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EP-4736651-A1 - METHOD FOR MAKING A PLURALITY OF WAFER BODIES

EP4736651A1EP 4736651 A1EP4736651 A1EP 4736651A1EP-4736651-A1

Abstract

A method for making a plurality of wafer bodies (400) is described, wherein two wafer sheets (100, 200) are mutually coupled so that respective parts (102, 202) are united together to form the wafer bodies (400), and wherein, subsequently, the united parts (102, 202) are separated from the mutually coupled wafer sheets (100, 200) . The method is characterized in that it involves the use of wafer sheets (100, 200) provided with coupling formations (105, 205) with the function of guaranteeing a correct mutual positioning of the wafer sheets (100, 200) .

Inventors

  • TAVELLA, ANDREA
  • RUBINETTO, Paolo
  • CANTAMESSA, Franco

Assignees

  • Soremartec S.A.

Dates

Publication Date
20260506
Application Date
20251015

Claims (19)

  1. Method for making a plurality of wafer bodies (400), each comprising a first part (102) and a second part (202) mutually coupled to each other and an internal space (402) delimited by said first and second part; said method comprising the steps of: - making a first wafer sheet (100) comprising a plurality of first parts (102), via a wafer batter that is baked inside a first mold device; - making a second wafer sheet (200) comprising a plurality of second parts (202), via a wafer batter that is baked inside a second mold device; - coupling together said first wafer sheet (100) and said second wafer sheet (200) so that each of said first parts (102) of said first sheet is coupled with a respective second part (202) of said second parts of said second sheet; - separating said first parts (102) and said second parts (202) mutually coupled from said first and second wafer sheets, so as to obtain said plurality of wafer bodies (400); said method being characterized in that - making said first wafer sheet (100) includes making, on said first wafer sheet, first coupling formations (105); - making said second wafer sheet (200) includes making, on said second wafer sheet (200), second coupling formations (205), and - coupling together said first wafer sheet (100) and said second wafer sheet (200) includes arranging said first and second wafer sheets in a predefined mutual positioning through the coupling of said first coupling formations (105) with said second coupling formations (205).
  2. Method according to claim 1, wherein coupling together said first wafer sheet (100) and said second wafer sheet (200) includes bringing said first wafer sheet (100) closer to said second wafer sheet (200), according to an approach movement (K) along a direction transverse to the planes of said first and second wafer sheets (100, 200), wherein said first coupling formations (105) comprise first guide surfaces (105A), and said second coupling formations (205) comprise second guide surfaces (205A), wherein said first guide surfaces (105A) and said second guide surfaces (205A) cooperate with each other to perform a positioning action of said first wafer sheet (100) and of said second wafer sheet (200), such that one of said first and second wafer sheets (100, 200) is moved relative to the other wafer sheet in a plane parallel to the plane of said sheets, by effect of said approach movement, so as to arrange said first and second wafer sheets (100, 200) in said predefined mutual positioning.
  3. Method according to claim 2, wherein said first guide surfaces (105A) and said second guide surfaces (205A) are configured to perform a centering action such that respective reference axes (I1) of the first coupling formations (105A) are aligned with respective reference axes (I2) of the second coupling formations (205A), by effect of said approach movement (K).
  4. Method according to claim 2 or 3, wherein each first coupling formation (105) of said first wafer sheet (100) comprises at least one pair of first guide surfaces (105A) that are inclined so as to be convergent or divergent in the direction towards a respective second coupling formation of said second wafer sheet (200), and are symmetrical with respect to a reference axis (I1) of said first formation (105), and wherein the respective second formation (205) comprises at least one pair of second guide surfaces (205A) that are inclined so as to be divergent or convergent in the direction towards said first formation (105), and are symmetrical with respect to a reference axis (I2) of said second formation (205).
  5. Method according to claim 2 or 3, wherein said first guide surfaces (105A) are conical surfaces that develop around the reference axes (I1) of the first coupling formations (105), and with respect to which the reference axes (I1) of the first formations constitute respective geometric axes, and wherein said second guide surfaces (105A) are conical surfaces that develop around the reference axes (I2) of the second coupling formations (205), and with respect to which the reference axes (I2) of the second formations constitute respective geometric axes.
  6. Method according to any one of claims 2 to 5, wherein said first guide surfaces (105A) and said second guide surfaces (205A) are configured to realize a form coupling between said first coupling formations (105) and said second coupling formations (205), once said first and second wafer sheets (100, 200) are in said predefined mutual positioning, so as to constrain said first and second wafer sheets in said predefined positioning preventing any relative movement thereof in a plane parallel to the plane of said first or second wafer sheet.
  7. Method according to any one of the preceding claims, wherein coupling together said first wafer sheet (100) and said second wafer sheet (200) includes, after said first and second wafer sheets (100, 200) have been arranged in said predefined mutual positioning, realizing a form coupling between said first coupling formations (105) and said second coupling formations (205), such that any relative movement of said first and second wafer sheets (100, 200) in a plane parallel to the planes of said first and second wafer sheets (100, 200) is prevented.
  8. Method according to any one of the preceding claims, wherein said first wafer sheet (100) comprises a first side that is facing said second wafer sheet (200) in said phase of coupling of said first and second sheets, and a second side opposite to said first side, and wherein said second wafer sheet (200) comprises a first side that is facing said first wafer sheet (100) in said phase of coupling of said first and second wafer sheets, and a second side opposite to said first side, wherein said first coupling formations are formed by protrusions (105) that protrude from said first side of said first wafer sheet (100) in a direction towards said first side of said second wafer sheet (200), and wherein said second coupling formations are formed by cavities (205) that are facing towards said first side of said first wafer sheet (100) and receive said protrusions (105) of said first wafer sheet (100), in said phase of coupling of said first and second wafer sheets (100, 200).
  9. Method according to claim 8, wherein said protrusions (105) protrude from said first side of said first wafer sheet (100) for a length such that said protrusions (105) engage said cavities (205), before said first side of said first wafer sheet (100) is brought into contact with said first side of said second wafer sheet (200) or in any case before said first wafer sheet (100) and said second wafer sheet (200) reach said predefined mutual positioning.
  10. Method according to any one of the preceding claims, wherein - said first wafer sheet (100) comprises flat portions (104) collectively defining a general plane of the sheet, which connect said first parts (102) together, and said first coupling formations (105) to said first parts (102), - said second wafer sheet (200) comprises flat portions (204) collectively defining a general plane of the sheet, which connect said second parts (202) together, and said second coupling formations (205) to said second parts (202).
  11. Method according to any one of the preceding claims, wherein said first parts (102) and/or said second parts (202) each have a hollow conformation, and wherein said first parts (102) comprise first peripheral edges (102A), and said second parts (202) comprise second peripheral edges (202A), wherein said first peripheral edges (102A) of said first parts (100) are intended to mate with said second peripheral edges (202A) of said second parts (200) in said predefined mutual positioning of said first and second wafer sheets (100, 200).
  12. Method according to any one of the preceding claims, wherein said first coupling formations (105) are placed along a peripheral area (100C) of said first wafer sheet (100) that surrounds an internal area of said first wafer sheet (100) in which said first parts (102) are made, and wherein said second coupling formations (205) are placed along a peripheral area (200C) of said second wafer sheet (200) that surrounds an internal area of said second wafer sheet (200) in which said second parts (202) are made.
  13. Wafer sheet (100) for making a plurality of wafer bodies (400) through the method according to any one of the preceding claims, said wafer sheet being intended to be used as said first wafer sheet (100) in said method, wherein said wafer sheet (100) comprises: - a plurality of first parts (102) intended to couple with second parts (202) of a further wafer sheet used as said second wafer sheet (200) in said method; and - a plurality of first coupling formations (105) configured to couple, in said coupling phase of said method, with second coupling formations (205) of said further wafer sheet, and to arrange, by effect of their coupling with said second formations (205), said wafer sheet and said further wafer sheet in said predefined mutual positioning.
  14. Wafer sheet according to claim 13, comprising a first side that is intended to face said further wafer sheet (200) in said coupling phase of said method, and a second side opposite to said first side, wherein said first coupling formations are formed by protrusions (105) that protrude from said first side of said wafer sheet (100), in a direction opposite to that in which said first parts (102) protrude from said second side.
  15. Wafer sheet according to claim 13 or 14, wherein said first coupling formations (105) are placed along a peripheral area (100C) of said wafer sheet (100) that surrounds an internal area of said wafer sheet in which said first parts (102) are made.
  16. Wafer sheet (200) for making a plurality of wafer bodies through the method according to any one of the preceding claims, said wafer sheet being intended to be used as said second wafer sheet (200) in said method, wherein said wafer sheet (200) comprises: - a plurality of second parts (202) intended to couple with first parts (102) of a further wafer sheet used as said first wafer sheet (100) in said method; and - a plurality of second coupling formations (205) configured to couple, in said coupling phase of said method, with first coupling formations (105) of said further wafer sheet, and to arrange, by effect of their coupling with said first formations (105), said wafer sheet and said further wafer sheet in said predefined mutual positioning.
  17. Wafer sheet according to claim 16, comprising a first side intended to face said further wafer sheet (100) in said coupling phase of said method, and a second side opposite to said first side, wherein said second coupling formations (205) are formed by cavities (205) that are located on said first side and are configured to receive the first coupling formations (105) in the form of protrusions of said further wafer sheet (100), in said coupling phase of said method.
  18. Wafer sheet according to claims 16 or 17, wherein said second coupling formations (205) are placed along a peripheral area (200C) of said wafer sheet (200) that surrounds an internal area of said wafer sheet (200) in which said second parts (202) are made.
  19. Mold device (10) for making a wafer sheet (100, 200) according to any one of claims 13 to 18, said mold device (10) comprising two half-plates (10A, 10B) connected to each other and movable relative to each other between an open position and a closed position in which the two half-plates together define a mold cavity (12) for receiving a wafer batter and for subjecting said received wafer batter to a baking phase, wherein said mold cavity (12) has a conformation such that the wafer batter that fills said mold cavity and is subjected to said baking phase, forms said wafer sheet (100, 200).

Description

Field of the invention The present invention relates to a method for making a plurality of wafer bodies, in particular of the type comprising a first part and a second part mutually coupled to each other, and an internal space delimited by the first part and the second part. More particularly, the present invention relates to a method comprising the steps of: making a first wafer sheet comprising a plurality of first parts, via a wafer batter that is baked inside a first mold device;making a second wafer sheet comprising a plurality of second parts, via a wafer batter that is baked inside a second mold device;coupling together the first wafer sheet and the second wafer sheet so that each of said first parts of said first wafer sheet is coupled with a respective second part of said second parts of the second wafer sheet;separating said first parts and said second parts mutually coupled from said first and second wafer sheets, so as to obtain the plurality of wafer bodies. A method of the type in question involves mutually coupling the first parts and the second parts that together will form the wafer bodies when these parts have not yet been separated from their respective sheets on which they were made. This facilitates handling and manipulation operations, since the wafer sheet holds these parts together, allowing to avoid the complexities arising from managing a plurality of independent parts. On the other hand, the choice to couple the wafer sheets together, and not just the individual parts made on them, makes the coupling phase particularly critical, as any misalignment between the two wafer sheets affects the mutual coupling of all their respective parts. For this reason, solutions have so far been predominantly widespread in which said first and second parts are first separated from their respective wafer sheets, and only subsequently are coupled together; in this case, any positioning errors of some first and second parts do not affect all the others. In this context, the present invention provides a method of the type indicated at the beginning that is capable of overcoming the drawback discussed above. In general, the present invention relates to a method according to claim 1. The claims form an integral part of the teaching provided herein. Further characteristics and advantages of the present invention will be apparent from the following description with reference to the appended drawings, provided by way of non-limiting example only, in which: figure 1 schematically represents an embodiment of the method described herein;figures 2a and 2b schematically illustrate two successive instants of a coupling phase of an embodiment of the method described herein;figure 3 represents a top view of an example of a wafer sheet used in the method described herein. In the following description, various specific details are illustrated for a thorough understanding of the embodiments. The embodiments can be implemented without one or more of the specific details, or with other methods, components or materials etc. In other instances, known structures or operations are not shown or described in detail to avoid obscuring various aspects of the embodiment. The references used herein are for convenience only and thus do not define the scope of protection or the scope of the embodiments. As anticipated above, the method described herein is intended for the production of a plurality of wafer bodies, each comprising a first part and a second part mutually coupled to each other, and an internal space delimited by the first part and the second part. The wafer bodies in question can be used for the production of sweet or savory products. For example, such wafer bodies can be used for the production of filled confectionery products in which a filling (e.g., a cream) is contained in the internal space of the wafer bodies. With reference now to figure 1, phase A of the method illustrated therein represents the making of a first wafer sheet 100, comprising a plurality of first parts 102, and the making of a second wafer sheet 200, comprising a plurality of second parts 202. The two wafer sheets 100, 200 are made using a common wafer batter (commonly referred to as "batter") and through production methods that are per se conventional. In one or more preferred embodiments, as the one illustrated, the wafer batter is dosed inside a mold cavity 12 of a mold device 10, where it is subjected to a baking process; at the end of the baking process, the wafer sheet 100 or 200 is obtained. The mold device 10 can be of any known type suitable for the indicated purposes; in one or more preferred embodiments, as the one illustrated, the mold device 10 can be a baking plate comprising two half-plates 10A, 10B, connected to each other and movable relative to each other between an open position and a closed position in which the two half-plates together define the mold cavity 12. For reasons that will become apparent later, the two wafer she