, wherein the first distance is less than the second distance.
8. 8. The optical component of claim 1, further comprising at least a first optical grating disposed in the first optical channel.
9. 9. The optical component of claim 1, wherein the first optical channel extending from the first port further comprises at least one optical power divider, the at least one optical power divider further comprising a Y-junction and a first and a second branching optical channel.
10. 10. The optical component of claim 1, wherein the first optical channel comprises a first waveguide portion and the second optical channel comprises a second waveguide portion, and the first and the second waveguide portions are optically coupled to form a directional coupler.
11. 11. The optical component of claim 1, further comprising: a third optical channel through at least a portion of the first optical element, the third optical channel extending between a fifth port at the first side of the optical component and a sixth port at the second side of the optical component; and a fourth optical channel through at least a portion of the second optical element, the fourth optical channel extending between a seventh port at the first side of the optical component and an eighth port at the second side of the optical component, wherein the fifth and seventh ports are spaced apart by a third distance, and the sixth and eighth ports are spaced apart by a fourth distance, the third distance different from the fourth distance.
12. 12. The optical component of claim 11, further comprising a first optical device directly bonded to the first and second optical channels and a second optical device directly bonded to the third and fourth optical channels.
13. 13. The optical component of claim 12, wherein the first optical device is an emitter and the second optical device is a receiver.
14. 14. The optical component of claim 13, wherein the emitter is a vertical-cavity surface-emitting laser, a photonic crystal surface-emitting laser, an edge-emitting laser, or a low-power LED.
15. 15. The optical component of claim 13, wherein the receiver is a photodiode or a complementary metal-oxide semiconductor sensor.
16. 16. The optical component of claim 12, wherein the first optical device and the second optical device are directly bonded to a first die.
17. 17. The optical component of claim 16, wherein the first die controls the operation of at least one of the first or the second optical devices.
18. 18. The optical component of claim 16, wherein the optical component bridges the first die and a second die.
19. 19. The optical component of claim 12, wherein the first optical device and the second optical device are thermocompression bonded to a first die.
20. 20. The optical component of claim 12, wherein the first optical device is directly bonded to a first die, and the second optical device is directly bonded to a second die.

Description

DIRECTLY BONDED OPTICAL COMPONENTS CROSS-REFERENCE TO RELATED APPLICATIONS [0001] This application claims priority to U.S. Application No. 18/745266, filed June 17, 2024, titled “DIRECTLY BONDED OPTICAL COMPONENTS,” and U.S. Provisional Application No. 63/511388, filed June 30, 2023, titled “DIRECTLY BONDED OPTICAL COMPONENTS,” the disclosures of which are incorporated herein by reference in their entirety for all purposes. BACKGROUND Field [0002] The field relates to directly bonded optical components and optical communication devices. Description of the Related Art [0003] Optical interconnects may be provided between semiconductor device dies or chips, such as graphics processing units (GPUs), Application Specific Integrated Circuits (ASIC), memory chips, etc. which can be provided within products like transceivers, switches, etc. for networking, datacenter, and other applications. The optical interconnects facilitate optical communication between the semiconductor device dies or electrical and optical components in general. Additionally, optical channels (such as optical waveguides) may be layered within a medium, or three-dimensional (3D) optical waveguides may be formed within a medium, like glass along with traditional packaging substrates (e.g., printed circuit board (PCB)). Optical signals or electromagnetic radiation can be transferred through the optical channels. However, it can be challenging to efficiently manufacture optical components that provide communication between semiconductor dies. Accordingly, there remains a continuing need for improved optical components. SUMMARY [0004] In one aspect, an optical component includes: a first optical element; a second optical element disposed over the first optical element; a first optical channel through at least a portion of the first optical element, the first optical channel extending between a first port at a first side of the optical component and a second port at a second side of the optical component; and a second optical channel through at least a portion of the second optical element, the second optical channel extending between a third port at the first side of the optical component and a fourth port, wherein the first and third ports arc spaced apart by a first distance along the first side, and wherein the second and fourth ports are spaced apart by a second distance along an exterior surface of the optical component, the first distance different from the second distance. [0005] In some embodiments, the second optical element is directly bonded to the first optical element without an intervening adhesive. In some embodiments, the fourth port is disposed at the second side of the optical component. In some embodiments, the second side is parallel to or at an angle to the first side of the optical component. In some embodiments, the fourth port is disposed at a third side of the optical component different from the second side. In some embodiments, the first optical channel is a waveguide. In some embodiments, the first distance is less than the second distance. In some embodiments, the optical component can include: a third optical channel through at least a portion of the first optical element, the third optical channel extending between a fifth port at the first side of the optical component and a sixth port at the second side of the optical component; and a fourth optical channel through at least a portion of the second optical element, the fourth optical channel extending between a seventh port at the first side of the optical component and an eighth port at the second side of the optical component, wherein the fifth and seventh ports are spaced apart by a third distance, and wherein the sixth and eighth ports are spaced apart by a fourth distance, the third distance different from the fourth distance. In some embodiments, the optical component can include a first optical device directly bonded to the first and second optical channels and a second optical device directly bonded to the third and fourth optical channels. In some embodiments, the first optical device is an emitter, and the second optical device is a receiver. In some embodiments, the emitter is a vertical-cavity surface-emitting laser, a photonic crystal surface-emitting laser, an edge-emitting laser, or a low-power LED. In some embodiments, the receiver is a photodiode or a complementary metal-oxide semiconductor sensor. In some embodiments, the first optical device and the second optical device are directly bonded to a first die. In some embodiments, the first die controls the operation of at least one of the first or the second optical devices. In some embodiments, the first optical device and the second optical device are thermocompression bonded to a first die. In some embodiments, the optical component can include an adapter assembly configured to couple an optical fiber to at least the second port. In some embodiments, the optical component can include at least